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Class Information
Number: 257/E23.186
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) > Other leads being perpendicular to base (epo)
Description: This subclass is indented under subclass E23.183. This subclass is substantially the same in scope as ECLA classification H01L23/049.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7859103 Semiconductor module and inverter device Dec. 28, 2010
7709866 Method for forming semiconductor contacts May. 4, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7449726 Power semiconductor apparatus Nov. 11, 2008
7030476 Rectifier diode device Apr. 18, 2006
7005739 High power semiconductor module Feb. 28, 2006
6774465 Semiconductor power package module Aug. 10, 2004
6577032 Rectifier unit of vehicle AC generator Jun. 10, 2003
6559529 Press-fit diode for universal mounting May. 6, 2003
6455929 Embedded type package of power semiconductor device Sep. 24, 2002
6434008 Semiconductor device Aug. 13, 2002
6396125 Semiconductor device May. 28, 2002
6331730 Push-in type semiconductor device including heat spreader Dec. 18, 2001
6310791 Power rectifier Oct. 30, 2001
6084298 Manufacturing of semiconductor device Jul. 4, 2000
6060776 Rectifier diode May. 9, 2000
5956231 Semiconductor device having power semiconductor elements Sep. 21, 1999
5847935 Electronic circuit chip package Dec. 8, 1998
5585310 Methods of mass production of semiconductor devices Dec. 17, 1996
5577656 Method of packaging a semiconductor device Nov. 26, 1996
5521436 Semiconductor device with a foil-sealed lid May. 28, 1996
5473193 Package for parallel subelement semiconductor devices Dec. 5, 1995
5446316 Hermetic package for a high power semiconductor device Aug. 29, 1995
5248901 Semiconductor devices and methods of assembly thereof Sep. 28, 1993
5135890 Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip Aug. 4, 1992
5130784 Semiconductor device including a metallic conductor for preventing arcing upon failure Jul. 14, 1992
5103290 Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip Apr. 7, 1992
5018002 High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip May. 21, 1991
5005069 Rectifier and method Apr. 2, 1991
4893173 Low-inductance semiconductor apparatus Jan. 9, 1990
4833522 Semiconductor module May. 23, 1989
4803180 Method for manufacturing pressure contact semiconductor devices Feb. 7, 1989
4792844 Pressure contact semiconductor device Dec. 20, 1988
4760037 Pressure contact type semiconductor device Jul. 26, 1988
4646129 Hermetic power chip packages Feb. 24, 1987
4646131 Rectifier device Feb. 24, 1987
4624303 Heat sink mounting and method of making Nov. 25, 1986
4611389 Low-cost power device package with quick-connect terminals and electrically isolated mounting means Sep. 16, 1986
4586075 Semiconductor rectifier Apr. 29, 1986
4532539 Solid-state diode-rectifier and heat sink structure Jul. 30, 1985
4530003 Low-cost power device package with quick connect terminals and electrically isolated mounting means Jul. 16, 1985
4514587 High power semiconductor package Apr. 30, 1985
4477826 Arrangement for aligning and attaching a shim to a semiconductor element Oct. 16, 1984
4470063 Copper matrix electrode having carbon fibers therein Sep. 4, 1984
4349831 Semiconductor device having glass and metal package Sep. 14, 1982
4347543 Rectifier circuit diode array and circuit protector Aug. 31, 1982
4328512 Two-element semiconductor diode rectifier assembly structure May. 4, 1982
4314270 Hybrid thick film integrated circuit heat dissipating and grounding assembly Feb. 2, 1982
4314271 Two semiconductor diode rectifier structure Feb. 2, 1982
4305087 Stud-mounted pressure assembled semiconductor device Dec. 8, 1981

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