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Browse by Category: Main > Physics
Class Information
Number: 257/E23.187
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) > Another lead being formed by cover plate parallel to base plate, e.g., sandwich type (epo)
Description: This subclass is indented under subclass E23.183. This subclass is substantially the same in scope as ECLA classification H01L23/051.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7968907 Low capacitance over-voltage protection thyristor device Jun. 28, 2011
7785924 Method for making semiconductor chips having coated portions Aug. 31, 2010
7786565 Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor Aug. 31, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7683479 Semiconductor package involving a rotary lock that connects a package substrate and a separate component Mar. 23, 2010
7582919 Functional coating of the SCFM preform Sep. 1, 2009
7560814 Semiconductor device that improves electrical connection reliability Jul. 14, 2009
7230338 Semiconductor device that improves electrical connection reliability Jun. 12, 2007
7061090 Semiconductor device Jun. 13, 2006
7060533 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators Jun. 13, 2006
7057298 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material Jun. 6, 2006
7042084 Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core May. 9, 2006
7006270 Optical scanning device, image forming apparatus, and optical scanning method Feb. 28, 2006
6998707 Semiconductor device having radiation structure Feb. 14, 2006
6995464 Pressure-contact type semiconductor device Feb. 7, 2006
6992383 Semiconductor device having radiation structure Jan. 31, 2006
6967404 Semiconductor device having radiation structure Nov. 22, 2005
6960825 Semiconductor device having radiation structure Nov. 1, 2005
6930401 Electronic device and method of manufacture the same Aug. 16, 2005
6891265 Semiconductor device having radiation structure May. 10, 2005
6881071 Power semiconductor module with pressure contact means Apr. 19, 2005
6878573 Method of manufacturing a semiconductor device and semiconductor device Apr. 12, 2005
6873045 Semiconductor module and power conversion device Mar. 29, 2005
6861730 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material Mar. 1, 2005
6856012 Contact system Feb. 15, 2005
6831351 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material Dec. 14, 2004
6798062 Semiconductor device having radiation structure Sep. 28, 2004
6794762 Electronic component and fabrication method thereof Sep. 21, 2004
6781227 Compression assembled electronic package having a plastic molded insulation ring Aug. 24, 2004
6759735 High power semiconductor device having semiconductor chips Jul. 6, 2004
6703707 Semiconductor device having radiation structure Mar. 9, 2004
6670687 Semiconductor device having silicon carbide layer of predetermined conductivity type and module device having the same Dec. 30, 2003
6657542 Electronic device and method of manufacture the same Dec. 2, 2003
6642078 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators Nov. 4, 2003
6614105 Chip-type semiconductor device Sep. 2, 2003
6605870 Pressure-contact type semiconductor device Aug. 12, 2003
6580403 Housing for an electronic component Jun. 17, 2003
6565983 Electrical contact element and use of the contact element May. 20, 2003
6548890 Press-contact type semiconductor device Apr. 15, 2003
6521919 Semiconductor device of reduced thermal resistance and increased operating area Feb. 18, 2003
6476480 Press-fit IC power package and method therefor Nov. 5, 2002
6465881 Compression bonded type semiconductor device Oct. 15, 2002
6465276 Power semiconductor package and method for making the same Oct. 15, 2002
6445013 Gate commutated turn-off semiconductor device Sep. 3, 2002
6426561 Short-circuit-resistant IGBT module Jul. 30, 2002
6423988 Pressure-contact semiconductor device Jul. 23, 2002
6423573 Integrated electronic circuit comprising at least an electronic power component Jul. 23, 2002
6396091 Chip scale package May. 28, 2002
6384474 Housing for receiving a planar power transistor May. 7, 2002
6377461 Power electronic module packaging Apr. 23, 2002

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