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Class Information
Number: 257/E23.152
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Geometry or layout of interconnection structure (epo) > Cross-sectional geometry (epo)
Description: This subclass is indented under subclass E23.151. This subclass is substantially the same in scope as ECLA classification H01L23/528C.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8648402 Semiconductor device Feb. 11, 2014
8648471 Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same Feb. 11, 2014
8629550 Printed wiring board with crossing wiring pattern Jan. 14, 2014
8618607 Semiconductor devices formed on a continuous active region with an isolating conductive structure positioned between such semiconductor devices, and methods of making same Dec. 31, 2013
8614511 Three dimensional semiconductor memory device and method of fabricating the same Dec. 24, 2013
8604557 Semiconductor memory device and method for manufacturing Dec. 10, 2013
8597960 Semiconductor chip stacking for redundancy and yield improvement Dec. 3, 2013
8541819 Semiconductor device and structure Sep. 24, 2013
8541878 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus Sep. 24, 2013
8513778 Semiconductor device Aug. 20, 2013
8513815 Implementing integrated circuit mixed double density and high performance wire structure Aug. 20, 2013
8502321 Semiconductor device and manufacturing method thereof Aug. 6, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8471391 Methods for multi-wire routing and apparatus implementing same Jun. 25, 2013
8441111 Stub minimization for multi-die wirebond assemblies with parallel windows May. 14, 2013
8436457 Stub minimization for multi-die wirebond assemblies with parallel windows May. 7, 2013
8378448 Chip inductor with frequency dependent inductance Feb. 19, 2013
8344497 Semiconductor package and electronic device having the same Jan. 1, 2013
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8310056 Semiconductor device Nov. 13, 2012
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels Sep. 4, 2012
8253198 Devices for shielding a signal line over an active region Aug. 28, 2012
8207613 Semiconductor memory device Jun. 26, 2012
8183148 Method of fabricating semiconductor device and semiconductor device May. 22, 2012
8183602 Nonvolatile semiconductor memory device including via-holes continuously formed through plural cell array layers May. 22, 2012
8115316 Packaging board, semiconductor module, and portable apparatus Feb. 14, 2012
8076781 Semiconductor device and manufacturing method of the same Dec. 13, 2011
8072066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring Dec. 6, 2011
8072080 Connection structure, electro-optical device, and method for production of electro-optical device Dec. 6, 2011
8044517 Electronic component comprising predominantly organic functional materials and a method for the production thereof Oct. 25, 2011
8013423 Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device Sep. 6, 2011
8008729 Integrated circuit with a contact structure including a portion arranged in a cavity of a semiconductor structure Aug. 30, 2011
7994047 Integrated circuit contact system Aug. 9, 2011
7948087 Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element May. 24, 2011
7948088 Semiconductor device May. 24, 2011
7928577 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same Apr. 19, 2011
7911063 Semiconductor device Mar. 22, 2011
7880284 Embedded power gating Feb. 1, 2011
7863733 Integrated circuit with multiple layers of circuits Jan. 4, 2011
7830005 Bond pad array for complex IC Nov. 9, 2010
7759801 Tapered signal lines Jul. 20, 2010
7732925 Semiconductor device and manufacturing method thereof Jun. 8, 2010
7709958 Methods and structures for interconnect passivation May. 4, 2010
7675161 Semiconductor device with wirings having varying lengths Mar. 9, 2010
7656037 Integrated circuit with improved component interconnections Feb. 2, 2010
7651939 Method of blocking a void during contact formation Jan. 26, 2010
7652364 Crossing conductive traces in a PCB Jan. 26, 2010
7648903 Modular bonding pad structure and method Jan. 19, 2010
7638870 Packaging for high speed integrated circuits Dec. 29, 2009
7625815 Reduced leakage interconnect structure Dec. 1, 2009

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