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Class Information
Number: 257/E23.162
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Based on metals, e.g., alloys, metal silicides (epo) > Principal metal being noble metal, e.g., gold (epo)
Description: This subclass is indented under subclass E23.157. This subclass is substantially the same in scope as ECLA classification H01L23/532M1N.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8513091 Method for wafer bonding using gold and indium Aug. 20, 2013
8299549 Layer structure for electrical contacting of semiconductor components Oct. 30, 2012
8119518 Noble metal barrier for fluorine-doped carbon films Feb. 21, 2012
8039966 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects Oct. 18, 2011
8026609 Semiconductor device and method for producing the same Sep. 27, 2011
7884018 Method for improving the selectivity of a CVD process Feb. 8, 2011
7880300 Semiconductor chip comprising a metal coating structure and associated production method Feb. 1, 2011
7830010 Surface treatment for selective metal cap applications Nov. 9, 2010
7799677 Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same Sep. 21, 2010
7701062 Semiconductor device and method for producing the same Apr. 20, 2010
7638428 Semiconductor structure and method of forming the same Dec. 29, 2009
7626264 Substrate for device bonding and method for manufacturing same Dec. 1, 2009
7566661 Electroless treatment of noble metal barrier and adhesion layer Jul. 28, 2009
7563718 Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same Jul. 21, 2009
7557030 Method for fabricating a recess gate in a semiconductor device Jul. 7, 2009
7538429 Method of enabling solder deposition on a substrate and electronic package formed thereby May. 26, 2009
7384863 Semiconductor device and method for manufacturing the same Jun. 10, 2008
7276796 Formation of oxidation-resistant seed layer for interconnect applications Oct. 2, 2007
7071558 Agglomeration control using early transition metal alloys Jul. 4, 2006
7060615 Methods of forming roughened layers of platinum Jun. 13, 2006
7030493 Semiconductor device having layered interconnect structure with a copper or platinum conducting film and a neighboring film Apr. 18, 2006
6900119 Agglomeration control using early transition metal alloys May. 31, 2005
6890864 Semiconductor device fabricating method and treating liquid May. 10, 2005
6867108 Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same Mar. 15, 2005
6852635 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Feb. 8, 2005
6849927 Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals Feb. 1, 2005
6838367 Method for simultaneous formation of fuse and capacitor plate and resulting structure Jan. 4, 2005
6821889 Production of elemental thin films using a boron-containing reducing agent Nov. 23, 2004
6803300 Method of manufacturing a semiconductor device having a ground plane Oct. 12, 2004
6800552 Deposition of transition metal carbides Oct. 5, 2004
6794286 Process for fabricating a metal wiring and metal contact in a semicondutor device Sep. 21, 2004
6723281 Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials Apr. 20, 2004
6720657 Semiconductor device and method of manufacturing the same Apr. 13, 2004
6716660 Method for fabricating a wiring line assembly for a thin film transistor array panel substrate Apr. 6, 2004
6664192 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Dec. 16, 2003
6589414 Nitride layer forming methods Jul. 8, 2003
6583022 Methods of forming roughened layers of platinum and methods of forming capacitors Jun. 24, 2003
6579785 Method of making multi-level wiring in a semiconductor device Jun. 17, 2003
6552432 Mask on a polymer having an opening width less than that of the opening in the polymer Apr. 22, 2003
6541859 Methods and structures for silver interconnections in integrated circuits Apr. 1, 2003
6515365 Semiconductor device having a ground plane and manufacturing method thereof Feb. 4, 2003
6486514 Wiring line assembly for thin film transistor array substrate and a method for fabricating the same Nov. 26, 2002
6482262 Deposition of transition metal carbides Nov. 19, 2002
6475276 Production of elemental thin films using a boron-containing reducing agent Nov. 5, 2002
6440230 Nitride layer forming method Aug. 27, 2002
6433431 Coating of copper and silver air bridge structures Aug. 13, 2002
6410985 Silver metallization by damascene method Jun. 25, 2002
6383924 Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials May. 7, 2002
6380625 Semiconductor interconnect barrier and manufacturing method thereof Apr. 30, 2002
6346472 Manufacturing method for semiconductor metalization barrier Feb. 12, 2002

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