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Class Information
Number: 257/E23.138
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Gaseous at normal operating temperature of device (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/20.










Patents under this class:

Patent Number Title Of Patent Date Issued
7714433 Piezoelectric cooling of a semiconductor package May. 11, 2010
6909171 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture Jun. 21, 2005
6709968 Microelectronic device with package with conductive elements and associated method of manufacture Mar. 23, 2004
6670719 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture Dec. 30, 2003
6653171 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method Nov. 25, 2003
6614092 Microelectronic device package with conductive elements and associated method of manufacture Sep. 2, 2003
6255137 Method for making air pockets in an HDI context Jul. 3, 2001
6111199 Integrated circuit package using a gas to insulate electrical conductors Aug. 29, 2000
RE35765 Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices Apr. 7, 1998
5405808 Fluid-filled and gas-filled semiconductor packages Apr. 11, 1995
5323150 Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices Jun. 21, 1994
5233130 Semiconductor device Aug. 3, 1993
4949219 Module sealing structure Aug. 14, 1990
4891730 Monolithic microwave integrated circuit terminal protection device Jan. 2, 1990
4717948 Semiconductor device Jan. 5, 1988
4159221 Method for hermetically sealing an electronic circuit package Jun. 26, 1979
4077057 Gas-insulated thyristor arrangement comprising a pressure encapsulation formed in the manner of a tank Feb. 28, 1978
4043969 Casting compound for semiconductor devices Aug. 23, 1977











 
 
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