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Class Information
Number: 257/E23.177
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Flexible insulating substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538J.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8678669 Reconfigurable polarity detachable connector assembly Mar. 25, 2014
8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Feb. 11, 2014
8502367 Wafer-level packaging method using composite material as a base Aug. 6, 2013
8436455 Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the same May. 7, 2013
8426983 Semiconductor device Apr. 23, 2013
8399301 Mounting structures for integrated circuit modules Mar. 19, 2013
8368197 Semiconductor package and method of manufacturing the semiconductor package Feb. 5, 2013
8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits Jan. 15, 2013
8258608 Lead frame and intermediate product of semiconductor device Sep. 4, 2012
8217507 Edge mount semiconductor package Jul. 10, 2012
8188474 Flexible light-emitting device May. 29, 2012
8093706 Mounting structure of semiconductor device and electronic apparatus using same Jan. 10, 2012
8072045 Extendable connector and network Dec. 6, 2011
7998797 Semiconductor device Aug. 16, 2011
7982296 Methods and devices for fabricating and assembling printable semiconductor elements Jul. 19, 2011
7943491 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp May. 17, 2011
7898074 Electronic devices including flexible electrical circuits and related methods Mar. 1, 2011
7834424 Extendable connector and network Nov. 16, 2010
7804985 Circuit module having force resistant construction Sep. 28, 2010
7772109 Manufacturing method of multilayer wiring substrate Aug. 10, 2010
7750457 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus Jul. 6, 2010
7719098 Stacked modules and method May. 18, 2010
7676918 Method for forming a molded circuit board Mar. 16, 2010
7671449 Structures and methods for an application of a flexible bridge Mar. 2, 2010
7649245 Structures and methods for a flexible bridge that enables high-bandwidth communication Jan. 19, 2010
7629691 Conductor geometry for electronic circuits fabricated on flexible substrates Dec. 8, 2009
7626273 Low profile stacking system and method Dec. 1, 2009
7622367 Methods and devices for fabricating and assembling printable semiconductor elements Nov. 24, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7579687 Circuit module turbulence enhancement systems and methods Aug. 25, 2009
7541671 Organic electronic devices having external barrier layer Jun. 2, 2009
7531906 Flip chip packaging using recessed interposer terminals May. 12, 2009
7508061 Three-dimensional semiconductor module having multi-sided ground block Mar. 24, 2009
7452754 Method for manufacturing flexible printed circuit boards Nov. 18, 2008
7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus Aug. 12, 2008
7408253 Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density Aug. 5, 2008
7368805 Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device May. 6, 2008
7345365 Electronic component with die and passive device Mar. 18, 2008
7342311 Electronic unit integrated into a flexible polymer body Mar. 11, 2008
7340829 Method for fabricating electrical connection structure of circuit board Mar. 11, 2008
7342308 Component stacking for integrated circuit electronic package Mar. 11, 2008
7335973 Adhesive of folder package Feb. 26, 2008
7335975 Integrated circuit stacking system and method Feb. 26, 2008
7321167 Flex tape architecture for integrated circuit signal ingress/egress Jan. 22, 2008
7309914 Inverted CSP stacking system and method Dec. 18, 2007
7304373 Power distribution within a folded flex package method and apparatus Dec. 4, 2007
7294928 Components, methods and assemblies for stacked packages Nov. 13, 2007
7291926 Multi-chip package structure Nov. 6, 2007
7288433 Method of making assemblies having stacked semiconductor chips Oct. 30, 2007

1 2 3 4 5 6 7

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