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Class Information
Number: 257/E23.181
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by shape of container or parts, e.g., caps, walls (epo)
Description: This subclass is indented under subclass E23.180. This subclass is substantially the same in scope as ECLA classification H01L23/04.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.183 Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) 28
257/E23.188 Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo) 73
257/E23.182 Container being hollow construction having no base used as mounting for semiconductor body (epo) 40

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8692366 Apparatus and method for microelectromechanical systems device packaging Apr. 8, 2014
8643169 Semiconductor sensor device with over-molded lid Feb. 4, 2014
8637978 System-in-a-package based flash memory card Jan. 28, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8587114 Multichip electronic packages and methods of manufacture Nov. 19, 2013
8575740 Semiconductor device Nov. 5, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8513043 Method for MEMS device fabrication and device formed Aug. 20, 2013
8497577 Micro electrical mechanical system Jul. 30, 2013
8395253 Hermetic surface mounted power package Mar. 12, 2013
8358003 Surface mount electronic device packaging assembly Jan. 22, 2013
8344489 Semiconductor device and manufacturing method thereof Jan. 1, 2013
8324728 Wafer level packaging using flip chip mounting Dec. 4, 2012
8314485 Electronic component Nov. 20, 2012
8309388 MEMS package having formed metal lid Nov. 13, 2012
8288791 Housing body and method for production thereof Oct. 16, 2012
8269320 Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof Sep. 18, 2012
8247889 Package having an inner shield and method for making the same Aug. 21, 2012
8247897 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same Aug. 21, 2012
8207022 Exposed die overmolded flip chip package method Jun. 26, 2012
8164180 Functional element package and fabrication method therefor Apr. 24, 2012
8154113 Interconnect and test assembly including an interconnect Apr. 10, 2012
8148811 Semiconductor device and manufacturing method thereof Apr. 3, 2012
8143729 Autoclave capable chip-scale package Mar. 27, 2012
8076771 Semiconductor device having metal cap divided by slit Dec. 13, 2011
8049311 Electronic component and method for its production Nov. 1, 2011
8044429 Light-emitting device and method for manufacturing the same Oct. 25, 2011
8035209 Micromechanical device which has cavities having different internal atmospheric pressures Oct. 11, 2011
8018030 Semiconductor chip with seal ring and sacrificial corner pattern Sep. 13, 2011
8004053 Micromechanical device and method of manufacturing micromechanical device Aug. 23, 2011
7994617 Semiconductor device Aug. 9, 2011
7990025 Silicon package with embedded oscillator Aug. 2, 2011
7977786 Saw debris reduction in MEMS devices Jul. 12, 2011
7960215 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device Jun. 14, 2011
7956347 Integrated modulating retro-reflector Jun. 7, 2011
7898093 Exposed die overmolded flip chip package and fabrication method Mar. 1, 2011
7884467 Package structure of a microphone Feb. 8, 2011
7842552 Semiconductor chip packages having reduced stress Nov. 30, 2010
7838897 Light-emitting device and method for manufacturing the same Nov. 23, 2010
7838990 High-frequency hermetically-sealed circuit package Nov. 23, 2010
7825517 Method for packaging semiconductor dies having through-silicon vias Nov. 2, 2010
7808004 Light emitting diode package structure and method of manufacturing the same Oct. 5, 2010
7772679 Magnetic shielding package structure of a magnetic memory device Aug. 10, 2010
7768122 Semiconductor package Aug. 3, 2010
7732915 Semiconductor sensor device with sensor chip and method for producing the same Jun. 8, 2010
7728425 Seal of fluid port Jun. 1, 2010
7714417 Substrate for mounting semiconductor element and method of manufacturing the same May. 11, 2010
7709950 Silicon wafer having through-wafer vias May. 4, 2010
7692292 Packaged electronic element and method of producing electronic element package Apr. 6, 2010
7671432 Dynamic quantity sensor Mar. 2, 2010

1 2 3 4 5 6 7 8

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