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Class Information
Number: 257/E23.144
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Capacitive arrangements or effects of, or between wiring layers (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/522C.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8653666 Semiconductor storage device having a peripheral circuit region and a memory cell region Feb. 18, 2014
8618607 Semiconductor devices formed on a continuous active region with an isolating conductive structure positioned between such semiconductor devices, and methods of making same Dec. 31, 2013
8618632 Semiconductor device and multi-layered wiring substrate Dec. 31, 2013
8604557 Semiconductor memory device and method for manufacturing Dec. 10, 2013
8604594 Structures for preventing cross-talk between through-silicon vias and integrated circuits Dec. 10, 2013
8587095 Method for establishing and closing a trench of a semiconductor component Nov. 19, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Sep. 10, 2013
8518277 Plastic capacitive touch screen and method of manufacturing same Aug. 27, 2013
8502342 Circuits, systems, and methods for reducing effects of cross talk in I/O lines and wire bonds Aug. 6, 2013
8461668 Power management integrated circuit Jun. 11, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8373249 Programmable capacitor associated with an input/output pad Feb. 12, 2013
8324711 Precision high-frequency capacitor formed on semiconductor substrate Dec. 4, 2012
8319313 Circuits, systems, and methods for reducing effects of cross talk in I/O lines and wire bonds Nov. 27, 2012
8319342 Interconnect structures having permeable hard mask for sealing air gap contained by conductive structures Nov. 27, 2012
8310056 Semiconductor device Nov. 13, 2012
8304321 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate Nov. 6, 2012
8252659 Method for producing interconnect structures for integrated circuits Aug. 28, 2012
8237282 Semiconductor device Aug. 7, 2012
8227902 Structures for preventing cross-talk between through-silicon vias and integrated circuits Jul. 24, 2012
8193092 Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices Jun. 5, 2012
8178965 Semiconductor module having deflecting conductive layer over a spacer structure May. 15, 2012
8143697 Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor Mar. 27, 2012
8143162 Interconnect structure having a silicide/germanide cap layer Mar. 27, 2012
8129766 Semiconductor memory device comprising shifted contact plugs Mar. 6, 2012
8115318 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 14, 2012
8089149 Semiconductor device Jan. 3, 2012
8080876 Structure and method for creating reliable deep via connections in a silicon carrier Dec. 20, 2011
8076730 Transistor level routing Dec. 13, 2011
8049303 Semiconductor device with power noise suppression Nov. 1, 2011
8039924 Semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portion Oct. 18, 2011
8030779 Multi-layered metal interconnection Oct. 4, 2011
8026111 Dielectric enhancements to chip-to-chip capacitive proximity communication Sep. 27, 2011
8021974 Structure and method for back end of the line integration Sep. 20, 2011
8022548 Method for fabricating conducting plates for a high-Q MIM capacitor Sep. 20, 2011
8004063 Precision high-frequency capacitor formed on semiconductor substrate Aug. 23, 2011
7989852 Integrated circuits and interconnect structure for integrated circuits Aug. 2, 2011
7968929 On-chip decoupling capacitor structures Jun. 28, 2011
7960833 Integrated circuits and interconnect structure for integrated circuits Jun. 14, 2011
7956439 Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same Jun. 7, 2011
7944026 Semiconductor device May. 17, 2011
7932543 Wire structure and semiconductor device comprising the wire structure Apr. 26, 2011
7915161 Post passivation interconnection schemes on top of IC chip Mar. 29, 2011
7902662 Power core devices and methods of making thereof Mar. 8, 2011
7888176 Stacked integrated circuit assembly Feb. 15, 2011
7880268 MIM capacitor Feb. 1, 2011
7875548 Method for making semiconductor structures implementing sacrificial material Jan. 25, 2011
7867924 Methods of reducing impurity concentration in isolating films in semiconductor devices Jan. 11, 2011
7863662 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate Jan. 4, 2011

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