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Class Information
Number: 257/E23.166
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Containing conductive organic materials or pastes, e.g., conductive adhesives, inks (epo)
Description: This subclass is indented under subclass E23.155. This subclass is substantially the same in scope as ECLA classification H01L23/532M4.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710662 Light-reflective anisotropic conductive paste and light-emitting device Apr. 29, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8384231 Method of forming a semiconductor die Feb. 26, 2013
8203218 Semiconductor device package including a paste member Jun. 19, 2012
8193643 Semiconductor device and method for fabricating the same Jun. 5, 2012
7625814 Filling deep features with conductors in semiconductor manufacturing Dec. 1, 2009
7554196 Plastic package and semiconductor component comprising such a plastic package, and method for its production Jun. 30, 2009
7485561 Filling deep features with conductors in semiconductor manufacturing Feb. 3, 2009
7456504 Electronic component assemblies with electrically conductive bonds Nov. 25, 2008
7384862 Method for fabricating semiconductor device and display device Jun. 10, 2008
7321133 Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic Jan. 22, 2008
7282779 Device, method of manufacture thereof, manufacturing method for active matrix substrate, electro-optical apparatus and electronic apparatus Oct. 16, 2007
7126228 Apparatus for processing semiconductor devices in a singulated form Oct. 24, 2006
7037851 Methods for selective integration of airgaps and devices made by such methods May. 2, 2006
7026239 Method for making an anisotropic conductive polymer film on a semiconductor wafer Apr. 11, 2006
6747215 Fat conductor Jun. 8, 2004
6685853 Energy sensitive electrically conductive admixtures, uses thereof, methods of fabrication and structures fabricated therewith Feb. 3, 2004
6635406 Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects Oct. 21, 2003
6602732 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate Aug. 5, 2003
6572672 Nanotechnology for biomedical products Jun. 3, 2003
6569490 Nanotechnology for chemical radiation, and biotechnology sensors May. 27, 2003
6562495 Nanoscale catalyst compositions from complex and non-stoichiometric compositions May. 13, 2003
6554609 Nanotechnology for electrical devices Apr. 29, 2003
6506321 Silicon based conductive material and process for production thereof Jan. 14, 2003
6455941 Chip scale package Sep. 24, 2002
6437448 Semiconductor device adapted for mounting on a substrate Aug. 20, 2002
6400016 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate Jun. 4, 2002
6400024 Method of providing a vertical interconnect between thin film microelectronic devices Jun. 4, 2002
6344271 Materials and products using nanostructured non-stoichiometric substances Feb. 5, 2002
6333561 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate Dec. 25, 2001
6326936 Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means Dec. 4, 2001
6246102 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture Jun. 12, 2001
6239488 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate May. 29, 2001
6214259 Dispersion containing Cu ultrafine particles individually dispersed therein Apr. 10, 2001
6153724 Preparation of cross-linked 2-dimensional polymers with sidedness from .alpha.,.beta.-lactones Nov. 28, 2000
6138348 Method of forming electrically conductive polymer interconnects on electrical substrates Oct. 31, 2000
6132644 Energy sensitive electrically conductive admixtures Oct. 17, 2000
6134118 Conductive epoxy flip-chip package and method Oct. 17, 2000
6121688 Anisotropic conductive sheet and printed circuit board Sep. 19, 2000
5918364 Method of forming electrically conductive polymer interconnects on electrical substrates Jul. 6, 1999
5886415 Anisotropic conductive sheet and printed circuit board Mar. 23, 1999
5879761 Method for forming electrically conductive polymer interconnects on electrical substrates Mar. 9, 1999
5689428 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture Nov. 18, 1997
5685939 Process for making a Z-axis adhesive and establishing electrical interconnection therewith Nov. 11, 1997
5677576 Chip sized semiconductor device Oct. 14, 1997
5657206 Conductive epoxy flip-chip package and method Aug. 12, 1997
5611140 Method of forming electrically conductive polymer interconnects on electrical substrates Mar. 18, 1997
5604379 Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film Feb. 18, 1997
5473119 Stress-resistant circuit board Dec. 5, 1995
5302548 Semiconductor device manufacturing method Apr. 12, 1994

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