| |
 |
|
Class Information
Number: 257/E23.14
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Solid or gel at normal operating temperature of device (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/24.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same |
May. 5, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7230332 |
Chip package with embedded component |
Jun. 12, 2007 |
| 7132753 |
Stacked die assembly having semiconductor die overhanging support |
Nov. 7, 2006 |
| 7109062 |
Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof |
Sep. 19, 2006 |
| 7064002 |
Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers |
Jun. 20, 2006 |
| 7061102 |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch |
Jun. 13, 2006 |
| 7060533 |
Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
Jun. 13, 2006 |
| 7057896 |
Power module and production method thereof |
Jun. 6, 2006 |
| 7053483 |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
May. 30, 2006 |
| 7041532 |
Methods for fabricating interposers including upwardly protruding dams |
May. 9, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7012323 |
Microelectronic assemblies incorporating inductors |
Mar. 14, 2006 |
| 7002244 |
Semiconductor device |
Feb. 21, 2006 |
| 7002236 |
Semiconductor package and method for producing the same |
Feb. 21, 2006 |
| 6995461 |
Semiconductor device |
Feb. 7, 2006 |
| 6987032 |
Ball grid array package and process for manufacturing same |
Jan. 17, 2006 |
| 6987058 |
Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material |
Jan. 17, 2006 |
| 6984545 |
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask |
Jan. 10, 2006 |
| 6975039 |
Method of forming a ball grid array package |
Dec. 13, 2005 |
| 6958530 |
Rectification chip terminal structure |
Oct. 25, 2005 |
| 6956297 |
Electronic circuit unit that is easy to manufacture and method of manufacturing the same |
Oct. 18, 2005 |
| 6949822 |
Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
Sep. 27, 2005 |
| 6939746 |
Method for assembling semiconductor die packages with standard ball grid array footprint |
Sep. 6, 2005 |
| 6940022 |
Protective coating for an electronic device |
Sep. 6, 2005 |
| 6940164 |
Power module |
Sep. 6, 2005 |
| 6940182 |
Flip-chip package with underfill dam for stress control |
Sep. 6, 2005 |
| 6933176 |
Ball grid array package and process for manufacturing same |
Aug. 23, 2005 |
| 6921971 |
Heat releasing member, package for accommodating semiconductor element and semiconductor device |
Jul. 26, 2005 |
| 6919507 |
Electrical assembly and method for manufacturing the electrical assembly |
Jul. 19, 2005 |
| 6903455 |
Side braze packages |
Jun. 7, 2005 |
| 6894384 |
Semiconductor device and method of manufacturing the same |
May. 17, 2005 |
| 6890796 |
Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected |
May. 10, 2005 |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
May. 3, 2005 |
| 6888228 |
Lead frame chip scale package |
May. 3, 2005 |
| 6882041 |
Thermally enhanced metal capped BGA package |
Apr. 19, 2005 |
| 6881611 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
Apr. 19, 2005 |
| 6873039 |
Methods of making microelectronic packages including electrically and/or thermally conductive element |
Mar. 29, 2005 |
| 6867485 |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
Mar. 15, 2005 |
| 6864165 |
Method of fabricating integrated electronic chip with an interconnect device |
Mar. 8, 2005 |
| 6861737 |
Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same |
Mar. 1, 2005 |
| 6856007 |
High-frequency chip packages |
Feb. 15, 2005 |
| 6847106 |
Semiconductor circuit with mechanically attached lid |
Jan. 25, 2005 |
| 6841859 |
Premolded cavity IC package |
Jan. 11, 2005 |
| 6838368 |
Method for making semiconductor device using a nickel film for stopping etching |
Jan. 4, 2005 |
| 6828600 |
Power semiconductor module with ceramic substrate |
Dec. 7, 2004 |
| 6821817 |
Premolded cavity IC package |
Nov. 23, 2004 |
| 6822339 |
Semiconductor device |
Nov. 23, 2004 |
| 6818473 |
Method for fabricating ceramic chip packages |
Nov. 16, 2004 |
|
|
|
