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Class Information
Number: 257/E23.154
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Characterized by materials (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/532.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.155 Conductive materials (epo) 17
257/E23.167 Insulating materials (epo) 1,149


Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8592980 Carbon nanotube-modified low-K materials Nov. 26, 2013
8569887 Post passivation interconnect with oxidation prevention layer Oct. 29, 2013
8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device Aug. 20, 2013
8426971 Top tri-metal system for silicon power semiconductor devices Apr. 23, 2013
8421126 Double-sided integrated circuit chips Apr. 16, 2013
8211794 Properties of metallic copper diffusion barriers through silicon surface treatments Jul. 3, 2012
8084297 Method of implementing a capacitor in an integrated circuit Dec. 27, 2011
8072066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring Dec. 6, 2011
8008777 Method for manufacturing semiconductor device and the semiconductor device Aug. 30, 2011
7893537 Semiconductor device Feb. 22, 2011
7880303 Stacked contact with low aspect ratio Feb. 1, 2011
7851351 Manufacturing method for semiconductor devices with enhanced adhesivity and barrier properties Dec. 14, 2010
7821042 Imaging device including a multiplier electrode Oct. 26, 2010
7816789 Germanium-containing dielectric barrier for low-k process Oct. 19, 2010
7791192 Circuit for and method of implementing a capacitor in an integrated circuit Sep. 7, 2010
7709958 Methods and structures for interconnect passivation May. 4, 2010
7575995 Method of forming fine metal pattern and method of forming metal line using the same Aug. 18, 2009
7550848 Semiconductor constructions comprising particle-containing materials Jun. 23, 2009
7476600 FET gate structure and fabrication process Jan. 13, 2009
7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating Dec. 23, 2008
7224062 Chip package with embedded panel-shaped component May. 29, 2007
7091615 Concentration graded carbon doped oxide Aug. 15, 2006
6894334 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same May. 17, 2005
6825063 Integrated core microelectronic package Nov. 30, 2004
6774023 Method of manufacturing a semiconductor device having a multilayer structure including a dual-layer silicide Aug. 10, 2004
6586822 Integrated core microelectronic package Jul. 1, 2003
6548847 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AN Apr. 15, 2003
6388324 Self-repairing interconnections for electrical circuits May. 14, 2002
6342412 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jan. 29, 2002
6306762 Semiconductor device having multi-layered metalization and method of manufacturing the same Oct. 23, 2001
6169324 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jan. 2, 2001
6143657 Method of increasing the stability of a copper to copper interconnection process and structure manufactured thereby Nov. 7, 2000
6127255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Oct. 3, 2000
6001461 Electronic parts and manufacturing method thereof Dec. 14, 1999
5939787 Semiconductor device having a multi-layer contact structure Aug. 17, 1999
5880024 Semiconductor device having wiring self-aligned with shield structure and process of fabrication thereof Mar. 9, 1999
5811316 Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring Sep. 22, 1998
5780869 Semiconductor integrated circuit means comprising conductive protein on insulating film of calcium phosphate Jul. 14, 1998
5780882 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jul. 14, 1998
5739589 Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same Apr. 14, 1998
5565380 Semiconductor device and process for production thereof Oct. 15, 1996
5557147 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Sep. 17, 1996
5552341 Semiconductor device and method for manufacturing the same Sep. 3, 1996
5481137 Semiconductor device with improved immunity to contact and conductor defects Jan. 2, 1996
5430327 Ohmic contact for III-V semiconductor materials Jul. 4, 1995
5420073 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal May. 30, 1995
5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal Nov. 22, 1994
5358616 Filling of vias and contacts employing an aluminum-germanium alloy Oct. 25, 1994
5331191 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jul. 19, 1994
5306946 Semiconductor device having a passivation layer with silicon nitride layers Apr. 26, 1994

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