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Class Information
Number: 257/E23.178
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Chips being integrally enclosed by interconnect and support structures (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538V.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8546194 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 1, 2013
8536700 Stackable electronic package and method of fabricating same Sep. 17, 2013
8525315 Semiconductor power module and method of manufacturing the same Sep. 3, 2013
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8476774 Off-chip VIAS in stacked chips Jul. 2, 2013
8466559 Forming die backside coating structures with coreless packages Jun. 18, 2013
8466569 Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer Jun. 18, 2013
8461672 Reconstituted wafer stack packaging with after-applied pad extensions Jun. 11, 2013
8456020 Semiconductor package and method of manufacturing the same Jun. 4, 2013
8455992 Semiconductor package and method of fabricating the same Jun. 4, 2013
8450838 Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus May. 28, 2013
8421200 Semiconductor integrated circuit device and method for fabricating the same Apr. 16, 2013
8330279 Semiconductor device Dec. 11, 2012
8319318 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages Nov. 27, 2012
8304895 Semiconductor package and method of fabricating the same Nov. 6, 2012
8293579 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Oct. 23, 2012
8253250 Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers Aug. 28, 2012
8222724 Semiconductor element module and method for manufacturing the same Jul. 17, 2012
8222723 Electric module having a conductive pattern layer Jul. 17, 2012
8217504 Article and panel comprising semiconductor chips, casting mold and methods of producing the same Jul. 10, 2012
8212361 Semiconductor die package including multiple dies and a common node structure Jul. 3, 2012
RE43380 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an May. 15, 2012
8125052 Seal ring structure with improved cracking protection Feb. 28, 2012
8110896 Substrate structure with capacitor component embedded therein and method for fabricating the same Feb. 7, 2012
8106495 Semiconductor apparatus and manufacturing method thereof Jan. 31, 2012
8106486 Electronic apparatus with an electrical conductor in the form of a liquid and an electrical insulator with a light-curing property Jan. 31, 2012
8097945 Bi-directional, reverse blocking battery switch Jan. 17, 2012
8093702 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Jan. 10, 2012
8076788 Off-chip vias in stacked chips Dec. 13, 2011
8076757 Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference Dec. 13, 2011
8072062 Circuit device with at least partial packaging and method for forming Dec. 6, 2011
8067830 Dual or multiple row package Nov. 29, 2011
8046914 Method for manufacturing multilayer printed circuit board Nov. 1, 2011
8022509 Crack stopping structure and method for fabricating the same Sep. 20, 2011
8022540 Chip package Sep. 20, 2011
8018043 Semiconductor package having side walls and method for manufacturing the same Sep. 13, 2011
8017440 Manufacturing method for semiconductor devices Sep. 13, 2011
8018054 Semiconductor die package including multiple semiconductor dice Sep. 13, 2011
8003438 Circuit module and manufacturing method thereof Aug. 23, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7999401 Semiconductor device and method of manufacturing same Aug. 16, 2011
7973399 Embedded chip package Jul. 5, 2011
7952204 Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same May. 31, 2011
7952187 System and method of forming a wafer scale package May. 31, 2011
7919871 Integrated circuit package system for stackable devices Apr. 5, 2011
7910405 Semiconductor device having adhesion increasing film to prevent peeling Mar. 22, 2011
7911036 Semiconductor wafer with rear side identification and method Mar. 22, 2011
7911047 Semiconductor device and method of fabricating the semiconductor device Mar. 22, 2011

1 2 3 4 5 6 7 8 9

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