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Class Information
Number: 257/E23.146
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > With adaptable interconnections (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/525.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.147 Comprising antifuses, i.e., connections having their state changed from nonconductive to conductive (epo) 579
257/E23.149 Comprising fuses, i.e., connections having their state changed from conductive to nonconductive (epo) 562

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8680648 Compact metal connect and/or disconnect structures Mar. 25, 2014
8581305 Semiconductor memory device Nov. 12, 2013
8525247 Non-volatile memory device having variable resistance element Sep. 3, 2013
8450734 Semiconductor device and fabrication method for the same May. 28, 2013
8354731 Semiconductor device Jan. 15, 2013
8344520 Stacked structure of chips Jan. 1, 2013
8288862 Multiple die stack package Oct. 16, 2012
8278752 Microelectronic package and method for a compression-based mid-level interconnect Oct. 2, 2012
8242578 Anti-fuse device structure and electroplating circuit structure and method Aug. 14, 2012
8178978 Support mounted electrically interconnected die assembly May. 15, 2012
8178945 Programmable PN anti-fuse May. 15, 2012
7952201 Semiconductor device including stacked semiconductor chips May. 31, 2011
7935621 Anti-fuse device structure and electroplating circuit structure and method May. 3, 2011
7923812 Quad memory cell and method of making same Apr. 12, 2011
7799583 System for separation of an electrically conductive connection Sep. 21, 2010
7772093 Method of and circuit for protecting a transistor formed on a die Aug. 10, 2010
7745919 Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups Jun. 29, 2010
7709861 Systems and methods for supporting a subset of multiple interface types in a semiconductor device May. 4, 2010
7667231 Automatic on-die defect isolation Feb. 23, 2010
7656020 Packaging conductive structure for a semiconductor substrate having a metallic layer Feb. 2, 2010
7626248 Semiconductor package with a controlled impedance bus Dec. 1, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7553755 Method for symmetric deposition of metal layer Jun. 30, 2009
7554201 Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same Jun. 30, 2009
7547977 Semiconductor chip having bond pads Jun. 16, 2009
7541682 Semiconductor chip having bond pads Jun. 2, 2009
7508059 Stacked chip package with redistribution lines Mar. 24, 2009
7466031 Structure and method of forming metal buffering layer Dec. 16, 2008
7453159 Semiconductor chip having bond pads Nov. 18, 2008
7432585 Semiconductor device electronic component, circuit board, and electronic device Oct. 7, 2008
7368803 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion May. 6, 2008
7291922 Substrate with many via contact means disposed therein Nov. 6, 2007
7271486 Retarding agglomeration of Ni monosilicide using Ni alloys Sep. 18, 2007
7199458 Stacked offset semiconductor package and method for fabricating Apr. 3, 2007
7148578 Semiconductor multi-chip package Dec. 12, 2006
7109585 Junction interconnection structures Sep. 19, 2006
7074707 Method of fabricating a connection device Jul. 11, 2006
7067426 Semiconductor processing methods Jun. 27, 2006
7064434 Customized microelectronic device and method for making customized electrical interconnections Jun. 20, 2006
7064409 Structure and programming of laser fuse Jun. 20, 2006
7064344 Barrier material encapsulation of programmable material Jun. 20, 2006
7033860 Process for manufacturing semiconductor device Apr. 25, 2006
7023088 Semiconductor package, semiconductor device and electronic device Apr. 4, 2006
7010766 Parallel design processes for integrated circuits Mar. 7, 2006
6999332 Semiconductor package with a controlled impedance bus and method of forming same Feb. 14, 2006
6991970 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device Jan. 31, 2006
6989595 Molds configured to pattern masses associated with semiconductor constructions Jan. 24, 2006
6982227 Single and multilevel rework Jan. 3, 2006

1 2 3 4 5

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