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Class Information
Number: 257/E23.177
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Flexible insulating substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538J.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
5937494 Method for assembling an ink-jet pen having a double-sided electrical interconnect flexible circuit Aug. 17, 1999
5933712 Attachment method for stacked integrated circuit (IC) chips Aug. 3, 1999
5907477 Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant May. 25, 1999
5904498 Connection component with releasable leads May. 18, 1999
5885849 Methods of making microelectronic assemblies Mar. 23, 1999
5873162 Technique for attaching a stiffener to a flexible substrate Feb. 23, 1999
5872700 Multi-chip module package with insulating tape having electrical leads and solder bumps Feb. 16, 1999
5872337 Chip carrier and cable assembly reinforced at edges Feb. 16, 1999
5869354 Method of making dielectrically isolated integrated circuit Feb. 9, 1999
5856913 Multilayer semiconductor device having high packing density Jan. 5, 1999
5854534 Controlled impedence interposer substrate Dec. 29, 1998
5840593 Membrane dielectric isolation IC fabrication Nov. 24, 1998
5834334 Method of forming a multi-chip module from a membrane circuit Nov. 10, 1998
5831828 Flexible circuit board and common heat spreader assembly Nov. 3, 1998
5822191 Integrated circuit mounting tape Oct. 13, 1998
5801446 Microelectronic connections with solid core joining units Sep. 1, 1998
5786629 3-D packaging using massive fillo-leaf technology Jul. 28, 1998
5776797 Three-dimensional flexible assembly of integrated circuits Jul. 7, 1998
5766983 Tape automated bonding circuit with interior sprocket holes Jun. 16, 1998
5763941 Connection component with releasable leads Jun. 9, 1998
5751553 Thin multichip module including a connector frame socket having first and second apertures May. 12, 1998
5729896 Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder Mar. 24, 1998
5712493 Display device having driving circuits at the periphery of a substrate Jan. 27, 1998
5686702 Polyimide multilayer wiring substrate Nov. 11, 1997
5668700 Panel assembly structure capable of connecting wiring line with electrode at fine pitch Sep. 16, 1997
5654220 Method of making a stacked 3D integrated circuit structure Aug. 5, 1997
5646446 Three-dimensional flexible assembly of integrated circuits Jul. 8, 1997
5638597 Manufacturing flexible circuit board assemblies with common heat spreaders Jun. 17, 1997
5637907 Three dimensional semiconductor circuit structure with optical interconnection Jun. 10, 1997
5633209 Method of forming a circuit membrane with a polysilicon film May. 27, 1997
5628852 Method for manufacturing a polyimide multilayer wiring substrate May. 13, 1997
5612511 Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems Mar. 18, 1997
5600179 Package for packaging a semiconductor device suitable for being connected to a connection object by soldering Feb. 4, 1997
5592007 Membrane dielectric isolation transistor fabrication Jan. 7, 1997
5592018 Membrane dielectric isolation IC fabrication Jan. 7, 1997
5580687 Contact stepper printed lithography method Dec. 3, 1996
5571741 Membrane dielectric isolation IC fabrication Nov. 5, 1996
5550941 Optoelectronic interface module Aug. 27, 1996
5532906 Wiring substrate Jul. 2, 1996
5527741 Fabrication and structures of circuit modules with flexible interconnect layers Jun. 18, 1996
5508558 High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion Apr. 16, 1996
5482658 Method of making an optoelectronic interface module Jan. 9, 1996
5477082 Bi-planar multi-chip module Dec. 19, 1995
5452182 Flexible high density interconnect structure and flexibly interconnected system Sep. 19, 1995
5448451 Lead carrier Sep. 5, 1995
5446245 Flexible circuit wiring board and method of producing the same Aug. 29, 1995
5426849 Method of producing a polyimide multilayer wiring board Jun. 27, 1995
5407557 Wiring boards and manufacturing methods thereof Apr. 18, 1995
5408052 Flexible multi-layer circuit wiring board Apr. 18, 1995
5401688 Semiconductor device of multichip module-type Mar. 28, 1995

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