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Class Information
Number: 257/E23.182
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo) > Container being hollow construction having no base used as mounting for semiconductor body (epo)
Description: This subclass is indented under subclass E23.181. This subclass is substantially the same in scope as ECLA classification H01L23/04B.










Patents under this class:

Patent Number Title Of Patent Date Issued
8610261 Power semiconductor device Dec. 17, 2013
8513043 Method for MEMS device fabrication and device formed Aug. 20, 2013
8334589 Power block and power semiconductor module using same Dec. 18, 2012
8294257 Power block and power semiconductor module using same Oct. 23, 2012
8164179 Chip scale package structure with can attachment Apr. 24, 2012
8124436 MEMS switch capping and passivation method Feb. 28, 2012
8004053 Micromechanical device and method of manufacturing micromechanical device Aug. 23, 2011
7936056 Airtight package comprising a pressure adjustment unit May. 3, 2011
7928560 Composite multi-layer substrate and module using the substrate Apr. 19, 2011
7812433 Package structure and electronic device using the same Oct. 12, 2010
7745926 Composite multi-layer substrate and module using the substrate Jun. 29, 2010
7705446 Package structure having semiconductor chip embedded therein and method for fabricating the same Apr. 27, 2010
7652385 Semiconductor device and method of manufacturing the same Jan. 26, 2010
7615861 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Nov. 10, 2009
7598610 Plate structure having chip embedded therein and the manufacturing method of the same Oct. 6, 2009
7579685 Wafer level packaging cap and fabrication method thereof Aug. 25, 2009
7541670 Semiconductor device having terminals Jun. 2, 2009
7294529 Method for embedding a component in a base Nov. 13, 2007
6870261 Discrete circuit component having an up-right circuit die with lateral electrical connections Mar. 22, 2005
6829147 Multilayered hybrid electronic module Dec. 7, 2004
6661082 Flip chip substrate design Dec. 9, 2003
6225686 Semiconductor device May. 1, 2001
6157076 Hermetic thin pack semiconductor device Dec. 5, 2000
5668702 Combination axial and surface mount cylindrical package containing one or more electronic components Sep. 16, 1997
5564182 Method for installing axial multiple Oct. 15, 1996
5389739 Electronic device packaging assembly Feb. 14, 1995
5232463 Apparatus for manufacturing a semiconductor device Aug. 3, 1993
5166098 Method of manufacturing an encapsulated semiconductor device with a can type housing Nov. 24, 1992
5106784 Method of making a post molded cavity package with internal dam bar for integrated circuit Apr. 21, 1992
5023702 Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method Jun. 11, 1991
4523371 Method of fabricating a resin mold type semiconductor device Jun. 18, 1985
4420652 Hermetically sealed package Dec. 13, 1983
4369330 Housing for electrical components, component groups or integrated circuit Jan. 18, 1983
4338486 Housing for electrical and electronic components Jul. 6, 1982
4233619 Light detector housing for fiber optic applications Nov. 11, 1980
4230901 Housing for semiconductor device Oct. 28, 1980
4187599 Semiconductor device having a tin metallization system and package containing same Feb. 12, 1980
4129243 Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof Dec. 12, 1978
4079511 Method for packaging hermetically sealed integrated circuit chips on lead frames Mar. 21, 1978
3950142 Lead assembly for semiconductive device Apr. 13, 1976











 
 
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