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Class Information
Number: 257/E23.184
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) > Other leads having insulating passage through base (epo)
Description: This subclass is indented under subclass E23.183. This subclass is substantially the same in scope as ECLA classification H01L23/045.










Patents under this class:

Patent Number Title Of Patent Date Issued
8692366 Apparatus and method for microelectromechanical systems device packaging Apr. 8, 2014
8008761 Optical semiconductor apparatus Aug. 30, 2011
7659613 Semiconductor device Feb. 9, 2010
7576423 Semiconductor device Aug. 18, 2009
7449726 Power semiconductor apparatus Nov. 11, 2008
7411288 Semiconductor device Aug. 12, 2008
6995461 Semiconductor device Feb. 7, 2006
6977339 Surface mounting package Dec. 20, 2005
6781057 Electrical arrangement and method for producing an electrical arrangement Aug. 24, 2004
6433276 Surface mount feedthrough Aug. 13, 2002
6380613 Semiconductor device Apr. 30, 2002
6317333 Package construction of semiconductor device Nov. 13, 2001
6207892 System and method for sealing high density electronic circuits Mar. 27, 2001
5998733 Graphite aluminum metal matrix composite microelectronic package Dec. 7, 1999
5940279 Metal support element for electronic components or circuit supports Aug. 17, 1999
5847453 Microwave circuit package Dec. 8, 1998
5574959 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient Nov. 12, 1996
5188985 Surface mount device with high thermal conductivity Feb. 23, 1993
5111277 Surface mount device with high thermal conductivity May. 5, 1992
5025347 Semiconductor device Jun. 18, 1991
4885662 Circuit module connection system Dec. 5, 1989
4684763 Hermetically sealable package for electronic component Aug. 4, 1987
4631805 Semiconductor device including plateless package fabrication method Dec. 30, 1986
4622434 Semiconductor device package and method thereof Nov. 11, 1986
4571612 Corrosion-protected electrical circuit component Feb. 18, 1986
4546374 Semiconductor device including plateless package Oct. 8, 1985
4493143 Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered Jan. 15, 1985
4382327 Method for particle entrapment within an electrical device package May. 10, 1983
4352119 Electrical device and method for particle entrapment device for an electrical component Sep. 28, 1982
4338486 Housing for electrical and electronic components Jul. 6, 1982
4319265 Monolithically interconnected series-parallel avalanche diodes Mar. 9, 1982
4285003 Lower cost semiconductor package with good thermal properties Aug. 18, 1981
4151479 Low frequency power amplifier using MOS FET's Apr. 24, 1979
4141135 Semiconductor process using lapped substrate and lapped low resistivity semiconductor carrier Feb. 27, 1979
4128697 Hermetic glass-metal compression seal Dec. 5, 1978
4037749 Hermetically sealed envelope and method of making the same Jul. 26, 1977
4015071 Microelectronic circuit case Mar. 29, 1977
3988825 Method of hermetically sealing an electrical component in a metallic housing Nov. 2, 1976
3978579 Automatic assembly of semiconductor devices Sep. 7, 1976











 
 
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