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Class Information
Number: 257/E23.175
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Geometry or layout of interconnection structure (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the in Same scope as ECLA classification H01L23/538G.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8670245 Communication circuit for driving a plurality of devices Mar. 11, 2014
8669651 Package-on-package structures with reduced bump bridging Mar. 11, 2014
8643175 Multi-channel package and electronic system including the same Feb. 4, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8623700 Inter-chip communication Jan. 7, 2014
8614509 Semiconductor device having a multi-layered line and manufacturing method of the same Dec. 24, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8546194 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 1, 2013
8502375 Corrugated die edge for stacked die semiconductor package Aug. 6, 2013
8492263 Protected solder ball joints in wafer level chip-scale packaging Jul. 23, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8450843 Semiconductor device and method for designing the same May. 28, 2013
8436477 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate May. 7, 2013
8420528 Manufacturing method of a semiconductor device having wirings Apr. 16, 2013
8373273 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby Feb. 12, 2013
8361898 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Jan. 29, 2013
8350385 Reduced bottom roughness of stress buffering element of a semiconductor component Jan. 8, 2013
8344514 Semiconductor device structures and electronic devices including same hybrid conductive vias Jan. 1, 2013
8334599 Electronic device having a chip stack Dec. 18, 2012
8330275 Interconnect structure for semiconductor devices Dec. 11, 2012
8318610 Method for thin film device with stranded conductor Nov. 27, 2012
8258014 Method of manufacturing a power transistor module and package with integrated bus bar Sep. 4, 2012
8237291 Stack package Aug. 7, 2012
8203213 Methods for packaging microelectronic devices and microelectronic devices formed using such methods Jun. 19, 2012
8193639 Dummy metal design for packaging structures Jun. 5, 2012
8183090 Methods for manufacturing device mounting board and circuit substrate May. 22, 2012
8154132 Semiconductor device comprising internal and external wiring Apr. 10, 2012
8097945 Bi-directional, reverse blocking battery switch Jan. 17, 2012
8058708 Through hole interconnection structure for semiconductor wafer Nov. 15, 2011
8053356 Interconnect structure for semiconductor devices Nov. 8, 2011
8044518 Junction member comprising junction pads arranged in matrix and multichip package using same Oct. 25, 2011
8021965 Inter-chip communication Sep. 20, 2011
7994047 Integrated circuit contact system Aug. 9, 2011
7994509 Structure and method for thin film device with stranded conductor Aug. 9, 2011
7994630 Power transistor package with integrated bus bar Aug. 9, 2011
7972954 Porous silicon dielectric Jul. 5, 2011
7948087 Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element May. 24, 2011
7928577 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same Apr. 19, 2011
7923295 Semiconductor device and method of forming the device using sacrificial carrier Apr. 12, 2011
7901998 Packaging substrate having pattern-matched metal layers Mar. 8, 2011
7897509 Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device Mar. 1, 2011
7898073 Semiconductor device and semiconductor module employing thereof Mar. 1, 2011
7880308 Semiconductor device Feb. 1, 2011
7879651 Packaging conductive structure and method for forming the same Feb. 1, 2011
7868439 Chip package and substrate thereof Jan. 11, 2011
7863733 Integrated circuit with multiple layers of circuits Jan. 4, 2011
7863726 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof Jan. 4, 2011
7847311 Organic light emitting display (OLED) with conductive spacer and its method of manufacture Dec. 7, 2010

1 2 3 4 5 6

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