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Class Information
Number: 257/E23.143
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Crossover interconnections (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/522A.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618896 |
Semiconductor die package including multiple dies and a common node structure |
Nov. 17, 2009 |
| 7586195 |
Semiconductor device |
Sep. 8, 2009 |
| 7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
Jul. 7, 2009 |
| 7553703 |
Methods of forming an interconnect structure |
Jun. 30, 2009 |
| 7538442 |
Semiconductor chip and semiconductor device |
May. 26, 2009 |
| 7521352 |
Method for manufacturing a semiconductor device |
Apr. 21, 2009 |
| 7498674 |
Semiconductor module having a coupling substrate, and methods for its production |
Mar. 3, 2009 |
| 7432597 |
Semiconductor device and method of manufacturing the same |
Oct. 7, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7411304 |
Semiconductor interconnect having conductive spring contacts |
Aug. 12, 2008 |
| 7400044 |
Semiconductor integrated circuit device |
Jul. 15, 2008 |
| 7391117 |
Method for fabricating semiconductor components with conductive spring contacts |
Jun. 24, 2008 |
| 7385295 |
Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks |
Jun. 10, 2008 |
| 7378340 |
Method of manufacturing semiconductor device and semiconductor device |
May. 27, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7358179 |
Method of manufacturing semiconductor device including air space formed around gate electrode |
Apr. 15, 2008 |
| 7332812 |
Memory card with connecting portions for connection to an adapter |
Feb. 19, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7291931 |
Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device |
Nov. 6, 2007 |
| 7245019 |
Semiconductor device with improved wiring arrangement utilizing a projecting portion and a method of manufacturing the same |
Jul. 17, 2007 |
| 7245016 |
Circuit layout structure |
Jul. 17, 2007 |
| 7180168 |
Stacked semiconductor chips |
Feb. 20, 2007 |
| 7074706 |
Semiconductor device and wiring forming method in semiconductor device |
Jul. 11, 2006 |
| 6943090 |
Aluminum-beryllium alloys for air bridges |
Sep. 13, 2005 |
| 6940142 |
Low data line capacitance image sensor array using air-gap metal crossover |
Sep. 6, 2005 |
| 6927158 |
Method of forming a semiconductor device with thermally conductive gas between wirings |
Aug. 9, 2005 |
| 6825749 |
Symmetric crossover structure of two lines for RF integrated circuits |
Nov. 30, 2004 |
| 6812810 |
Bridges for microelectromechanical structures |
Nov. 2, 2004 |
| 6806181 |
Method of fabricating an air bridge |
Oct. 19, 2004 |
| 6798064 |
Electronic component and method of manufacture |
Sep. 28, 2004 |
| 6765297 |
Semiconductor device and wiring forming method in semiconductor device |
Jul. 20, 2004 |
| 6737739 |
Method of vacuum packaging a semiconductor device assembly |
May. 18, 2004 |
| 6717191 |
Aluminum-beryllium alloys for air bridges |
Apr. 6, 2004 |
| 6576848 |
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same |
Jun. 10, 2003 |
| 6509590 |
Aluminum-beryllium alloys for air bridges |
Jan. 21, 2003 |
| 6509623 |
Microelectronic air-gap structures and methods of forming the same |
Jan. 21, 2003 |
| 6498396 |
Semiconductor chip scale package and ball grid array structures |
Dec. 24, 2002 |
| 6495399 |
Method of vacuum packaging a semiconductor device assembly |
Dec. 17, 2002 |
| 6492705 |
Integrated circuit air bridge structures and methods of fabricating same |
Dec. 10, 2002 |
| 6472740 |
Self-supporting air bridge interconnect structure for integrated circuits |
Oct. 29, 2002 |
| 6469330 |
Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections |
Oct. 22, 2002 |
| 6433431 |
Coating of copper and silver air bridge structures |
Aug. 13, 2002 |
| 6211056 |
Integrated circuit air bridge structures and methods of fabricating same |
Apr. 3, 2001 |
| 6057224 |
Methods for making semiconductor devices having air dielectric interconnect structures |
May. 2, 2000 |
| 6057573 |
Design for high density memory with relaxed metal pitch |
May. 2, 2000 |
| 5994777 |
Method and support structure for air bridge wiring of an integrated circuit |
Nov. 30, 1999 |
| 5933725 |
Word line resistance reduction method and design for high density memory with relaxed metal pitch |
Aug. 3, 1999 |
| 5898223 |
Chip-on-chip IC packages |
Apr. 27, 1999 |
| 5891797 |
Method of forming a support structure for air bridge wiring of an integrated circuit |
Apr. 6, 1999 |
| 5817446 |
Method of forming airbridged metallization for integrated circuit fabrication |
Oct. 6, 1998 |
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