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Class Information
Number: 257/E23.172
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Assembly of plurality of insulating substrates (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538F.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8587123 Multi-chip and multi-substrate reconstitution based packaging Nov. 19, 2013
8536700 Stackable electronic package and method of fabricating same Sep. 17, 2013
8455992 Semiconductor package and method of fabricating the same Jun. 4, 2013
8426956 Semiconductor package structure having plural packages in a stacked arrangement Apr. 23, 2013
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8304895 Semiconductor package and method of fabricating the same Nov. 6, 2012
8274144 Helical springs electrical connecting a plurality of packages Sep. 25, 2012
8232631 Semiconductor packing having offset stack structure Jul. 31, 2012
8168471 Semiconductor device and manufacturing method of a semiconductor device May. 1, 2012
8035220 Semiconductor packaging device Oct. 11, 2011
8035210 Integrated circuit package system with interposer Oct. 11, 2011
7919841 Mounting structures for integrated circuit modules Apr. 5, 2011
7919871 Integrated circuit package system for stackable devices Apr. 5, 2011
7883938 Stacked die semiconductor package and method of assembly Feb. 8, 2011
7880308 Semiconductor device Feb. 1, 2011
7799604 Semiconductor device having multilayer printed wiring board and manufacturing method of the same Sep. 21, 2010
7755181 IC package and method of manufacturing the same Jul. 13, 2010
7749807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies Jul. 6, 2010
7741151 Integrated circuit package formation Jun. 22, 2010
7732907 Integrated circuit package system with edge connection system Jun. 8, 2010
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7569922 Semiconductor device having a bonding wire and method for manufacturing the same Aug. 4, 2009
7557439 Layered chip package that implements memory device Jul. 7, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7508061 Three-dimensional semiconductor module having multi-sided ground block Mar. 24, 2009
7385281 Semiconductor integrated circuit device Jun. 10, 2008
7372139 Semiconductor chip package May. 13, 2008
7340829 Method for fabricating electrical connection structure of circuit board Mar. 11, 2008
7335972 Heterogeneously integrated microsystem-on-a-chip Feb. 26, 2008
7332736 Article comprising gated field emission structures with centralized nanowires and method for making the same Feb. 19, 2008
7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths Dec. 11, 2007
7276787 Silicon chip carrier with conductive through-vias and method for fabricating same Oct. 2, 2007
7239024 Semiconductor package with recess for die Jul. 3, 2007
7224062 Chip package with embedded panel-shaped component May. 29, 2007
7199458 Stacked offset semiconductor package and method for fabricating Apr. 3, 2007
7138708 Electronic system for fixing power and signal semiconductor chips Nov. 21, 2006
7084513 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same Aug. 1, 2006
7060601 Packaging substrates for integrated circuits and soldering methods Jun. 13, 2006
7059047 Sockets for "springed" semiconductor devices Jun. 13, 2006
7057272 Power supply connection structure to a semiconductor device Jun. 6, 2006
7049170 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities May. 23, 2006
7047634 Method of making a multilayer wiring board May. 23, 2006
7045886 Semiconductor device and method of fabricating the same May. 16, 2006
7045884 Semiconductor device package May. 16, 2006
7042074 Power semiconductor module and method for producing it May. 9, 2006
7041516 Multi chip module assembly May. 9, 2006
7034401 Packaging substrates for integrated circuits and soldering methods Apr. 25, 2006
7018866 Circuit component built-in module with embedded semiconductor chip and method of manufacturing Mar. 28, 2006
6998708 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set Feb. 14, 2006
6995043 Methods for fabricating routing elements for multichip modules Feb. 7, 2006

1 2 3 4 5 6 7 8 9

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