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Class Information
Number: 257/E23.171
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Adaptable interconnections, e.g., for engineering changes (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8680648 Compact metal connect and/or disconnect structures Mar. 25, 2014
8441106 Apparatus and method for defining laser cleave alignment May. 14, 2013
8344520 Stacked structure of chips Jan. 1, 2013
8124429 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types Feb. 28, 2012
8053862 Integrated circuit fuse Nov. 8, 2011
8030137 Flexible interposer for stacking semiconductor chips and connecting same to substrate Oct. 4, 2011
7989932 Semiconductor device Aug. 2, 2011
7928550 Flexible interposer for stacking semiconductor chips and connecting same to substrate Apr. 19, 2011
7863733 Integrated circuit with multiple layers of circuits Jan. 4, 2011
7851898 Multichip package or system-in package Dec. 14, 2010
7772047 Method of fabricating a semiconductor die having a redistribution layer Aug. 10, 2010
7741151 Integrated circuit package formation Jun. 22, 2010
7728427 Assembling stacked substrates that can form cylindrical inductors and adjustable transformers Jun. 1, 2010
7626248 Semiconductor package with a controlled impedance bus Dec. 1, 2009
7521784 System for coupling wire to semiconductor region Apr. 21, 2009
7391122 Techniques for flip chip package migration Jun. 24, 2008
7257884 Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration Aug. 21, 2007
7126232 Defect repair apparatus for an electronic device Oct. 24, 2006
7109585 Junction interconnection structures Sep. 19, 2006
7064421 Wire bonding package Jun. 20, 2006
7060529 Multiple chip semiconductor arrangement having electrical components in separating regions Jun. 13, 2006
7060537 Microchip controller board manufacturing method Jun. 13, 2006
7061093 Semiconductor device and voltage regulator Jun. 13, 2006
7037757 Stacked semiconductor module May. 2, 2006
7007375 Method for fabricating a semiconductor component Mar. 7, 2006
7005727 Low cost programmable CPU package/substrate Feb. 28, 2006
6999332 Semiconductor package with a controlled impedance bus and method of forming same Feb. 14, 2006
6991969 Methods and apparatus for addition of electrical conductors to previously fabricated device Jan. 31, 2006
6946327 Semiconductor device and manufacturing method of that Sep. 20, 2005
6936833 Semiconductor device package having a switcher connecting plural processing elements Aug. 30, 2005
6937458 Selectable decoupling capacitors for integrated circuit and methods of use Aug. 30, 2005
6917120 Microchip controller board Jul. 12, 2005
6914786 Converter device Jul. 5, 2005
6914275 Semiconductor component with electrical characteristic adjustment circuitry Jul. 5, 2005
6911736 Electrostatic discharge protection Jun. 28, 2005
6911730 Multi-chip module including embedded transistors within the substrate Jun. 28, 2005
6861742 Wafer level chip size package having rerouting layers Mar. 1, 2005
6861738 Laminated-chip semiconductor device Mar. 1, 2005
6853058 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member Feb. 8, 2005
6844625 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit Jan. 18, 2005
6841868 Memory modules including capacity for additional memory Jan. 11, 2005
6838766 Semiconductor device Jan. 4, 2005
6815803 Multiple chip semiconductor arrangement having electrical components in separating regions Nov. 9, 2004
6815230 Control signal transmitting method with package power pin and related integrated circuit package structure Nov. 9, 2004
6812557 Stacked type semiconductor device Nov. 2, 2004
6809332 Electronic device and defect repair method thereof Oct. 26, 2004
6759917 Method and apparatus for adjusting impedance of matching circuit Jul. 6, 2004
6753482 Semiconductor component with adjustment circuitry Jun. 22, 2004
6730989 Semiconductor package and method May. 4, 2004
6730526 Multi-chip module system and method of fabrication May. 4, 2004

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