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Class Information
Number: 257/E23.142
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo)
Description: This subclass is indented under subclass E23.141. This subclass is substantially the same in scope as ECLA classification H01L23/522.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602068 |
Dual-damascene process to fabricate thick wire structure |
Oct. 13, 2009 |
| 7598616 |
Interconnect structure |
Oct. 6, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
| 7586195 |
Semiconductor device |
Sep. 8, 2009 |
| 7572723 |
Micropad for bonding and a method therefor |
Aug. 11, 2009 |
| 7547973 |
Tamper-resistant semiconductor device |
Jun. 16, 2009 |
| 7547969 |
Semiconductor chip with passivation layer comprising metal interconnect and contact pads |
Jun. 16, 2009 |
| 7528493 |
Interconnect structure and method of fabrication of same |
May. 5, 2009 |
| 7528495 |
Chip structure |
May. 5, 2009 |
| 7521352 |
Method for manufacturing a semiconductor device |
Apr. 21, 2009 |
| 7514795 |
Semiconductor integrated circuit having improved power supply wiring |
Apr. 7, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7511780 |
Active matrix liquid crystal display device |
Mar. 31, 2009 |
| 7511378 |
Enhancement of performance of a conductive wire in a multilayered substrate |
Mar. 31, 2009 |
| 7486307 |
Semiconductor apparatus having conductive layers and semiconductor thin films |
Feb. 3, 2009 |
| 7482661 |
Pattern forming method and semiconductor device manufactured by using said pattern forming method |
Jan. 27, 2009 |
| 7470988 |
Chip structure and process for forming the same |
Dec. 30, 2008 |
| 7443020 |
Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit |
Oct. 28, 2008 |
| 7432597 |
Semiconductor device and method of manufacturing the same |
Oct. 7, 2008 |
| 7432556 |
Semiconductor device with dummy conductors |
Oct. 7, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7378340 |
Method of manufacturing semiconductor device and semiconductor device |
May. 27, 2008 |
| 7358548 |
Semiconductor integrated circuit having layout in which buffers or protection circuits are arranged in concentrated manner |
Apr. 15, 2008 |
| 7348674 |
Low capacitance wiring layout |
Mar. 25, 2008 |
| 7332753 |
Semiconductor device, wafer and method of designing and manufacturing the same |
Feb. 19, 2008 |
| 7327024 |
Power module, and phase leg assembly |
Feb. 5, 2008 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7301231 |
Reinforced bond pad for a semiconductor device |
Nov. 27, 2007 |
| 7274085 |
Capacitor structure |
Sep. 25, 2007 |
| 7253525 |
Semiconductor device including contact holes between adjacent conductor patterns and method for fabricating the same |
Aug. 7, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7247552 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor |
Jul. 24, 2007 |
| 7245016 |
Circuit layout structure |
Jul. 17, 2007 |
| 7239002 |
Integrated circuit device |
Jul. 3, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7190078 |
Interlocking via for package via integrity |
Mar. 13, 2007 |
| 7187015 |
High-density metal capacitor using dual-damascene copper interconnect |
Mar. 6, 2007 |
| 7141882 |
Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method |
Nov. 28, 2006 |
| 7132752 |
Semiconductor chip and semiconductor device including lamination of semiconductor chips |
Nov. 7, 2006 |
| 7112866 |
Method to form a cross network of air gaps within IMD layer |
Sep. 26, 2006 |
| 7078729 |
Semiconductor device and method of manufacturing the same |
Jul. 18, 2006 |
| 7067919 |
Semiconductor device |
Jun. 27, 2006 |
| 7064646 |
Integrated inductor |
Jun. 20, 2006 |
| 7049701 |
Semiconductor device using insulating film of low dielectric constant as interlayer insulating film |
May. 23, 2006 |
| 7046113 |
Inductor element |
May. 16, 2006 |
| 7045372 |
Apparatus and method for forming a battery in an integrated circuit |
May. 16, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7029927 |
Method of repairing an integrated electronic circuit using a formed electrical isolation |
Apr. 18, 2006 |
| 7026241 |
Superconductor device and method of manufacturing the same |
Apr. 11, 2006 |
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