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Class Information
Number: 257/E23.155
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo) > Conductive materials (epo)
Description: This subclass is indented under subclass E23.154. This subclass is substantially the same in scope as ECLA classification H01L23/532M.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.157 Based on metals, e.g., alloys, metal silicides (epo) 97
257/E23.165 Containing carbon, e.g., fullerenes (epo) 46
257/E23.166 Containing conductive organic materials or pastes, e.g., conductive adhesives, inks (epo) 71
257/E23.164 Containing semiconductor material, e.g., polysilicon (epo) 279
257/E23.156 Containing superconducting materials (epo) 40


Patents under this class:

Patent Number Title Of Patent Date Issued
8569887 Post passivation interconnect with oxidation prevention layer Oct. 29, 2013
8486767 Interconnects with improved electromigration reliability Jul. 16, 2013
8421246 Joint structure and electronic component Apr. 16, 2013
8329502 Conformal coating of highly structured surfaces Dec. 11, 2012
8294202 Metal gate structure of a semiconductor device Oct. 23, 2012
8278757 Printed electronics Oct. 2, 2012
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels Sep. 4, 2012
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8026605 Interconnect structure and method of manufacturing a damascene structure Sep. 27, 2011
7989956 Interconnects with improved electromigration reliability Aug. 2, 2011
7880303 Stacked contact with low aspect ratio Feb. 1, 2011
7875977 Barrier layers for conductive features Jan. 25, 2011
7663238 Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof Feb. 16, 2010
7656037 Integrated circuit with improved component interconnections Feb. 2, 2010
7605469 Atomic layer deposited tantalum containing adhesion layer Oct. 20, 2009
7545051 Nanowire array and nanowire solar cells and methods for forming the same Jun. 9, 2009
6407453 Semiconductor device and method of manufacturing the same Jun. 18, 2002











 
 
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