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Class Information
Number: 257/E23.145
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Via connections in multilevel interconnection structure (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/522E.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710672 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8709945 Area efficient through-hole connections Apr. 29, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects Apr. 22, 2014
8703507 Method and apparatus to improve reliability of vias Apr. 22, 2014
8692385 Device for connecting nano-objects to external electrical systems, and method for producing said device Apr. 8, 2014
8692364 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8664766 Interconnect structure containing non-damaged dielectric and a via gouging feature Mar. 4, 2014
8664761 Semiconductor structure and manufacturing method of the same Mar. 4, 2014
8664113 Multilayer interconnect structure and method for integrated circuits Mar. 4, 2014
8659159 Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same Feb. 25, 2014
8653648 Zigzag pattern for TSV copper adhesion Feb. 18, 2014
8648472 Semiconductor device Feb. 11, 2014
8648471 Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same Feb. 11, 2014
8643183 Long-term heat-treated integrated circuit arrangements and methods for producing the same Feb. 4, 2014
8643083 Electronic devices with ultraviolet blocking layers Feb. 4, 2014
8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 4, 2014
8637982 Split loop cut pattern for spacer process Jan. 28, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633589 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Jan. 21, 2014
8633520 Semiconductor device Jan. 21, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8618663 Patternable dielectric film structure with improved lithography and method of fabricating same Dec. 31, 2013
8618539 Interconnect sensor for detecting delamination Dec. 31, 2013
8617981 Semiconductor device and manufacturing method thereof Dec. 31, 2013
8610287 Wiring substrate and method of manufacturing the same Dec. 17, 2013
8610275 Semiconductor contact structure including a spacer formed within a via and method of manufacturing the same Dec. 17, 2013
8604618 Structure and method for reducing vertical crack propagation Dec. 10, 2013
8604617 Semiconductor device Dec. 10, 2013
8604557 Semiconductor memory device and method for manufacturing Dec. 10, 2013
8592992 Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP Nov. 26, 2013
8592989 Integrated circuit package system with bump over via Nov. 26, 2013
8592980 Carbon nanotube-modified low-K materials Nov. 26, 2013
8592977 Integrated circuit (IC) chip and method for fabricating the same Nov. 26, 2013
8592306 Redundant metal barrier structure for interconnect applications Nov. 26, 2013
8587126 Stacked microelectronic assembly with TSVs formed in stages with plural active chips Nov. 19, 2013
8581389 Uniformity control for IC passivation structure Nov. 12, 2013
8581272 Method of producing nanopatterned articles, and articles produced thereby Nov. 12, 2013
8575761 Segmented supply rail configuration for a digital integrated circuit Nov. 5, 2013
8575760 Semiconductor devices having electrodes Nov. 5, 2013
8569893 Self-aligned, integrated circuit contact Oct. 29, 2013
8569892 Semiconductor device and manufacturing method thereof Oct. 29, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8558391 Semiconductor device and a method of manufacturing the same Oct. 15, 2013
8558390 Semiconductor device Oct. 15, 2013
8558384 Interconnect structure containing various capping materials for electrical fuse and other related applications Oct. 15, 2013
8558383 Post passivation structure for a semiconductor device and packaging process for same Oct. 15, 2013











 
 
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