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Class Information
Number: 257/E23.188
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo)
Description: This subclass is indented under subclass E23.181. This subclass is substantially the same in scope as ECLA classification H01L23/053.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.189 Leads being parallel to base (epo) 457
257/E23.19 Leads having passage through base (epo) 206

Patents under this class:
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Patent Number Title Of Patent Date Issued
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8587107 Silicon carbide semiconductor Nov. 19, 2013
8519531 Electrical and/or electronic device with elastic contact element Aug. 27, 2013
8441117 Semiconductor device May. 14, 2013
8436464 Hollow sealing structure and manufacturing method for hollow sealing structure May. 7, 2013
7960829 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Jun. 14, 2011
7936056 Airtight package comprising a pressure adjustment unit May. 3, 2011
7768124 Semiconductor sensor having a flat mounting plate with banks Aug. 3, 2010
7652385 Semiconductor device and method of manufacturing the same Jan. 26, 2010
7635916 Integrated circuit package with top-side conduction cooling Dec. 22, 2009
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7633150 Semiconductor device and method for manufacturing semiconductor device Dec. 15, 2009
7498669 Semiconductor device Mar. 3, 2009
7423333 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device Sep. 9, 2008
7408250 Micromirror array device with compliant adhesive Aug. 5, 2008
7342263 Circuit device Mar. 11, 2008
7301224 Surface acoustic wave device and manufacturing method of the same Nov. 27, 2007
7274095 Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Sep. 25, 2007
7166911 Packaged microchip with premolded-type package Jan. 23, 2007
7002236 Semiconductor package and method for producing the same Feb. 21, 2006
6951980 Package for an electrical device Oct. 4, 2005
6858474 Wire bond package and packaging method Feb. 22, 2005
6844221 Method of manufacturing a wire bond-less electronic component for use with an external circuit Jan. 18, 2005
6809413 Microelectronic device package with an integral window mounted in a recessed lip Oct. 26, 2004
6798063 Low profile ball grid array package Sep. 28, 2004
6760227 Multilayer ceramic electronic component and manufacturing method thereof Jul. 6, 2004
6751101 Electronic component and method of producing the same Jun. 15, 2004
6724079 Wire bond-less electronic component for use with an external circuit and method of manufacture Apr. 20, 2004
6683370 Semiconductor component and method of manufacturing same Jan. 27, 2004
6674159 Bi-level microelectronic device package with an integral window Jan. 6, 2004
6661084 Single level microelectronic device package with an integral window Dec. 9, 2003
6635953 IC chip package Oct. 21, 2003
6614110 Module with bumps for connection and support Sep. 2, 2003
6572004 Hermetically sealed component assembly package Jun. 3, 2003
6538312 Multilayered microelectronic device package with an integral window Mar. 25, 2003
6495895 Bi-level multilayered microelectronic device package with an integral window Dec. 17, 2002
6489670 Sealed symmetric multilayered microelectronic device package with integral windows Dec. 3, 2002
6384473 Microelectronic device package with an integral window May. 7, 2002
6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation Apr. 9, 2002
6350954 Electronic device package, and method Feb. 26, 2002
6323547 Pressure contact type semiconductor device with ringshaped gate terminal Nov. 27, 2001
6297550 Bondable anodized aluminum heatspreader for semiconductor packages Oct. 2, 2001
6165820 Package for electronic devices Dec. 26, 2000
6078102 Semiconductor die package for mounting in horizontal and upright configurations Jun. 20, 2000
5904499 Package for power semiconductor chips May. 18, 1999
5866441 Inverted chip bonded module with high packaging efficiency Feb. 2, 1999
5818106 Semiconductor device having a capacitor formed on a surface of a closure Oct. 6, 1998
5796165 High-frequency integrated circuit device having a multilayer structure Aug. 18, 1998
5793105 Inverted chip bonded with high packaging efficiency Aug. 11, 1998
5775403 Incorporating partially sintered preforms in metal matrix composites Jul. 7, 1998

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