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Class Information
Number: 257/E23.139
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Liquid at normal operating temperature of device (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/22.










Patents under this class:

Patent Number Title Of Patent Date Issued
7714433 Piezoelectric cooling of a semiconductor package May. 11, 2010
6370032 Compliant microelectronic mounting device Apr. 9, 2002
6307260 Microelectronic assembly fabrication with terminal formation from a conductive layer Oct. 23, 2001
6265765 Fan-out semiconductor chip assembly Jul. 24, 2001
6207892 System and method for sealing high density electronic circuits Mar. 27, 2001
6104087 Microelectronic assemblies with multiple leads Aug. 15, 2000
6012224 Method of forming compliant microelectronic mounting device Jan. 11, 2000
5913109 Fixtures and methods for lead bonding and deformation Jun. 15, 1999
5801441 Microelectronic mounting with multiple lead deformation and bonding Sep. 1, 1998
5688716 Fan-out semiconductor chip assembly Nov. 18, 1997
5568684 Method of encapsulating an electronic device Oct. 29, 1996
5518964 Microelectronic mounting with multiple lead deformation and bonding May. 21, 1996
5477084 Microelectronic device packaging containing a liquid and method Dec. 19, 1995
5413965 Method of making microelectronic device package containing a liquid May. 9, 1995
5317196 Encapsulant method and apparatus May. 31, 1994
5243756 Integrated circuit protection by liquid encapsulation Sep. 14, 1993
5130889 Integrated circuit protection by liquid encapsulation Jul. 14, 1992











 
 
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