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Class Information
Number: 257/E23.173
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Multilayer substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538D.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7601998 |
Semiconductor memory device having metallization comprising select lines, bit lines and word lines |
Oct. 13, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7579590 |
Method of measuring thin layers using SIMS |
Aug. 25, 2009 |
| 7557439 |
Layered chip package that implements memory device |
Jul. 7, 2009 |
| 7514273 |
Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel |
Apr. 7, 2009 |
| 7514780 |
Power semiconductor device |
Apr. 7, 2009 |
| 7511378 |
Enhancement of performance of a conductive wire in a multilayered substrate |
Mar. 31, 2009 |
| 7495335 |
Method of reducing process steps in metal line protective structure formation |
Feb. 24, 2009 |
| 7479700 |
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same |
Jan. 20, 2009 |
| 7465991 |
Semiconductor substrates having useful and transfer layers |
Dec. 16, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7397118 |
Ceramic chip-type electronic component and method of making the same |
Jul. 8, 2008 |
| 7358609 |
Semiconductor device |
Apr. 15, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7340829 |
Method for fabricating electrical connection structure of circuit board |
Mar. 11, 2008 |
| 7307346 |
Final passivation scheme for integrated circuits |
Dec. 11, 2007 |
| 7301230 |
Circuit board with a thin-film layer configured to accommodate a passive element |
Nov. 27, 2007 |
| 7287328 |
Methods for distributed electrode injection |
Oct. 30, 2007 |
| 7196408 |
Fan out type wafer level package structure and method of the same |
Mar. 27, 2007 |
| 7084513 |
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same |
Aug. 1, 2006 |
| 7035113 |
Multi-chip electronic package having laminate carrier and method of making same |
Apr. 25, 2006 |
| 7023707 |
Information handling system |
Apr. 4, 2006 |
| 6998708 |
Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
Feb. 14, 2006 |
| 6995322 |
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
Feb. 7, 2006 |
| 6992896 |
Stacked chip electronic package having laminate carrier and method of making same |
Jan. 31, 2006 |
| 6984886 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Jan. 10, 2006 |
| 6962866 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Nov. 8, 2005 |
| 6943445 |
Semiconductor device having bridge-connected wiring structure |
Sep. 13, 2005 |
| 6930392 |
Electronic parts packaging structure and method of manufacturing the same |
Aug. 16, 2005 |
| 6906411 |
Multilayer substrate module and portable wireless terminal |
Jun. 14, 2005 |
| 6894228 |
High performance dense wire for printed circuit board |
May. 17, 2005 |
| 6891387 |
System for probing, testing, burn-in, repairing and programming of integrated circuits |
May. 10, 2005 |
| 6888218 |
Embedded capacitor multi-chip modules |
May. 3, 2005 |
| 6879493 |
Module component and method of manufacturing the same |
Apr. 12, 2005 |
| 6856009 |
Techniques for packaging multiple device components |
Feb. 15, 2005 |
| 6842347 |
Data processing system and associated control chip and printed circuit board |
Jan. 11, 2005 |
| 6838896 |
Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
Jan. 4, 2005 |
| 6836025 |
Semiconductor device configured to be surface mountable |
Dec. 28, 2004 |
| 6832436 |
Method for forming a substructure of a multilayered laminate |
Dec. 21, 2004 |
| 6828514 |
High speed circuit board and method for fabrication |
Dec. 7, 2004 |
| 6828506 |
Wiring structure |
Dec. 7, 2004 |
| 6812561 |
Thin high-frequency module having integrated circuit chip with little breakage |
Nov. 2, 2004 |
| 6809268 |
Printed wiring substrate and method for fabricating the same |
Oct. 26, 2004 |
| 6808578 |
Method for producing ceramic substrate |
Oct. 26, 2004 |
| 6806428 |
Module component and method of manufacturing the same |
Oct. 19, 2004 |
| 6798045 |
Lead frame, circuit board with lead frame, and method for producing the lead frame |
Sep. 28, 2004 |
| 6794739 |
Semiconductor device, process for production thereof, and electronic equipment |
Sep. 21, 2004 |
| 6791178 |
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
Sep. 14, 2004 |
| 6780677 |
Process for mounting electronic device and semiconductor device |
Aug. 24, 2004 |
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