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Class Information
Number: 257/E23.19
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo) > Leads having passage through base (epo)
Description: This subclass is indented under subclass E23.188. This subclass is substantially the same in scope as ECLA classification H01L23/055.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8546895 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Oct. 1, 2013
8410595 Semiconductor device with chip mounted on a substrate Apr. 2, 2013
8367469 Chip-scale semiconductor die packaging method Feb. 5, 2013
8106408 Optical semiconductor device with flexible substrate Jan. 31, 2012
8093714 Chip assembly with chip-scale packaging Jan. 10, 2012
8043881 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Oct. 25, 2011
7998774 Package, in particular for MEMS devices and method of making same Aug. 16, 2011
7989264 Warpage resistant semiconductor package and method for manufacturing the same Aug. 2, 2011
7898043 Package, in particular for MEMS devices and method of making same Mar. 1, 2011
7880283 High reliability power module Feb. 1, 2011
7875942 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Jan. 25, 2011
7719096 Semiconductor device and method for manufacturing a semiconductor device May. 18, 2010
7649250 Semiconductor package Jan. 19, 2010
7615835 Package for semiconductor acceleration sensor Nov. 10, 2009
7528467 IC substrate with over voltage protection function May. 5, 2009
7436056 Electronic component package Oct. 14, 2008
7348663 Integrated circuit package and method for fabricating same Mar. 25, 2008
7262498 Assembly with a ring and bonding pads formed of a same material on a substrate Aug. 28, 2007
7262491 Die pad for semiconductor packages and methods of making and using same Aug. 28, 2007
7239024 Semiconductor package with recess for die Jul. 3, 2007
7154173 Semiconductor device and manufacturing method of the same Dec. 26, 2006
7066659 Small form factor transceiver with externally modulated laser Jun. 27, 2006
7061102 High performance flipchip package that incorporates heat removal with minimal thermal mismatch Jun. 13, 2006
7029952 Method for making a semiconductor package and semiconductor package with integrated circuit chips Apr. 18, 2006
6996304 Small form factor transceiver with externally modulated laser Feb. 7, 2006
6989296 Fabrication method of semiconductor package with photosensitive chip Jan. 24, 2006
6987032 Ball grid array package and process for manufacturing same Jan. 17, 2006
6983537 Method of making a plastic package with an air cavity Jan. 10, 2006
6982486 Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same Jan. 3, 2006
6980438 Semiconductor package with heat dissipating structure Dec. 27, 2005
6967400 IC chip package Nov. 22, 2005
6953892 Connection housing for an electronic component Oct. 11, 2005
6933523 Semiconductor alignment aid Aug. 23, 2005
6933176 Ball grid array package and process for manufacturing same Aug. 23, 2005
6929974 Feedthrough design and method for a hermetically sealed microdevice Aug. 16, 2005
6924429 Electronic device and production method therefor Aug. 2, 2005
6911599 Header assembly for optoelectronic devices Jun. 28, 2005
6909176 Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Jun. 21, 2005
6891266 RF transition for an area array package May. 10, 2005
6886246 Method for making an article having an embedded electronic device May. 3, 2005
6878875 Small form factor optical transceiver with extended transmission range Apr. 12, 2005
6867368 Multi-layer ceramic feedthrough structure in a transmitter optical subassembly Mar. 15, 2005
6858795 Radiation shielding of three dimensional multi-chip modules Feb. 22, 2005
6852928 Cooled externally modulated laser for transmitter optical subassembly Feb. 8, 2005
6852927 Thin metal package and manufacturing method thereof Feb. 8, 2005
6840777 Solderless electronics packaging Jan. 11, 2005
6841733 Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly Jan. 11, 2005
6838765 Semiconductor device and manufacturing method thereof Jan. 4, 2005

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