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Class Information
Number: 257/E23.191
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by material of container or its electrical properties (epo)
Description: This subclass is indented under subclass E23.18. This subclass is substantially the same in scope as ECLA classification H01L23/06.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.192 Material being electrical insulator, e.g., glass (epo) 84


Patents under this class:
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Patent Number Title Of Patent Date Issued
8629563 Method for packaging semiconductor dies having through-silicon vias Jan. 14, 2014
8434158 Systems and methods for detecting and thwarting unauthorized access and hostile attacks on secured systems Apr. 30, 2013
8314488 Sample liquid supply container, sample liquid supply container set, and microchip set Nov. 20, 2012
8283792 Methods and systems for forming an alignment mark with optically mismatched alignment mark stack materials Oct. 9, 2012
8138601 Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package Mar. 20, 2012
8102034 Semiconductor device and manufacturing method of the same Jan. 24, 2012
7982309 Integrated circuit including gas phase deposited packaging material Jul. 19, 2011
7956467 Semiconductor device and method of manufacturing the same Jun. 7, 2011
7911042 Package having shield case Mar. 22, 2011
7842552 Semiconductor chip packages having reduced stress Nov. 30, 2010
7719092 Power semiconductor module May. 18, 2010
7696622 MEMS device formed inside hermetic chamber having getter film Apr. 13, 2010
7692292 Packaged electronic element and method of producing electronic element package Apr. 6, 2010
7692207 Packaging designs for LEDs Apr. 6, 2010
7692317 Apparatus for housing a micromechanical structure Apr. 6, 2010
7675171 Semiconductor package and fabricating method thereof Mar. 9, 2010
7300823 Apparatus for housing a micromechanical structure and method for producing the same Nov. 27, 2007
7112877 High density package with wrap around interconnect Sep. 26, 2006
6977187 Chip package sealing method Dec. 20, 2005
6974635 Package for electronic component, lid material for package lid, and production method for lid material Dec. 13, 2005
6952046 Electronic and optoelectronic component packaging technique Oct. 4, 2005
6866893 Conductive cap, electronic component, and method of forming insulating film of conductive cap Mar. 15, 2005
6815084 Discontinuous high-modulus fiber metal matrix composite for thermal management applications Nov. 9, 2004
6800189 Method of forming insulating film of conductive cap by anodizing or electrodeposition Oct. 5, 2004
6759269 Method for fabricating Al-Si alloy packaging material Jul. 6, 2004
6611054 IC package lid for dose enhancement protection Aug. 26, 2003
6596139 Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications Jul. 22, 2003
6566748 Flip-chip semiconductor device having an improved reliability May. 20, 2003
6493231 Electrical apparatus Dec. 10, 2002
6489558 Conductive cap, electronic component, and method of forming insulating film of conductive cap Dec. 3, 2002
6452263 Radiation shield and radiation shielded integrated circuit device Sep. 17, 2002
6312535 Silicon alloys for electronic packaging Nov. 6, 2001
6295205 Explosion protection for semiconductor modules Sep. 25, 2001
6194789 Flexible hermetic sealing Feb. 27, 2001
6159772 Packaging electrical circuits Dec. 12, 2000
6119923 Packaging electrical circuits Sep. 19, 2000
6111316 Electronic component encapsulated in a glass tube Aug. 29, 2000
6096981 Packaging electrical circuits Aug. 1, 2000
6054766 Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation Apr. 25, 2000
5998733 Graphite aluminum metal matrix composite microelectronic package Dec. 7, 1999
5906310 Packaging electrical circuits May. 25, 1999
5889220 Copper-tungsten alloys and their manufacturing methods Mar. 30, 1999
5825085 Power semiconductor device, armoring case thereof and method for manufacturing the same Oct. 20, 1998
5808358 Packaging electrical circuits Sep. 15, 1998
5789810 Semiconductor cap Aug. 4, 1998
5775403 Incorporating partially sintered preforms in metal matrix composites Jul. 7, 1998
5773879 Cu/Mo/Cu clad mounting for high frequency devices Jun. 30, 1998
5700724 Hermetically sealed package for a high power hybrid circuit Dec. 23, 1997
5650592 Graphite composites for electronic packaging Jul. 22, 1997
5574959 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient Nov. 12, 1996

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