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Class Information
Number: 257/E23.18
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/02.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.191 Characterized by material of container or its electrical properties (epo) 68
257/E23.193 Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (epo) 739
257/E23.181 Characterized by shape of container or parts, e.g., caps, walls (epo) 367

Patents under this class:
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Patent Number Title Of Patent Date Issued
8710638 Socket type MEMS device with stand-off portion Apr. 29, 2014
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process Apr. 22, 2014
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8659019 Semiconductor device Feb. 25, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633049 Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom Jan. 21, 2014
8610261 Power semiconductor device Dec. 17, 2013
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8569113 Method for producing a microfluid component, as well as microfluid component Oct. 29, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8552544 Package structure Oct. 8, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8492883 Semiconductor package having a cavity structure Jul. 23, 2013
8487429 Assembly of multi-chip modules using sacrificial features Jul. 16, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8466010 Seal ring support for backside illuminated image sensor Jun. 18, 2013
8410613 Semiconductor device having groove-shaped pattern Apr. 2, 2013
8394679 Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture Mar. 12, 2013
8395177 Package for protecting a device from ambient substances Mar. 12, 2013
8395268 Semiconductor memory device Mar. 12, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8349634 Semiconductor device with sealed cap Jan. 8, 2013
8349635 Encapsulated MEMS device and method to form the same Jan. 8, 2013
8334589 Power block and power semiconductor module using same Dec. 18, 2012
8334582 Protective seal ring for preventing die-saw induced stress Dec. 18, 2012
8304874 Stackable integrated circuit package system Nov. 6, 2012
8294257 Power block and power semiconductor module using same Oct. 23, 2012
8288851 Method and system for hermetically sealing packages for optics Oct. 16, 2012
8217508 Method of packaging integrated circuit devices using preformed carrier Jul. 10, 2012
8207022 Exposed die overmolded flip chip package method Jun. 26, 2012
8188596 Multi-chip module May. 29, 2012
8169059 On-chip RF shields with through substrate conductors May. 1, 2012
8143103 Package stacking system with mold contamination prevention and method for manufacturing thereof Mar. 27, 2012
8138027 Optical semiconductor device having pre-molded leadframe with window and method therefor Mar. 20, 2012
8129828 Wiring substrate with reinforcement Mar. 6, 2012
8106495 Semiconductor apparatus and manufacturing method thereof Jan. 31, 2012
8102040 Integrated circuit package system with die and package combination Jan. 24, 2012
8084332 Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom Dec. 27, 2011
8039308 Integrated-circuit package for proximity communication Oct. 18, 2011
8035209 Micromechanical device which has cavities having different internal atmospheric pressures Oct. 11, 2011
8022509 Crack stopping structure and method for fabricating the same Sep. 20, 2011
8013435 Semiconductor module Sep. 6, 2011
8008735 Micromachine device with a spatial portion formed within Aug. 30, 2011
8003442 Integrated cirucit package and method for fabrication thereof Aug. 23, 2011
8004071 Semiconductor memory device Aug. 23, 2011
7989264 Warpage resistant semiconductor package and method for manufacturing the same Aug. 2, 2011
7990025 Silicon package with embedded oscillator Aug. 2, 2011
7964949 Tenon-and-mortise packaging structure Jun. 21, 2011
7956431 Method of manufacturing an image sensing micromodule Jun. 7, 2011

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