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Class Information
Number: 257/E23.14
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Solid or gel at normal operating temperature of device (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/24.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8587105 Semiconductor device Nov. 19, 2013
8518752 Integrated circuit packaging system with stackable package and method of manufacture thereof Aug. 27, 2013
8493767 One-time programmable device having an LDMOS structure Jul. 23, 2013
8324717 Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module Dec. 4, 2012
8268670 Method of semiconductor device protection Sep. 18, 2012
8159072 Rectification chip terminal structure Apr. 17, 2012
8148808 Partitioning of electronic packages Apr. 3, 2012
8120170 Integrated package circuit with stiffener Feb. 21, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
7956451 Packages for encapsulated semiconductor devices and method of making same Jun. 7, 2011
7728440 Warp-suppressed semiconductor device Jun. 1, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7687394 Method for forming inter-layer dielectric of low dielectric constant and method for forming copper wiring using the same Mar. 30, 2010
7683479 Semiconductor package involving a rotary lock that connects a package substrate and a separate component Mar. 23, 2010
7626255 Device, system and electric element Dec. 1, 2009
7528482 Embedded chip package with improved heat dissipation performance and method of making the same May. 5, 2009
7518239 Semiconductor device with substrate having penetrating hole having a protrusion Apr. 14, 2009
7459776 Stacked die assembly having semiconductor die projecting beyond support Dec. 2, 2008
7230332 Chip package with embedded component Jun. 12, 2007
7132753 Stacked die assembly having semiconductor die overhanging support Nov. 7, 2006
7109062 Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof Sep. 19, 2006
7064002 Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers Jun. 20, 2006
7061102 High performance flipchip package that incorporates heat removal with minimal thermal mismatch Jun. 13, 2006
7060533 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators Jun. 13, 2006
7057896 Power module and production method thereof Jun. 6, 2006
7053483 Semiconductor package using terminals formed on a conductive layer of a circuit board May. 30, 2006
7041532 Methods for fabricating interposers including upwardly protruding dams May. 9, 2006
7030476 Rectifier diode device Apr. 18, 2006
7012323 Microelectronic assemblies incorporating inductors Mar. 14, 2006
7002236 Semiconductor package and method for producing the same Feb. 21, 2006
7002244 Semiconductor device Feb. 21, 2006
6995461 Semiconductor device Feb. 7, 2006
6987032 Ball grid array package and process for manufacturing same Jan. 17, 2006
6987058 Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material Jan. 17, 2006
6984545 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask Jan. 10, 2006
6975039 Method of forming a ball grid array package Dec. 13, 2005
6958530 Rectification chip terminal structure Oct. 25, 2005
6956297 Electronic circuit unit that is easy to manufacture and method of manufacturing the same Oct. 18, 2005
6949822 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Sep. 27, 2005
6940182 Flip-chip package with underfill dam for stress control Sep. 6, 2005
6940164 Power module Sep. 6, 2005
6939746 Method for assembling semiconductor die packages with standard ball grid array footprint Sep. 6, 2005
6940022 Protective coating for an electronic device Sep. 6, 2005
6933176 Ball grid array package and process for manufacturing same Aug. 23, 2005
6921971 Heat releasing member, package for accommodating semiconductor element and semiconductor device Jul. 26, 2005
6919507 Electrical assembly and method for manufacturing the electrical assembly Jul. 19, 2005
6903455 Side braze packages Jun. 7, 2005
6894384 Semiconductor device and method of manufacturing the same May. 17, 2005
6890796 Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected May. 10, 2005
6888228 Lead frame chip scale package May. 3, 2005

1 2 3 4 5 6 7 8 9

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