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Browse by Category: Main > Physics
Class Information
Number: 257/E23.161
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Based on metals, e.g., alloys, metal silicides (epo) > Principal metal being copper (epo)
Description: This subclass is indented under subclass E23.157. This subclass is substantially the same in scope as ECLA classification H01L23/532M1C.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8710659 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8703615 Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers Apr. 22, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8575029 Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance Nov. 5, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8513124 Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers Aug. 20, 2013
8513805 Manufacturing of a semiconductor device and the manufacturing method Aug. 20, 2013
8466553 Semiconductor device and semiconductor package having the same Jun. 18, 2013
8466556 Semiconductor device and method of manufacturing the same Jun. 18, 2013
8440563 Film forming method and processing system May. 14, 2013
8384189 High performance system-on-chip using post passivation process Feb. 26, 2013
8384217 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride Feb. 26, 2013
8378488 Semiconductor device and method of manufacturing the same Feb. 19, 2013
8349730 Transitional interface between metal and dielectric in interconnect structures Jan. 8, 2013
8344352 Using unstable nitrides to form semiconductor structures Jan. 1, 2013
8344509 Method for fabricating semiconductor device and semiconductor device Jan. 1, 2013
8330276 Semiconductor device and method for manufacturing the same Dec. 11, 2012
8324731 Integrated circuit device Dec. 4, 2012
8304906 Partial air gap formation for providing interconnect isolation in integrated circuits Nov. 6, 2012
8258627 Group II element alloys for protecting metal interconnects Sep. 4, 2012
8227347 Interconnecting structure production method, and interconnecting structure Jul. 24, 2012
8216933 Krypton sputtering of low resistivity tungsten Jul. 10, 2012
8198174 Air channel interconnects for 3-D integration Jun. 12, 2012
8198732 Semiconductor device Jun. 12, 2012
8188600 Semiconductor device and method of fabricating the same May. 29, 2012
8174121 Semiconductor device and manufacturing method thereof May. 8, 2012
8138604 Metal cap with ultra-low k dielectric material for circuit interconnect applications Mar. 20, 2012
8129844 Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices Mar. 6, 2012
8125013 Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors Feb. 28, 2012
8120181 Post passivation interconnection process and structures Feb. 21, 2012
8102051 Semiconductor device having an electrode and method for manufacturing the same Jan. 24, 2012
8089154 Electronic component formed with barrier-seed layer on base material Jan. 3, 2012
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8067836 Semiconductor device with reduced increase in copper film resistance Nov. 29, 2011
8063471 Copper alloy sheet for electric and electronic parts Nov. 22, 2011
8030204 Semiconductor device and method of manufacturing the same Oct. 4, 2011
8030779 Multi-layered metal interconnection Oct. 4, 2011
8026605 Interconnect structure and method of manufacturing a damascene structure Sep. 27, 2011
7982204 Using unstable nitrides to form semiconductor structures Jul. 19, 2011
7968455 Copper deposition for filling features in manufacture of microelectronic devices Jun. 28, 2011
7956465 Reducing resistivity in interconnect structures of integrated circuits Jun. 7, 2011
7919862 Reducing resistivity in interconnect structures of integrated circuits Apr. 5, 2011
7880303 Stacked contact with low aspect ratio Feb. 1, 2011
7880294 Potential-free housing leadthrough Feb. 1, 2011
7879263 Method and solution to grow charge-transfer complex salts Feb. 1, 2011
7868456 Semiconductor device and method for fabricating the same Jan. 11, 2011
7867888 Flip-chip package substrate and a method for fabricating the same Jan. 11, 2011

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