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Class Information
Number: 257/E23.188
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo)
Description: This subclass is indented under subclass E23.181. This subclass is substantially the same in scope as ECLA classification H01L23/053.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7498669 |
Semiconductor device |
Mar. 3, 2009 |
| 7423333 |
Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device |
Sep. 9, 2008 |
| 7408250 |
Micromirror array device with compliant adhesive |
Aug. 5, 2008 |
| 7342263 |
Circuit device |
Mar. 11, 2008 |
| 7301224 |
Surface acoustic wave device and manufacturing method of the same |
Nov. 27, 2007 |
| 7274095 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
Sep. 25, 2007 |
| 7166911 |
Packaged microchip with premolded-type package |
Jan. 23, 2007 |
| 7002236 |
Semiconductor package and method for producing the same |
Feb. 21, 2006 |
| 6951980 |
Package for an electrical device |
Oct. 4, 2005 |
| 6858474 |
Wire bond package and packaging method |
Feb. 22, 2005 |
| 6844221 |
Method of manufacturing a wire bond-less electronic component for use with an external circuit |
Jan. 18, 2005 |
| 6809413 |
Microelectronic device package with an integral window mounted in a recessed lip |
Oct. 26, 2004 |
| 6798063 |
Low profile ball grid array package |
Sep. 28, 2004 |
| 6760227 |
Multilayer ceramic electronic component and manufacturing method thereof |
Jul. 6, 2004 |
| 6751101 |
Electronic component and method of producing the same |
Jun. 15, 2004 |
| 6724079 |
Wire bond-less electronic component for use with an external circuit and method of manufacture |
Apr. 20, 2004 |
| 6683370 |
Semiconductor component and method of manufacturing same |
Jan. 27, 2004 |
| 6674159 |
Bi-level microelectronic device package with an integral window |
Jan. 6, 2004 |
| 6661084 |
Single level microelectronic device package with an integral window |
Dec. 9, 2003 |
| 6635953 |
IC chip package |
Oct. 21, 2003 |
| 6614110 |
Module with bumps for connection and support |
Sep. 2, 2003 |
| 6572004 |
Hermetically sealed component assembly package |
Jun. 3, 2003 |
| 6538312 |
Multilayered microelectronic device package with an integral window |
Mar. 25, 2003 |
| 6495895 |
Bi-level multilayered microelectronic device package with an integral window |
Dec. 17, 2002 |
| 6489670 |
Sealed symmetric multilayered microelectronic device package with integral windows |
Dec. 3, 2002 |
| 6384473 |
Microelectronic device package with an integral window |
May. 7, 2002 |
| 6369411 |
Semiconductor device for controlling high-power electricity with improved heat dissipation |
Apr. 9, 2002 |
| 6350954 |
Electronic device package, and method |
Feb. 26, 2002 |
| 6323547 |
Pressure contact type semiconductor device with ringshaped gate terminal |
Nov. 27, 2001 |
| 6297550 |
Bondable anodized aluminum heatspreader for semiconductor packages |
Oct. 2, 2001 |
| 6165820 |
Package for electronic devices |
Dec. 26, 2000 |
| 6078102 |
Semiconductor die package for mounting in horizontal and upright configurations |
Jun. 20, 2000 |
| 5904499 |
Package for power semiconductor chips |
May. 18, 1999 |
| 5866441 |
Inverted chip bonded module with high packaging efficiency |
Feb. 2, 1999 |
| 5818106 |
Semiconductor device having a capacitor formed on a surface of a closure |
Oct. 6, 1998 |
| 5796165 |
High-frequency integrated circuit device having a multilayer structure |
Aug. 18, 1998 |
| 5793105 |
Inverted chip bonded with high packaging efficiency |
Aug. 11, 1998 |
| 5775403 |
Incorporating partially sintered preforms in metal matrix composites |
Jul. 7, 1998 |
| 5668033 |
Method for manufacturing a semiconductor acceleration sensor device |
Sep. 16, 1997 |
| 5627406 |
Inverted chip bonded module with high packaging efficiency |
May. 6, 1997 |
| 5570274 |
High density multichip module packaging structure |
Oct. 29, 1996 |
| 5465481 |
Method for fabricating a semiconductor package |
Nov. 14, 1995 |
| 5463250 |
Semiconductor component package |
Oct. 31, 1995 |
| 5362926 |
Circuit substrate for mounting a semiconductor element |
Nov. 8, 1994 |
| 5326932 |
Semiconductor package |
Jul. 5, 1994 |
| 5313091 |
Package for a high power electrical component |
May. 17, 1994 |
| 5306948 |
Semiconductor device and semiconductor module having auxiliary high power supplying terminals |
Apr. 26, 1994 |
| 5297001 |
High power semiconductor assembly |
Mar. 22, 1994 |
| 5264726 |
Chip-carrier |
Nov. 23, 1993 |
| 5209390 |
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
May. 11, 1993 |
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