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Class Information
Number: 257/E23.159
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo) > Based on metals, e.g., alloys, metal silicides (epo) > Principal metal being aluminum (epo) > Aluminum alloys (epo)
Description: This subclass is indented under subclass E23.158. This subclass is substantially the same in scope as ECLA classification H01L23/532M1A2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8546923 Rigid power module suited for high-voltage applications Oct. 1, 2013
8519513 Semiconductor wafer plating bus Aug. 27, 2013
8399313 Method of manufacturing semiconductor device having first conductive layer including aluminum Mar. 19, 2013
8384222 Semiconductor device and manufacturing method thereof Feb. 26, 2013
8003449 Method of manufacturing a semiconductor device having a reverse staggered thin film transistor Aug. 23, 2011
7943518 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip May. 17, 2011
7928575 Electronic device, method of manufacture of the same, and sputtering target Apr. 19, 2011
7553754 Electronic device, method of manufacture of the same, and sputtering target Jun. 30, 2009
7323783 Electrode, method for producing same and semiconductor device using same Jan. 29, 2008
7224065 Contact/via force fill techniques and resulting structures May. 29, 2007
7193326 Mold type semiconductor device Mar. 20, 2007
7064437 Semiconductor device having aluminum conductors Jun. 20, 2006
6943090 Aluminum-beryllium alloys for air bridges Sep. 13, 2005
6888258 Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the same May. 3, 2005
6856021 Semiconductor device having aluminum alloy conductors Feb. 15, 2005
6797594 Semiconductor device and method of manufacturing the same Sep. 28, 2004
6791188 Thin film aluminum alloy and sputtering target to form the same Sep. 14, 2004
6784550 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Aug. 31, 2004
6781235 Three-level unitary interconnect structure Aug. 24, 2004
6777810 Interconnection alloy for integrated circuits Aug. 17, 2004
6774035 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Aug. 10, 2004
6736947 Sputtering target, A1 interconnection film, and electronic component May. 18, 2004
6717191 Aluminum-beryllium alloys for air bridges Apr. 6, 2004
6624519 Aluminum based alloy bridge structure and method of forming same Sep. 23, 2003
6605842 Semiconductor device and a method of manufacturing the same Aug. 12, 2003
6602788 Process for fabricating an interconnect for contact holes Aug. 5, 2003
6528848 Semiconductor device and a method of manufacturing the same Mar. 4, 2003
6522010 Semiconductor constructions comprising aluminum-containing layers Feb. 18, 2003
6509649 Semiconductor device and fabricating method thereof Jan. 21, 2003
6509590 Aluminum-beryllium alloys for air bridges Jan. 21, 2003
6472697 Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application Oct. 29, 2002
6459153 Compositions for improving interconnect metallization performance in integrated circuits Oct. 1, 2002
6413866 Method of forming a solute-enriched layer in a substrate surface and article formed thereby Jul. 2, 2002
6413863 Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process Jul. 2, 2002
6399471 Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application Jun. 4, 2002
6396151 Partially-overlapped interconnect structure and method of making May. 28, 2002
6339026 Semiconductor processing methods of polishing aluminum-comprising layers Jan. 15, 2002
6331482 Method of VLSI contact, trench, and via filling using a germanium underlayer with metallization Dec. 18, 2001
6329275 Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same Dec. 11, 2001
6316356 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Nov. 13, 2001
6312833 Multilayered wiring layer Nov. 6, 2001
6297156 Method for enhanced filling of high aspect ratio dual damascene structures Oct. 2, 2001
6278188 Semiconductor constructions comprising aluminum-containing layers Aug. 21, 2001
6265781 Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods Jul. 24, 2001
6242111 Anodized aluminum susceptor for forming integrated circuit structures and method of making anodized aluminum susceptor Jun. 5, 2001
6229213 Germanium alloy electrical interconnect structure May. 8, 2001
6200894 Method for enhancing aluminum interconnect properties Mar. 13, 2001
6110829 Ultra-low temperature Al fill for sub-0.25 .mu.m generation of ICs using an Al-Ge-Cu alloy Aug. 29, 2000
6110819 Interconnect structure using Al.sub.2 Cu for an integrated circuit chip Aug. 29, 2000
6096438 A1-N1-Y alloy films for electrodes of semiconductor devices and sputtering targets for depositing the A1-N1-Y alloy films Aug. 1, 2000

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