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Class Information
Number: 257/E23.142
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) > Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (epo)
Description: This subclass is indented under subclass E23.141. This subclass is substantially the same in scope as ECLA classification H01L23/522.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.144 Capacitive arrangements or effects of, or between wiring layers (epo) 860
257/E23.154 Characterized by materials (epo) 71
257/E23.143 Crossover interconnections (epo) 122
257/E23.151 Geometry or layout of interconnection structure (epo) 735
257/E23.145 Via connections in multilevel interconnection structure (epo) 1,514
257/E23.146 With adaptable interconnections (epo) 230


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8710661 Methods for selective reverse mask planarization and interconnect structures formed thereby Apr. 29, 2014
8674513 Interconnect structures for substrate Mar. 18, 2014
8674516 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Mar. 18, 2014
8670638 Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide Mar. 11, 2014
8664763 Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus Mar. 4, 2014
8653666 Semiconductor storage device having a peripheral circuit region and a memory cell region Feb. 18, 2014
8653639 Layered chip package and method of manufacturing same Feb. 18, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8648472 Semiconductor device Feb. 11, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8633059 Integrated circuit packaging system with interconnect and method of manufacture thereof Jan. 21, 2014
8633520 Semiconductor device Jan. 21, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8624346 Exclusion zone for stress-sensitive circuit design Jan. 7, 2014
8604557 Semiconductor memory device and method for manufacturing Dec. 10, 2013
8598717 Semiconductor device and method for manufacturing the same Dec. 3, 2013
8598690 Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground Dec. 3, 2013
8592983 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device Nov. 26, 2013
8580613 Semiconductor chip arrangement with sensor chip and manufacturing method Nov. 12, 2013
8581362 Wireless communication devices with in-package integrated passive components Nov. 12, 2013
8581408 Semiconductor device Nov. 12, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558384 Interconnect structure containing various capping materials for electrical fuse and other related applications Oct. 15, 2013
8530997 Double seal ring Sep. 10, 2013
8525167 Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package Sep. 3, 2013
8519540 Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same Aug. 27, 2013
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8513778 Semiconductor device Aug. 20, 2013
8508033 Semiconductor device Aug. 13, 2013
8502384 Semiconductor device and manufacturing method thereof Aug. 6, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8492263 Protected solder ball joints in wafer level chip-scale packaging Jul. 23, 2013
8487433 Semiconductor device Jul. 16, 2013
8487401 Methods of fabricating passive element without planarizing and related semiconductor device Jul. 16, 2013
8476766 Semiconductor memory device and method for manufacturing the same Jul. 2, 2013
8466560 Dummy structures having a golden ratio and method for forming the same Jun. 18, 2013
8461060 Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles Jun. 11, 2013
8461678 Structure with self aligned resist layer on an interconnect surface and method of making same Jun. 11, 2013
8456014 Semiconductor device Jun. 4, 2013
8426244 High speed, high density, low power die interconnect system Apr. 23, 2013
8426968 High speed, high density, low power die interconnect system Apr. 23, 2013
8426970 Substrate processing including a masking layer Apr. 23, 2013
8421243 Layered chip package and method of manufacturing same Apr. 16, 2013
8415776 Semiconductor device Apr. 9, 2013
8410613 Semiconductor device having groove-shaped pattern Apr. 2, 2013
8404582 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps Mar. 26, 2013

1 2 3 4 5 6 7 8 9 10 11










 
 
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