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Class Information
Number: 257/E23.168
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including internal interconnections, e.g., cross-under constructions (epo)
Description: This subclass is indented under subclass E23.141. This subclass is substantially the same in scope as ECLA classification H01L23/535.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8686394 Semiconductor constructions and memory arrays Apr. 1, 2014
8680691 Semiconductor device having semiconductor member and mounting member Mar. 25, 2014
8680626 Methods, structures, and designs for self-aligning local interconnects used in integrated circuits Mar. 25, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8648472 Semiconductor device Feb. 11, 2014
8618637 Semiconductor package using through-electrodes having voids Dec. 31, 2013
8618662 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof Dec. 31, 2013
8610260 Stub minimization for assemblies without wirebonds to package substrate Dec. 17, 2013
8581349 3D memory semiconductor device and structure Nov. 12, 2013
8552562 Profiled contact for semiconductor device Oct. 8, 2013
8547167 Die power structure Oct. 1, 2013
8519515 TSV structure and method for forming the same Aug. 27, 2013
8492263 Protected solder ball joints in wafer level chip-scale packaging Jul. 23, 2013
8487305 Semiconductor device and method of manufacturing the same Jul. 16, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8471387 Extendable network structure Jun. 25, 2013
8461045 Bond pad connection to redistribution lines having tapered profiles Jun. 11, 2013
8415796 Semiconductor device having a multilayer structure Apr. 9, 2013
8399981 Ball grid array with improved single-ended and differential signal performance Mar. 19, 2013
8389406 Method of manufacturing semiconductor device Mar. 5, 2013
8368195 Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Feb. 5, 2013
8344508 Semiconductor device and fabrication method thereof Jan. 1, 2013
8299633 Semiconductor chip device with solder diffusion protection Oct. 30, 2012
8294280 Panelized backside processing for thin semiconductors Oct. 23, 2012
8294250 Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate Oct. 23, 2012
8278749 Integrated antennas in wafer level package Oct. 2, 2012
8269333 Combined power mesh transition and signal overpass/underpass Sep. 18, 2012
8264011 Semiconductor device Sep. 11, 2012
8242578 Anti-fuse device structure and electroplating circuit structure and method Aug. 14, 2012
8242612 Wiring board having piercing linear conductors and semiconductor device using the same Aug. 14, 2012
8232644 Wafer level package having a stress relief spacer and manufacturing method thereof Jul. 31, 2012
8227878 Sealed surface acoustic wave element package Jul. 24, 2012
8193639 Dummy metal design for packaging structures Jun. 5, 2012
8178905 Layout structure of semiconductor device May. 15, 2012
RE43320 Semiconductor device and manufacturing method thereof Apr. 24, 2012
8163646 Interconnection wiring structure of a semiconductor device and method for manufacturing same Apr. 24, 2012
8154053 Programmable metal elements and programmable via elements in an integrated circuit Apr. 10, 2012
8154132 Semiconductor device comprising internal and external wiring Apr. 10, 2012
8120177 Wafer level package having a stress relief spacer and manufacturing method thereof Feb. 21, 2012
8102059 Interconnect structure for high frequency signal transmissions Jan. 24, 2012
8084840 Interposer including air gap structure, methods of forming the same, semiconductor device including the interposer, and multi-chip package including the interposer Dec. 27, 2011
7994545 Methods, structures, and designs for self-aligning local interconnects used in integrated circuits Aug. 9, 2011
7977778 Integrated circuit package system with interference-fit feature Jul. 12, 2011
7977770 Semiconductor device and method of manufacturing the same Jul. 12, 2011
7968451 Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections Jun. 28, 2011
7935621 Anti-fuse device structure and electroplating circuit structure and method May. 3, 2011
7932606 Semiconductor device and a method of manufacturing the same Apr. 26, 2011
7911063 Semiconductor device Mar. 22, 2011
7892918 Method of fabricating a semiconductor device including formation of contact holes Feb. 22, 2011
7872355 Semiconductor integrated circuit and method of designing semiconductor integrated circuit Jan. 18, 2011

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