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Class Information
Number: 257/E23.189
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo) > Leads being parallel to base (epo)
Description: This subclass is indented under subclass E23.188. This subclass is substantially the same in scope as ECLA classification H01L23/057.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8330236 Isolation channel improving measurement accuracy of MEMS devices Dec. 11, 2012
7880283 High reliability power module Feb. 1, 2011
7759774 Shielded structures to protect semiconductor devices Jul. 20, 2010
7649250 Semiconductor package Jan. 19, 2010
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7528482 Embedded chip package with improved heat dissipation performance and method of making the same May. 5, 2009
7528467 IC substrate with over voltage protection function May. 5, 2009
7498669 Semiconductor device Mar. 3, 2009
7436056 Electronic component package Oct. 14, 2008
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7256431 Insulating substrate and semiconductor device having a thermally sprayed circuit pattern Aug. 14, 2007
7061064 Semiconductor device and package for containing semiconductor element Jun. 13, 2006
7020958 Methods forming an integrated circuit package with a split cavity wall Apr. 4, 2006
7023078 Packages for communication devices Apr. 4, 2006
6991470 Circuit carrier and production thereof Jan. 31, 2006
6989293 Thermally enhanced packaging structure and fabrication method thereof Jan. 24, 2006
6982479 Semiconductor package with leadframe inductors Jan. 3, 2006
6927477 Coplanar line, and a module using the coplanar line Aug. 9, 2005
6924429 Electronic device and production method therefor Aug. 2, 2005
6921971 Heat releasing member, package for accommodating semiconductor element and semiconductor device Jul. 26, 2005
6906406 Multiple dice package Jun. 14, 2005
6900525 Semiconductor package having filler metal of gold/silver/copper alloy May. 31, 2005
6900986 Power module May. 31, 2005
6873049 Near hermetic power chip on board device and manufacturing method therefor Mar. 29, 2005
6865804 Method for integrated EMI shielding Mar. 15, 2005
6864564 Flash-preventing semiconductor package Mar. 8, 2005
6858795 Radiation shielding of three dimensional multi-chip modules Feb. 22, 2005
6847115 Packaged semiconductor device for radio frequency shielding Jan. 25, 2005
6828511 Prefabricated semiconductor chip carrier Dec. 7, 2004
6804103 Electronic component and method for manufacturing the same Oct. 12, 2004
6798053 IC chip package Sep. 28, 2004
6797882 Die package for connection to a substrate Sep. 28, 2004
6783393 Package for opto-electrical components Aug. 31, 2004
6762937 Power module Jul. 13, 2004
6747339 Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate Jun. 8, 2004
6747346 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device Jun. 8, 2004
6740967 Image sensor having an improved package structure May. 25, 2004
6720493 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages Apr. 13, 2004
6709891 Open-cavity semiconductor die package Mar. 23, 2004
6702624 Electronic component in which an insert member is tightly held by a resin portion and prevented from deformation thereof Mar. 9, 2004
6703702 IC chip mounting structure and display device Mar. 9, 2004
6696752 Encapsulated semiconductor device with flash-proof structure Feb. 24, 2004
6691398 Electronic packaging device and method Feb. 17, 2004
6661089 Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same Dec. 9, 2003
6649834 Injection molded image sensor and a method for manufacturing the same Nov. 18, 2003
6635953 IC chip package Oct. 21, 2003
6617194 Electronic component, communication device, and manufacturing method for electronic component Sep. 9, 2003
6617677 Electric or electronic component and method of manufacturing such a component Sep. 9, 2003
6613978 Radiation shielding of three dimensional multi-chip modules Sep. 2, 2003
6583432 Methods and compositions for ionizing radiation shielding Jun. 24, 2003

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