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Class Information
Number: 257/E23.177
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Flexible insulating substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538J.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
5397916 Semiconductor device including stacked die Mar. 14, 1995
5386341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape Jan. 31, 1995
5363275 Modular component computer system Nov. 8, 1994
5354695 Membrane dielectric isolation IC fabrication Oct. 11, 1994
5345205 Compact high density interconnected microwave system Sep. 6, 1994
5341233 Liquid crystal module with tab assemblies connected through a flexible circuit board Aug. 23, 1994
5324687 Method for thinning of integrated circuit chips for lightweight packaged electronic systems Jun. 28, 1994
5321884 Multilayered flexible circuit package Jun. 21, 1994
5321210 Polyimide multilayer wiring board and method of producing same Jun. 14, 1994
5313416 Semiconductor memory control device and method of mounting same in high density May. 17, 1994
5310966 Wiring boards and manufacturing methods thereof May. 10, 1994
5303119 Interconnection system for integrated circuits Apr. 12, 1994
5288950 Flexible wiring board and method of preparing the same Feb. 22, 1994
5281852 Semiconductor device including stacked die Jan. 25, 1994
5268813 Flexible printed circuit package and flexible printed circuit for incorporating in such a package Dec. 7, 1993
5253010 Printed circuit board Oct. 12, 1993
5249245 Optoelectroinc mount including flexible substrate and method for making same Sep. 28, 1993
5243218 Cooling structure for electronics devices Sep. 7, 1993
5241454 Mutlilayered flexible circuit package Aug. 31, 1993
5239448 Formulation of multichip modules Aug. 24, 1993
5198965 Free form packaging of specific functions within a computer system Mar. 30, 1993
5192716 Method of making a extended integration semiconductor structure Mar. 9, 1993
5182631 Film carrier for RF IC Jan. 26, 1993
5164888 Method and structure for implementing dynamic chip burn-in Nov. 17, 1992
5152868 Elastomer connector for integrated circuits or similar, and method of manufacturing same Oct. 6, 1992
5138433 Multi-chip package type semiconductor device Aug. 11, 1992
5126920 Multiple integrated circuit interconnection arrangement Jun. 30, 1992
5115964 Method for bonding thin film electronic device May. 26, 1992
5109601 Method of marking a thin film package May. 5, 1992
5108553 G-tab manufacturing process and the product produced thereby Apr. 28, 1992
5106461 High-density, multi-level interconnects, flex circuits, and tape for tab Apr. 21, 1992
5067004 Module for interconnecting integrated circuits Nov. 19, 1991
5065228 G-TAB having particular through hole Nov. 12, 1991
5057969 Thin film electronic device Oct. 15, 1991
5055907 Extended integration semiconductor structure with wiring layers Oct. 8, 1991
4996585 Electronic package Feb. 26, 1991
4989317 Method for making tab circuit electrical connector supporting multiple components thereon Feb. 5, 1991
4981817 Tab method for implementing dynamic chip burn-in Jan. 1, 1991
4980034 High-density, multi-level interconnects, flex circuits, and tape for TAB Dec. 25, 1990
4965700 Thin film package for mixed bonding of chips Oct. 23, 1990
4937203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer Jun. 26, 1990
4933810 Integrated circuit interconnector Jun. 12, 1990
4918811 Multichip integrated circuit packaging method Apr. 24, 1990
4890157 Integrated circuit product having a polyimide film interconnection structure Dec. 26, 1989
4884122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer Nov. 28, 1989
4855867 Full panel electronic packaging structure Aug. 8, 1989
4805007 Flip chip module Feb. 14, 1989
4783695 Multichip integrated circuit packaging configuration and method Nov. 8, 1988
4766670 Full panel electronic packaging structure and method of making same Aug. 30, 1988
4744008 Flexible film chip carrier with decoupling capacitors May. 10, 1988

1 2 3 4 5 6 7

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