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Class Information
Number: 257/E23.185
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) > Other leads being parallel to base (epo)
Description: This subclass is indented under subclass E23.183. This subclass is substantially the same in scope as ECLA classification H01L23/047.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8283769 Modular low stress package technology Oct. 9, 2012
7947534 Integrated circuit packaging system including a non-leaded package May. 24, 2011
7880283 High reliability power module Feb. 1, 2011
7859110 Solder resist material, wiring board using the solder resist material, and semiconductor package Dec. 28, 2010
7772679 Magnetic shielding package structure of a magnetic memory device Aug. 10, 2010
7649250 Semiconductor package Jan. 19, 2010
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7262498 Assembly with a ring and bonding pads formed of a same material on a substrate Aug. 28, 2007
7075174 Semiconductor packaging techniques for use with non-ceramic packages Jul. 11, 2006
7053299 Flange for integrated circuit package May. 30, 2006
7030472 Integrated circuit device having flexible leadframe Apr. 18, 2006
7002803 Electronic product with heat radiating plate Feb. 21, 2006
6900526 Semiconductor device package May. 31, 2005
6867367 Package for integrated circuit die Mar. 15, 2005
6853055 Radiation shielding die carrier package Feb. 8, 2005
6730991 Integrated circuit chip package May. 4, 2004
6713865 Semiconductor device having semiconductor element housed in packed with heat sink Mar. 30, 2004
6703559 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough Mar. 9, 2004
6703700 Semiconductor packaging structure Mar. 9, 2004
6660562 Method and apparatus for a lead-frame air-cavity package Dec. 9, 2003
6597060 Semiconductor device package Jul. 22, 2003
6518659 Stackable package having a cavity and a lid for an electronic device Feb. 11, 2003
6483182 Integrated-circuit case Nov. 19, 2002
6476478 Cavity semiconductor package with exposed leads and die pad Nov. 5, 2002
6472251 Method for integrated circuit packaging Oct. 29, 2002
6462413 LDMOS transistor heatsink package assembly and manufacturing method Oct. 8, 2002
6372551 Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability Apr. 16, 2002
6058020 Component housing for surface mounting of a semiconductor component May. 2, 2000
5999415 BGA package using PCB and tape in a die-down configuration Dec. 7, 1999
5883424 Lead frame for hollow plastic package Mar. 16, 1999
5675122 Sealable electronics packages Oct. 7, 1997
5574959 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient Nov. 12, 1996
5559373 Hermetically sealed surface mount diode package Sep. 24, 1996
5433260 Sealable electronics packages and methods of producing and sealing such packages Jul. 18, 1995
5428188 Low-cost package for electronic components Jun. 27, 1995
5374786 Ceramic wall hybrid package with washer and solid metal through wall leads Dec. 20, 1994
5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die Nov. 22, 1994
5317107 Shielded stripline configuration semiconductor device and method for making the same May. 31, 1994
5315155 Electronic package with stress relief channel May. 24, 1994
5216279 Power semiconductor device suitable for automation of production Jun. 1, 1993
5200640 Hermetic package having covers and a base providing for direct electrical connection Apr. 6, 1993
5159750 Method of connecting an IC component with another electrical component Nov. 3, 1992
5107074 Multi-lead hermetic power package with high packing density Apr. 21, 1992
5014159 Semiconductor package May. 7, 1991
5008734 Stadium-stepped package for an integrated circuit with air dielectric Apr. 16, 1991
4972043 Multi-lead hermetic power package with high packing density Nov. 20, 1990
4881116 Package for integrated circuit Nov. 14, 1989
4866571 Semiconductor package Sep. 12, 1989
4845545 Low profile semiconductor package Jul. 4, 1989

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