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Class Information
Number: 257/E23.171
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (epo) > Adaptable interconnections, e.g., for engineering changes (epo)
Description: This subclass is indented under subclass E23.169. This subclass is substantially the same in scope as ECLA classification H01L23/538B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8680648 |
Compact metal connect and/or disconnect structures |
Mar. 25, 2014 |
| 8441106 |
Apparatus and method for defining laser cleave alignment |
May. 14, 2013 |
| 8344520 |
Stacked structure of chips |
Jan. 1, 2013 |
| 8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
Feb. 28, 2012 |
| 8053862 |
Integrated circuit fuse |
Nov. 8, 2011 |
| 8030137 |
Flexible interposer for stacking semiconductor chips and connecting same to substrate |
Oct. 4, 2011 |
| 7989932 |
Semiconductor device |
Aug. 2, 2011 |
| 7928550 |
Flexible interposer for stacking semiconductor chips and connecting same to substrate |
Apr. 19, 2011 |
| 7863733 |
Integrated circuit with multiple layers of circuits |
Jan. 4, 2011 |
| 7851898 |
Multichip package or system-in package |
Dec. 14, 2010 |
| 7772047 |
Method of fabricating a semiconductor die having a redistribution layer |
Aug. 10, 2010 |
| 7741151 |
Integrated circuit package formation |
Jun. 22, 2010 |
| 7728427 |
Assembling stacked substrates that can form cylindrical inductors and adjustable transformers |
Jun. 1, 2010 |
| 7626248 |
Semiconductor package with a controlled impedance bus |
Dec. 1, 2009 |
| 7521784 |
System for coupling wire to semiconductor region |
Apr. 21, 2009 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7257884 |
Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration |
Aug. 21, 2007 |
| 7126232 |
Defect repair apparatus for an electronic device |
Oct. 24, 2006 |
| 7109585 |
Junction interconnection structures |
Sep. 19, 2006 |
| 7064421 |
Wire bonding package |
Jun. 20, 2006 |
| 7060529 |
Multiple chip semiconductor arrangement having electrical components in separating regions |
Jun. 13, 2006 |
| 7060537 |
Microchip controller board manufacturing method |
Jun. 13, 2006 |
| 7061093 |
Semiconductor device and voltage regulator |
Jun. 13, 2006 |
| 7037757 |
Stacked semiconductor module |
May. 2, 2006 |
| 7007375 |
Method for fabricating a semiconductor component |
Mar. 7, 2006 |
| 7005727 |
Low cost programmable CPU package/substrate |
Feb. 28, 2006 |
| 6999332 |
Semiconductor package with a controlled impedance bus and method of forming same |
Feb. 14, 2006 |
| 6991969 |
Methods and apparatus for addition of electrical conductors to previously fabricated device |
Jan. 31, 2006 |
| 6946327 |
Semiconductor device and manufacturing method of that |
Sep. 20, 2005 |
| 6936833 |
Semiconductor device package having a switcher connecting plural processing elements |
Aug. 30, 2005 |
| 6937458 |
Selectable decoupling capacitors for integrated circuit and methods of use |
Aug. 30, 2005 |
| 6917120 |
Microchip controller board |
Jul. 12, 2005 |
| 6914786 |
Converter device |
Jul. 5, 2005 |
| 6914275 |
Semiconductor component with electrical characteristic adjustment circuitry |
Jul. 5, 2005 |
| 6911736 |
Electrostatic discharge protection |
Jun. 28, 2005 |
| 6911730 |
Multi-chip module including embedded transistors within the substrate |
Jun. 28, 2005 |
| 6861742 |
Wafer level chip size package having rerouting layers |
Mar. 1, 2005 |
| 6861738 |
Laminated-chip semiconductor device |
Mar. 1, 2005 |
| 6853058 |
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member |
Feb. 8, 2005 |
| 6844625 |
Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit |
Jan. 18, 2005 |
| 6841868 |
Memory modules including capacity for additional memory |
Jan. 11, 2005 |
| 6838766 |
Semiconductor device |
Jan. 4, 2005 |
| 6815803 |
Multiple chip semiconductor arrangement having electrical components in separating regions |
Nov. 9, 2004 |
| 6815230 |
Control signal transmitting method with package power pin and related integrated circuit package structure |
Nov. 9, 2004 |
| 6812557 |
Stacked type semiconductor device |
Nov. 2, 2004 |
| 6809332 |
Electronic device and defect repair method thereof |
Oct. 26, 2004 |
| 6759917 |
Method and apparatus for adjusting impedance of matching circuit |
Jul. 6, 2004 |
| 6753482 |
Semiconductor component with adjustment circuitry |
Jun. 22, 2004 |
| 6730989 |
Semiconductor package and method |
May. 4, 2004 |
| 6730526 |
Multi-chip module system and method of fabrication |
May. 4, 2004 |
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