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Class Information
Number: 257/E23.192
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by material of container or its electrical properties (epo) > Material being electrical insulator, e.g., glass (epo)
Description: This subclass is indented under subclass E23.191. This subclass is substantially the same in scope as ECLA classification H01L23/08.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8546934 Method for manufacturing semiconductor devices having a glass substrate Oct. 1, 2013
8120184 Semiconductor constructions and methods of forming layers Feb. 21, 2012
8097938 Conductive chip-scale package Jan. 17, 2012
8053803 Package for optical semiconductor element Nov. 8, 2011
8049311 Electronic component and method for its production Nov. 1, 2011
7964945 Glass cap molding package, manufacturing method thereof and camera module Jun. 21, 2011
7843033 Shielded integrated circuit pad structure Nov. 30, 2010
7812433 Package structure and electronic device using the same Oct. 12, 2010
7737559 Semiconductor constructions Jun. 15, 2010
7638865 Sensor package Dec. 29, 2009
7633150 Semiconductor device and method for manufacturing semiconductor device Dec. 15, 2009
7598125 Method for wafer level packaging and fabricating cap structures Oct. 6, 2009
7423333 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device Sep. 9, 2008
7372159 Semiconductor device May. 13, 2008
7301224 Surface acoustic wave device and manufacturing method of the same Nov. 27, 2007
7294909 Electronic package repair process Nov. 13, 2007
7190051 Chip level hermetic and biocompatible electronics package using SOI wafers Mar. 13, 2007
7002803 Electronic product with heat radiating plate Feb. 21, 2006
6930398 Package structure for optical image sensing integrated circuits Aug. 16, 2005
6873049 Near hermetic power chip on board device and manufacturing method therefor Mar. 29, 2005
6818479 Highly moisture-sensitive electronic device element and method for fabrication Nov. 16, 2004
6569532 Epoxy resin compositions and premolded semiconductor packages May. 27, 2003
6524887 Embedded recess in polymer memory package and method of making same Feb. 25, 2003
6525416 Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them Feb. 25, 2003
6399677 Epoxy resin compositions and premolded semiconductor packages Jun. 4, 2002
6207595 Laminate and method of manufacture thereof Mar. 27, 2001
6127629 Hermetically sealed microelectronic device and method of forming same Oct. 3, 2000
6111199 Integrated circuit package using a gas to insulate electrical conductors Aug. 29, 2000
6111316 Electronic component encapsulated in a glass tube Aug. 29, 2000
5827999 Homogeneous chip carrier package Oct. 27, 1998
5801068 Hermetically sealed microelectronic device and method of forming same Sep. 1, 1998
5650593 Thermally enhanced chip carrier package Jul. 22, 1997
5623167 Semiconductor device Apr. 22, 1997
5561265 Integrated circuit packaging Oct. 1, 1996
5550403 Improved laminate package for an integrated circuit and integrated circuit having such a package Aug. 27, 1996
5532513 Metal-ceramic composite lid Jul. 2, 1996
5483740 Method of making homogeneous thermoplastic semi-conductor chip carrier package Jan. 16, 1996
5471011 Homogeneous thermoplastic semi-conductor chip carrier package Nov. 28, 1995
5412247 Protection and packaging system for semiconductor devices May. 2, 1995
5326932 Semiconductor package Jul. 5, 1994
5285012 Low noise integrated circuit package Feb. 8, 1994
5213878 Ceramic composite for electronic applications May. 25, 1993
5140109 Container package for semiconductor element Aug. 18, 1992
5108958 Ceramic composite for electronic applications Apr. 28, 1992
5107328 Packaging means for a semiconductor die having particular shelf structure Apr. 21, 1992
5061987 Silicon substrate multichip assembly Oct. 29, 1991
5043535 Hermetic cerglass and cermet electronic packages Aug. 27, 1991
4958216 Package for housing semiconductor elements Sep. 18, 1990
4926238 Semiconductor device and method for producing the same May. 15, 1990
4907065 Integrated circuit chip sealing assembly Mar. 6, 1990

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