| |
 |
|
Class Information
Number: 257/E23.181
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo)
Description: This subclass is indented under subclass E23.180. This subclass is substantially the same in scope as ECLA classification H01L23/04.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8692366 |
Apparatus and method for microelectromechanical systems device packaging |
Apr. 8, 2014 |
| 8643169 |
Semiconductor sensor device with over-molded lid |
Feb. 4, 2014 |
| 8637978 |
System-in-a-package based flash memory card |
Jan. 28, 2014 |
| 8624383 |
Integrated circuit package and method for fabrication thereof |
Jan. 7, 2014 |
| 8587114 |
Multichip electronic packages and methods of manufacture |
Nov. 19, 2013 |
| 8575740 |
Semiconductor device |
Nov. 5, 2013 |
| 8558371 |
Method for wafer level package and semiconductor device fabricated using the same |
Oct. 15, 2013 |
| 8513043 |
Method for MEMS device fabrication and device formed |
Aug. 20, 2013 |
| 8497577 |
Micro electrical mechanical system |
Jul. 30, 2013 |
| 8395253 |
Hermetic surface mounted power package |
Mar. 12, 2013 |
| 8358003 |
Surface mount electronic device packaging assembly |
Jan. 22, 2013 |
| 8344489 |
Semiconductor device and manufacturing method thereof |
Jan. 1, 2013 |
| 8324728 |
Wafer level packaging using flip chip mounting |
Dec. 4, 2012 |
| 8314485 |
Electronic component |
Nov. 20, 2012 |
| 8309388 |
MEMS package having formed metal lid |
Nov. 13, 2012 |
| 8288791 |
Housing body and method for production thereof |
Oct. 16, 2012 |
| 8269320 |
Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof |
Sep. 18, 2012 |
| 8247889 |
Package having an inner shield and method for making the same |
Aug. 21, 2012 |
| 8247897 |
Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same |
Aug. 21, 2012 |
| 8207022 |
Exposed die overmolded flip chip package method |
Jun. 26, 2012 |
| 8164180 |
Functional element package and fabrication method therefor |
Apr. 24, 2012 |
| 8154113 |
Interconnect and test assembly including an interconnect |
Apr. 10, 2012 |
| 8148811 |
Semiconductor device and manufacturing method thereof |
Apr. 3, 2012 |
| 8143729 |
Autoclave capable chip-scale package |
Mar. 27, 2012 |
| 8076771 |
Semiconductor device having metal cap divided by slit |
Dec. 13, 2011 |
| 8049311 |
Electronic component and method for its production |
Nov. 1, 2011 |
| 8044429 |
Light-emitting device and method for manufacturing the same |
Oct. 25, 2011 |
| 8035209 |
Micromechanical device which has cavities having different internal atmospheric pressures |
Oct. 11, 2011 |
| 8018030 |
Semiconductor chip with seal ring and sacrificial corner pattern |
Sep. 13, 2011 |
| 8004053 |
Micromechanical device and method of manufacturing micromechanical device |
Aug. 23, 2011 |
| 7994617 |
Semiconductor device |
Aug. 9, 2011 |
| 7990025 |
Silicon package with embedded oscillator |
Aug. 2, 2011 |
| 7977786 |
Saw debris reduction in MEMS devices |
Jul. 12, 2011 |
| 7960215 |
Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
Jun. 14, 2011 |
| 7956347 |
Integrated modulating retro-reflector |
Jun. 7, 2011 |
| 7898093 |
Exposed die overmolded flip chip package and fabrication method |
Mar. 1, 2011 |
| 7884467 |
Package structure of a microphone |
Feb. 8, 2011 |
| 7842552 |
Semiconductor chip packages having reduced stress |
Nov. 30, 2010 |
| 7838897 |
Light-emitting device and method for manufacturing the same |
Nov. 23, 2010 |
| 7838990 |
High-frequency hermetically-sealed circuit package |
Nov. 23, 2010 |
| 7825517 |
Method for packaging semiconductor dies having through-silicon vias |
Nov. 2, 2010 |
| 7808004 |
Light emitting diode package structure and method of manufacturing the same |
Oct. 5, 2010 |
| 7772679 |
Magnetic shielding package structure of a magnetic memory device |
Aug. 10, 2010 |
| 7768122 |
Semiconductor package |
Aug. 3, 2010 |
| 7732915 |
Semiconductor sensor device with sensor chip and method for producing the same |
Jun. 8, 2010 |
| 7728425 |
Seal of fluid port |
Jun. 1, 2010 |
| 7714417 |
Substrate for mounting semiconductor element and method of manufacturing the same |
May. 11, 2010 |
| 7709950 |
Silicon wafer having through-wafer vias |
May. 4, 2010 |
| 7692292 |
Packaged electronic element and method of producing electronic element package |
Apr. 6, 2010 |
| 7671432 |
Dynamic quantity sensor |
Mar. 2, 2010 |
|
|
|
