| |
 |
|
Class Information
Number: 257/E23.166
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Containing conductive organic materials or pastes, e.g., conductive adhesives, inks (epo)
Description: This subclass is indented under subclass E23.155. This subclass is substantially the same in scope as ECLA classification H01L23/532M4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7384862 |
Method for fabricating semiconductor device and display device |
Jun. 10, 2008 |
| 7321133 |
Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic |
Jan. 22, 2008 |
| 7282779 |
Device, method of manufacture thereof, manufacturing method for active matrix substrate, electro-optical apparatus and electronic apparatus |
Oct. 16, 2007 |
| 7126228 |
Apparatus for processing semiconductor devices in a singulated form |
Oct. 24, 2006 |
| 7037851 |
Methods for selective integration of airgaps and devices made by such methods |
May. 2, 2006 |
| 7026239 |
Method for making an anisotropic conductive polymer film on a semiconductor wafer |
Apr. 11, 2006 |
| 6747215 |
Fat conductor |
Jun. 8, 2004 |
| 6685853 |
Energy sensitive electrically conductive admixtures, uses thereof, methods of fabrication and structures fabricated therewith |
Feb. 3, 2004 |
| 6635406 |
Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects |
Oct. 21, 2003 |
| 6602732 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
Aug. 5, 2003 |
| 6572672 |
Nanotechnology for biomedical products |
Jun. 3, 2003 |
| 6569490 |
Nanotechnology for chemical radiation, and biotechnology sensors |
May. 27, 2003 |
| 6562495 |
Nanoscale catalyst compositions from complex and non-stoichiometric compositions |
May. 13, 2003 |
| 6554609 |
Nanotechnology for electrical devices |
Apr. 29, 2003 |
| 6506321 |
Silicon based conductive material and process for production thereof |
Jan. 14, 2003 |
| 6455941 |
Chip scale package |
Sep. 24, 2002 |
| 6437448 |
Semiconductor device adapted for mounting on a substrate |
Aug. 20, 2002 |
| 6400016 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
Jun. 4, 2002 |
| 6400024 |
Method of providing a vertical interconnect between thin film microelectronic devices |
Jun. 4, 2002 |
| 6344271 |
Materials and products using nanostructured non-stoichiometric substances |
Feb. 5, 2002 |
| 6333561 |
Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
Dec. 25, 2001 |
| 6326936 |
Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means |
Dec. 4, 2001 |
| 6246102 |
Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
Jun. 12, 2001 |
| 6239488 |
Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
May. 29, 2001 |
| 6214259 |
Dispersion containing Cu ultrafine particles individually dispersed therein |
Apr. 10, 2001 |
| 6153724 |
Preparation of cross-linked 2-dimensional polymers with sidedness from .alpha.,.beta.-lactones |
Nov. 28, 2000 |
| 6138348 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Oct. 31, 2000 |
| 6134118 |
Conductive epoxy flip-chip package and method |
Oct. 17, 2000 |
| 6132644 |
Energy sensitive electrically conductive admixtures |
Oct. 17, 2000 |
| 6121688 |
Anisotropic conductive sheet and printed circuit board |
Sep. 19, 2000 |
| 5918364 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Jul. 6, 1999 |
| 5886415 |
Anisotropic conductive sheet and printed circuit board |
Mar. 23, 1999 |
| 5879761 |
Method for forming electrically conductive polymer interconnects on electrical substrates |
Mar. 9, 1999 |
| 5689428 |
Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
Nov. 18, 1997 |
| 5685939 |
Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
Nov. 11, 1997 |
| 5677576 |
Chip sized semiconductor device |
Oct. 14, 1997 |
| 5657206 |
Conductive epoxy flip-chip package and method |
Aug. 12, 1997 |
| 5611140 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Mar. 18, 1997 |
| 5604379 |
Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film |
Feb. 18, 1997 |
| 5473119 |
Stress-resistant circuit board |
Dec. 5, 1995 |
| 5302548 |
Semiconductor device manufacturing method |
Apr. 12, 1994 |
| 5289035 |
Tri-layer titanium coating for an aluminum layer of a semiconductor device |
Feb. 22, 1994 |
| 5270253 |
Method of producing semiconductor device |
Dec. 14, 1993 |
| 5260115 |
Organic electro-conductive thin films and process for production thereof |
Nov. 9, 1993 |
| 5237130 |
Flip chip technology using electrically conductive polymers and dielectrics |
Aug. 17, 1993 |
| 5235212 |
Semiconductor device having a mechanical buffer |
Aug. 10, 1993 |
| 5231053 |
Process of forming a tri-layer titanium coating for an aluminum layer of a semiconductor device |
Jul. 27, 1993 |
| 5196371 |
Flip chip bonding method using electrically conductive polymer bumps |
Mar. 23, 1993 |
| 5188767 |
Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder |
Feb. 23, 1993 |
| 5116638 |
Organic electro-conductive thin films and process for production thereof |
May. 26, 1992 |
|
|
|
