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Class Information
Number: 257/E23.179
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Marks applied to semiconductor devices or parts, e.g., registration marks, test patterns, alignment structures, wafer maps (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/544.

Patents under this class:

Patent Number Title Of Patent Date Issued
8704224 Semiconductor test structures Apr. 22, 2014
8692393 Alignment mark design for semiconductor device Apr. 8, 2014
8692392 Crack stop barrier and method of manufacturing thereof Apr. 8, 2014
8692245 Crack stop structure and method for forming the same Apr. 8, 2014
8680653 Wafer and a method of dicing a wafer Mar. 25, 2014
8674523 Apparatus and method for predetermined component placement to a target platform Mar. 18, 2014
8674355 Integrated circuit test units with integrated physical and electrical test regions Mar. 18, 2014
8673744 Wiring substrate, manufacturing method thereof, and semiconductor package Mar. 18, 2014
8673668 Test structure for controlling the incorporation of semiconductor alloys in transistors comprising high-k metal gate electrode structures Mar. 18, 2014
8673659 Method of fabricating semiconductor device including process monitoring pattern having overlapping input/output pad array area Mar. 18, 2014
8669641 Diffusion region routing for narrow scribe-line devices Mar. 11, 2014
8653669 Semiconductor package Feb. 18, 2014
8652971 Cavity process etch undercut monitor Feb. 18, 2014
8648339 Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals Feb. 11, 2014
8629568 Semiconductor device cover mark Jan. 14, 2014
8623772 Method of forming patterns of semiconductor device Jan. 7, 2014
8610294 Laser processing method and semiconductor device obtained by using the processing method Dec. 17, 2013
8610252 Scribe line structure for wafer dicing Dec. 17, 2013
8604474 Semiconductor device integrated with monitoring device in center thereof Dec. 10, 2013
8592287 Overlay alignment mark and method of detecting overlay alignment error using the mark Nov. 26, 2013
8592107 Method and apparatus of providing overlay Nov. 26, 2013
8587090 Die seal ring structure Nov. 19, 2013
8569899 Device and method for alignment of vertically stacked wafers and die Oct. 29, 2013
8564143 Overlay mark for multiple pre-layers and currently layer Oct. 22, 2013
8563393 Method for manufacturing semiconductor device Oct. 22, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8558351 Alignment for backside illumination sensor Oct. 15, 2013
8552544 Package structure Oct. 8, 2013
8552543 Semiconductor package Oct. 8, 2013
8546962 Mark structure and method for measuring alignment accuracy between former layer and latter layer Oct. 1, 2013
8546961 Alignment marks to enable 3D integration Oct. 1, 2013
8536572 Assembled multi-component electronic apparatus using alignment and reference marks Sep. 17, 2013
8535955 Method for assembling a multi-component electronic apparatus Sep. 17, 2013
8531046 Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside Sep. 10, 2013
8531008 Material structure in scribe line and method of separating chips Sep. 10, 2013
8530248 Method for placing a component onto a target platform by an apparatus using a probe Sep. 10, 2013
8525356 Wiring substrate, manufacturing method thereof, and semiconductor package Sep. 3, 2013
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Sep. 3, 2013
8519512 Test line placement to improve die sawing quality Aug. 27, 2013
8519391 Semiconductor chip with backside conductor structure Aug. 27, 2013
8519389 Semiconductor device, method of manufacturing the same, and method of designing the same Aug. 27, 2013
8513823 Semiconductor package having main stamp and sub-stamp Aug. 20, 2013
8513821 Overlay mark assistant feature Aug. 20, 2013
8508055 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8508017 Test device and semiconductor integrated circuit device Aug. 13, 2013
8507913 Method of bonding wafers Aug. 13, 2013
8502324 Semiconductor wafer having scribe lane alignment marks for reducing crack propagation Aug. 6, 2013
8497568 Monitoring pattern, and pattern stitch monitoring method and wafer therewith Jul. 30, 2013
8492912 Light emitting diode package Jul. 23, 2013
8492240 Solar-cell marking method and solar cell Jul. 23, 2013

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