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Class Information
Number: 257/E23.143
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo) > Crossover interconnections (epo)
Description: This subclass is indented under subclass E23.142. This subclass is substantially the same in scope as ECLA classification H01L23/522A.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8604557 Semiconductor memory device and method for manufacturing Dec. 10, 2013
8525247 Non-volatile memory device having variable resistance element Sep. 3, 2013
8513778 Semiconductor device Aug. 20, 2013
8492904 Semiconductor device and manufacturing method of the same Jul. 23, 2013
8486760 Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same Jul. 16, 2013
8421125 Semiconductor device with deviation compensation and method for fabricating the same Apr. 16, 2013
8378448 Chip inductor with frequency dependent inductance Feb. 19, 2013
8362616 Semiconductor device having plurality of wiring layers and designing method thereof Jan. 29, 2013
8354342 Semiconductor device with side-junction and method for fabricating the same Jan. 15, 2013
8274156 Optoelectronic semiconductor device Sep. 25, 2012
8242578 Anti-fuse device structure and electroplating circuit structure and method Aug. 14, 2012
8212361 Semiconductor die package including multiple dies and a common node structure Jul. 3, 2012
8203212 Air gaps in a multilayer integrated circuit and method of making same Jun. 19, 2012
8203213 Methods for packaging microelectronic devices and microelectronic devices formed using such methods Jun. 19, 2012
8198733 Semiconductor device with deviation compensation and method for fabricating the same Jun. 12, 2012
8178878 Mother thin film transistor array substrate and thin film transistor array substrate fabricated therefrom May. 15, 2012
8164197 Semiconductor device having multilayer interconnection structure Apr. 24, 2012
8143725 Semiconductor device Mar. 27, 2012
8138560 Microstructure, micromachine, and manufacturing method of microstructure and micromachine Mar. 20, 2012
8076730 Transistor level routing Dec. 13, 2011
8072080 Connection structure, electro-optical device, and method for production of electro-optical device Dec. 6, 2011
8026611 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another Sep. 27, 2011
7935621 Anti-fuse device structure and electroplating circuit structure and method May. 3, 2011
7911063 Semiconductor device Mar. 22, 2011
7863615 Display unit and method of manufacturing the same Jan. 4, 2011
7843069 Wire bond pads Nov. 30, 2010
7768138 Semiconductor device Aug. 3, 2010
7745823 Thin film panel and method of manufacturing the same Jun. 29, 2010
7652363 Semiconductor device including an arrangement for detection of tampering Jan. 26, 2010
7629694 Interconnections for crosswire arrays Dec. 8, 2009
7626272 Via configurable architecture for customization of analog circuitry in a semiconductor device Dec. 1, 2009
7618896 Semiconductor die package including multiple dies and a common node structure Nov. 17, 2009
7586195 Semiconductor device Sep. 8, 2009
7557436 Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes Jul. 7, 2009
7553703 Methods of forming an interconnect structure Jun. 30, 2009
7538442 Semiconductor chip and semiconductor device May. 26, 2009
7521352 Method for manufacturing a semiconductor device Apr. 21, 2009
7498674 Semiconductor module having a coupling substrate, and methods for its production Mar. 3, 2009
7432597 Semiconductor device and method of manufacturing the same Oct. 7, 2008
7414275 Multi-level interconnections for an integrated circuit chip Aug. 19, 2008
7411304 Semiconductor interconnect having conductive spring contacts Aug. 12, 2008
7400044 Semiconductor integrated circuit device Jul. 15, 2008
7391117 Method for fabricating semiconductor components with conductive spring contacts Jun. 24, 2008
7385295 Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks Jun. 10, 2008
7378340 Method of manufacturing semiconductor device and semiconductor device May. 27, 2008
7368803 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion May. 6, 2008
7358179 Method of manufacturing semiconductor device including air space formed around gate electrode Apr. 15, 2008
7332812 Memory card with connecting portions for connection to an adapter Feb. 19, 2008
7327030 Apparatus and method incorporating discrete passive components in an electronic package Feb. 5, 2008

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