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Class Information
Number: 257/E23.164
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Containing semiconductor material, e.g., polysilicon (epo)
Description: This subclass is indented under subclass E23.155. This subclass is substantially the same in scope as ECLA classification H01L23/532M2.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8686486 Memory device Apr. 1, 2014
8633544 Twin MONOS array for high speed application Jan. 21, 2014
8598705 Composite substrate for a semiconductor chip Dec. 3, 2013
8178861 Semiconductor device May. 15, 2012
8076665 Semiconductor device Dec. 13, 2011
7927905 Method of producing microsprings having nanowire tip structures Apr. 19, 2011
7829459 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device Nov. 9, 2010
7790580 Metal-induced crystallization of amorphous silicon in thin film transistors Sep. 7, 2010
7705459 Semiconductor devices and methods of forming interconnection lines therein Apr. 27, 2010
7592705 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device Sep. 22, 2009
7585757 Semiconductor device and method of manufacturing the same Sep. 8, 2009
7342301 Connection device with actuating element for changing a conductive state of a via Mar. 11, 2008
7265437 Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Sep. 4, 2007
7176485 Damascene resistor and method for measuring the width of same Feb. 13, 2007
6879017 Methods and structures for metal interconnections in integrated circuits Apr. 12, 2005
6794713 Semiconductor device and method of manufacturing the same including a dual layer raised source and drain Sep. 21, 2004
6774023 Method of manufacturing a semiconductor device having a multilayer structure including a dual-layer silicide Aug. 10, 2004
6693032 Method of forming a contact structure having an anchoring portion Feb. 17, 2004
6653229 Integrated circuit with a recessed conductive layer Nov. 25, 2003
6593653 Low leakage current silicon carbonitride prepared using methane, ammonia and silane for copper diffusion barrier, etchstop and passivation applications Jul. 15, 2003
6521528 Semiconductor device and method of making thereof Feb. 18, 2003
6506321 Silicon based conductive material and process for production thereof Jan. 14, 2003
6504224 Methods and structures for metal interconnections in integrated circuits Jan. 7, 2003
6476489 Apparatus and manufacturing method for semiconductor device adopting NA interlayer contact structure Nov. 5, 2002
6468845 Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor Oct. 22, 2002
6455942 Method and apparatus for strapping a plurality of polysilicon lines in a semiconductor integrated circuit device Sep. 24, 2002
6448651 Semiconductor device having a multi-level metallization and its fabricating method Sep. 10, 2002
6444568 Method of forming a copper diffusion barrier Sep. 3, 2002
6433430 Contact structure having a diffusion barrier Aug. 13, 2002
6429520 Semiconductor component with silicon wiring and method of fabricating the component Aug. 6, 2002
6429503 Connection element in an integrated circuit having a layer structure disposed between two conductive structures Aug. 6, 2002
6424038 Low dielectric constant microelectronic conductor structure with enhanced adhesion and attenuated electrical leakage Jul. 23, 2002
RE37769 Methods for fabricating memory cells and load elements Jun. 25, 2002
6383917 Method for making integrated circuits May. 7, 2002
6346731 Semiconductor apparatus having conductive thin films Feb. 12, 2002
6246116 Buried wiring line Jun. 12, 2001
6188136 Semiconductor device including a wiring layer having a non-doped or high resistivity polycrystal silicon portion Feb. 13, 2001
6171950 Method for forming a multilevel interconnection with low contact resistance in a semiconductor device Jan. 9, 2001
6153516 Method of fabricating a modified polysilicon plug structure Nov. 28, 2000
6121126 Methods and structures for metal interconnections in integrated circuits Sep. 19, 2000
6118140 Semiconductor apparatus having conductive thin films Sep. 12, 2000
6087693 Semiconductor device with reduced stepped portions Jul. 11, 2000
6066895 Interconnecting structure for semiconductor integrated circuits and method May. 23, 2000
6043142 Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor Mar. 28, 2000
6025265 Method of forming a landing pad structure in an integrated circuit Feb. 15, 2000
6020641 Multilevel interconnection with low contact resistance in a semiconductor device Feb. 1, 2000
6013951 Semiconductor device having an improved lead connection structure and manufacturing method thereof Jan. 11, 2000
6001729 Method of forming wiring structure for semiconductor device Dec. 14, 1999
5872385 Conductive interconnect structure and method of formation Feb. 16, 1999
5855993 Electronic devices having metallurgies containing copper-semiconductor compounds Jan. 5, 1999

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