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Class Information
Number: 257/E23.183
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo)
Description: This subclass is indented under subclass E23.181. This subclass is substantially the same in scope as ECLA classification H01L23/043.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.187 Another lead being formed by cover plate parallel to base plate, e.g., sandwich type (epo) 216
257/E23.185 Other leads being parallel to base (epo) 88
257/E23.186 Other leads being perpendicular to base (epo) 65
257/E23.184 Other leads having insulating passage through base (epo) 39


Patents under this class:

Patent Number Title Of Patent Date Issued
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8143717 Surface mount package with ceramic sidewalls Mar. 27, 2012
8089147 IMS formed as can for semiconductor housing Jan. 3, 2012
8080872 Surface mount package with high thermal conductivity Dec. 20, 2011
7993950 System and method of encapsulation Aug. 9, 2011
7936056 Airtight package comprising a pressure adjustment unit May. 3, 2011
7888797 High frequency package device with internal space having a resonant frequency offset from frequency used Feb. 15, 2011
7719023 Light emitting device May. 18, 2010
7659559 Semiconductor package having insulated metal substrate and method of fabricating the same Feb. 9, 2010
7652385 Semiconductor device and method of manufacturing the same Jan. 26, 2010
7598125 Method for wafer level packaging and fabricating cap structures Oct. 6, 2009
7449726 Power semiconductor apparatus Nov. 11, 2008
7423333 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device Sep. 9, 2008
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same Jun. 10, 2008
7368325 Semiconductor package May. 6, 2008
7230333 Semiconductor package Jun. 12, 2007
7132745 Method for attaching shields on substrates Nov. 7, 2006
6798063 Low profile ball grid array package Sep. 28, 2004
6518659 Stackable package having a cavity and a lid for an electronic device Feb. 11, 2003
5831827 Token shaped module for housing an electronic circuit Nov. 3, 1998
5760425 Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance Jun. 2, 1998
5639990 Solid printed substrate and electronic circuit package using the same Jun. 17, 1997
5188985 Surface mount device with high thermal conductivity Feb. 23, 1993
5111277 Surface mount device with high thermal conductivity May. 5, 1992
4864384 Pre-matched module for an ultra-high frequency diode and a process for forming the biasing connection for the diode Sep. 5, 1989
4566027 Pre-matched module for an ultra-high frequency diode with high heat dissipation Jan. 21, 1986
4499659 Semiconductor structures and manufacturing methods Feb. 19, 1985
4472760 Capacitor Sep. 18, 1984











 
 
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