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Class Information
Number: 257/E23.173
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Multilayer substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538D.

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8624300 Contact integration for three-dimensional stacking semiconductor devices Jan. 7, 2014
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8357591 Method of processing a wafer by using and reusing photolithographic masks Jan. 22, 2013
8334533 Semiconductor device including a circuit area and a monitor area having a plurality of monitor layers and method for manufacturing the same Dec. 18, 2012
8324717 Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module Dec. 4, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8304895 Semiconductor package and method of fabricating the same Nov. 6, 2012
8232631 Semiconductor packing having offset stack structure Jul. 31, 2012
8217511 Redistributed chip packaging with thermal contact to device backside Jul. 10, 2012
8125074 Laminated substrate for an integrated circuit BGA package and printed circuit boards Feb. 28, 2012
8097946 Device mounting board, semiconductor module, and mobile device Jan. 17, 2012
8058105 Method of fabricating a packaging structure Nov. 15, 2011
8053882 Stacked semiconductor devices and signal distribution methods thereof Nov. 8, 2011
8044519 Semiconductor device and method of fabricating the same Oct. 25, 2011
7989317 Manufacturing method of semiconductor device Aug. 2, 2011
7939918 Chip packages with covers May. 10, 2011
7923828 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element Apr. 12, 2011
7923299 Manufacturing process for embedded semiconductor device Apr. 12, 2011
7915079 Method of manufacturing layered chip package Mar. 29, 2011
7911049 Electrically optimized and structurally protected via structure for high speed signals Mar. 22, 2011
7879656 Multilayer substrate and method of manufacturing the same Feb. 1, 2011
7871920 Semiconductor chips with reduced stress from underfill at edge of chip Jan. 18, 2011
7846772 Layered chip package and method of manufacturing same Dec. 7, 2010
7834441 Multilayer substrate and method of manufacturing the same Nov. 16, 2010
7825500 Manufacturing process and structure for embedded semiconductor device Nov. 2, 2010
7820526 Manufacturing method of semiconductor device Oct. 26, 2010
7808097 Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof Oct. 5, 2010
7800216 Multilayer printed wiring board Sep. 21, 2010
7791168 Techniques for providing decoupling capacitance Sep. 7, 2010
7777339 Semiconductor chips with reduced stress from underfill at edge of chip Aug. 17, 2010
7772109 Manufacturing method of multilayer wiring substrate Aug. 10, 2010
7741678 Semiconductor substrates having useful and transfer layers Jun. 22, 2010
7714432 Ceramic/organic hybrid substrate May. 11, 2010
7691669 Techniques for providing decoupling capacitance Apr. 6, 2010
7655537 Semiconductor substrates having useful and transfer layers Feb. 2, 2010
7633142 Flexible core for enhancement of package interconnect reliability Dec. 15, 2009
7601998 Semiconductor memory device having metallization comprising select lines, bit lines and word lines Oct. 13, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7579590 Method of measuring thin layers using SIMS Aug. 25, 2009
7557439 Layered chip package that implements memory device Jul. 7, 2009
7514273 Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel Apr. 7, 2009
7514780 Power semiconductor device Apr. 7, 2009
7511378 Enhancement of performance of a conductive wire in a multilayered substrate Mar. 31, 2009
7495335 Method of reducing process steps in metal line protective structure formation Feb. 24, 2009
7479700 Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same Jan. 20, 2009
7465991 Semiconductor substrates having useful and transfer layers Dec. 16, 2008
7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus Aug. 12, 2008
7405474 Low cost thermally enhanced semiconductor package Jul. 29, 2008
7397118 Ceramic chip-type electronic component and method of making the same Jul. 8, 2008
7358609 Semiconductor device Apr. 15, 2008

1 2 3 4 5 6 7 8 9 10

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