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Class Information
Number: 257/E23.141
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/52.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626267 |
Semiconductor integrated circuit device including wiring lines and interconnections |
Dec. 1, 2009 |
| 7622762 |
Nonvolatile semiconductor memory and method for fabricating the same |
Nov. 24, 2009 |
| 7619297 |
Electronic device including an inductor |
Nov. 17, 2009 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Nov. 10, 2009 |
| 7615481 |
Method of manufacturing multilevel interconnect structure and multilevel interconnect structure |
Nov. 10, 2009 |
| 7605066 |
Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components |
Oct. 20, 2009 |
| 7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
Sep. 29, 2009 |
| 7589415 |
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip |
Sep. 15, 2009 |
| 7589423 |
Semiconductor device and a method of manufacturing the same and designing the same |
Sep. 15, 2009 |
| 7579691 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Aug. 25, 2009 |
| 7576431 |
Semiconductor chip package and multichip package |
Aug. 18, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7564142 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
Jul. 21, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7534675 |
Techniques for fabricating nanowire field-effect transistors |
May. 19, 2009 |
| 7528895 |
Liquid crystal display device and method for making the same |
May. 5, 2009 |
| 7524753 |
Semiconductor device having through electrode and method of manufacturing the same |
Apr. 28, 2009 |
| 7521778 |
Semiconductor device and method of manufacturing the same |
Apr. 21, 2009 |
| 7517783 |
Molybdenum-doped indium oxide structures and methods |
Apr. 14, 2009 |
| 7514793 |
Metal interconnection lines of semiconductor devices and methods of forming the same |
Apr. 7, 2009 |
| 7508070 |
Two dimensional stacking using interposers |
Mar. 24, 2009 |
| 7504715 |
Packaging of a microchip device |
Mar. 17, 2009 |
| 7504721 |
Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
Mar. 17, 2009 |
| 7501697 |
Integrated circuit package system |
Mar. 10, 2009 |
| 7498666 |
Stacked integrated circuit |
Mar. 3, 2009 |
| 7486307 |
Semiconductor apparatus having conductive layers and semiconductor thin films |
Feb. 3, 2009 |
| 7482661 |
Pattern forming method and semiconductor device manufactured by using said pattern forming method |
Jan. 27, 2009 |
| 7480026 |
Electro-optical device and electronic apparatus |
Jan. 20, 2009 |
| 7476976 |
Flip chip package with advanced electrical and thermal properties for high current designs |
Jan. 13, 2009 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7423346 |
Post passivation interconnection process and structures |
Sep. 9, 2008 |
| 7414312 |
Memory-module board layout for use with memory chips of different data widths |
Aug. 19, 2008 |
| 7411259 |
Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof |
Aug. 12, 2008 |
| 7411302 |
Semiconductor device and a method of manufacturing the same and designing the same |
Aug. 12, 2008 |
| 7405485 |
Semiconductor device |
Jul. 29, 2008 |
| 7405455 |
Semiconductor constructions and transistor gates |
Jul. 29, 2008 |
| 7400038 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Jul. 15, 2008 |
| 7385287 |
Preventing damage to low-k materials during resist stripping |
Jun. 10, 2008 |
| 7361984 |
Chip package structure |
Apr. 22, 2008 |
| 7361979 |
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates |
Apr. 22, 2008 |
| 7342295 |
Porogen material |
Mar. 11, 2008 |
| 7339265 |
Capacitance type semiconductor sensor |
Mar. 4, 2008 |
| 7332428 |
Metal interconnect structure and method |
Feb. 19, 2008 |
| 7329943 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
Feb. 12, 2008 |
| 7327033 |
Copper alloy via bottom liner |
Feb. 5, 2008 |
| 7294899 |
Nanowire Filament |
Nov. 13, 2007 |
| 7285855 |
Packaged device and method of forming same |
Oct. 23, 2007 |
| 7282434 |
Method of manufacturing a semiconductor device |
Oct. 16, 2007 |
| 7279783 |
Partitioned integrated circuit package with central clock driver |
Oct. 9, 2007 |
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