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Class Information
Number: 257/E23.175
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Geometry or layout of interconnection structure (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the in Same scope as ECLA classification H01L23/538G.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7411304 |
Semiconductor interconnect having conductive spring contacts |
Aug. 12, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7391117 |
Method for fabricating semiconductor components with conductive spring contacts |
Jun. 24, 2008 |
| 7355272 |
Semiconductor device with stacked semiconductor chips of the same type |
Apr. 8, 2008 |
| 7332818 |
Multi-chip electronic package with reduced line skew and circuitized substrate for use therein |
Feb. 19, 2008 |
| 7327042 |
Interconnection structure of electric conductive wirings |
Feb. 5, 2008 |
| 7323785 |
Semiconductor device |
Jan. 29, 2008 |
| 7291916 |
Signal transmission structure and circuit substrate thereof |
Nov. 6, 2007 |
| 7250371 |
Reduction of feature critical dimensions |
Jul. 31, 2007 |
| 7198980 |
Methods for assembling multiple semiconductor devices |
Apr. 3, 2007 |
| 7180180 |
Stacked device underfill and a method of fabrication |
Feb. 20, 2007 |
| 7112866 |
Method to form a cross network of air gaps within IMD layer |
Sep. 26, 2006 |
| 7098541 |
Interconnect method for directly connected stacked integrated circuits |
Aug. 29, 2006 |
| 7084513 |
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same |
Aug. 1, 2006 |
| 7061092 |
High-density modularity for ICS |
Jun. 13, 2006 |
| 7061785 |
Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package |
Jun. 13, 2006 |
| 7057292 |
Solder bar for high power flip chips |
Jun. 6, 2006 |
| 7054599 |
High density interconnect structure for use on software defined radio |
May. 30, 2006 |
| 7042073 |
Semiconductor device and manufacturing method thereof |
May. 9, 2006 |
| 7015570 |
Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
Mar. 21, 2006 |
| 6927471 |
Electronic system modules and method of fabrication |
Aug. 9, 2005 |
| 6906406 |
Multiple dice package |
Jun. 14, 2005 |
| 6891387 |
System for probing, testing, burn-in, repairing and programming of integrated circuits |
May. 10, 2005 |
| 6882046 |
Single package containing multiple integrated circuit devices |
Apr. 19, 2005 |
| 6881609 |
Component connections using bumps and wells |
Apr. 19, 2005 |
| 6879493 |
Module component and method of manufacturing the same |
Apr. 12, 2005 |
| 6861741 |
Circuit configuration |
Mar. 1, 2005 |
| 6838896 |
Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
Jan. 4, 2005 |
| 6831234 |
Multilayer printed circuit board |
Dec. 14, 2004 |
| 6815251 |
High density modularity for IC's |
Nov. 9, 2004 |
| 6815746 |
Semiconductor device and method of manufacturing the same |
Nov. 9, 2004 |
| 6809411 |
Low-inductance semiconductor components |
Oct. 26, 2004 |
| 6806428 |
Module component and method of manufacturing the same |
Oct. 19, 2004 |
| 6787920 |
Electronic circuit board manufacturing process and associated apparatus |
Sep. 7, 2004 |
| 6777785 |
Lead frame containing a master and a slave IC chips and a testing circuit embedded within the master IC chip |
Aug. 17, 2004 |
| 6765298 |
Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads |
Jul. 20, 2004 |
| 6759732 |
Semiconductor device with circuit cell array and arrangement on a semiconductor chip |
Jul. 6, 2004 |
| 6735651 |
Multi-chip module having chips coupled in a ring |
May. 11, 2004 |
| 6728904 |
Electronic circuit package |
Apr. 27, 2004 |
| 6713327 |
Stress controlled dielectric integrated circuit fabrication |
Mar. 30, 2004 |
| 6714625 |
Lithography device for semiconductor circuit pattern generation |
Mar. 30, 2004 |
| 6710263 |
Semiconductor devices |
Mar. 23, 2004 |
| 6704248 |
High density power module incorporating passive components distributed in a substrate |
Mar. 9, 2004 |
| 6682981 |
Stress controlled dielectric integrated circuit fabrication |
Jan. 27, 2004 |
| 6665182 |
Module unit for memory modules and method for its production |
Dec. 16, 2003 |
| 6632705 |
Memory modules and packages using different orientations and terminal assignments |
Oct. 14, 2003 |
| 6624703 |
Terminal arrangement for an electrical device |
Sep. 23, 2003 |
| 6602735 |
Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips |
Aug. 5, 2003 |
| 6584004 |
Electronic circuit package |
Jun. 24, 2003 |
| 6577016 |
Semiconductor device having adhesive inflow preventing means |
Jun. 10, 2003 |
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