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Class Information
Number: 257/E23.137
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Including materials for absorbing or reacting with moisture or other undesired substances, e.g., getters (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/26.


Patents under this class:
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Patent Number Title Of Patent Date Issued
7342290 Semiconductor metal contamination reduction for ultra-thin gate dielectrics Mar. 11, 2008
7309865 Electronic device having infrared sensing elements Dec. 18, 2007
7235864 Integrated circuit devices, edge seals therefor Jun. 26, 2007
7205179 Hydrogen diffusion hybrid port and method of making Apr. 17, 2007
7091605 Highly moisture-sensitive electronic device element and method for fabrication Aug. 15, 2006
7042075 Electronic device sealed under vacuum containing a getter and method of operation May. 9, 2006
6992375 Anchor for device package Jan. 31, 2006
6977391 Transport balancing diffusion layer for rate limited scavenging systems Dec. 20, 2005
6958260 Hydrogen gettering system Oct. 25, 2005
6929974 Feedthrough design and method for a hermetically sealed microdevice Aug. 16, 2005
6879147 Package with environmental control material carrier Apr. 12, 2005
6861289 Moisture-sensitive device protection system Mar. 1, 2005
6842473 Water getter devices for laser amplifiers and process for the manufacture thereof Jan. 11, 2005
6825817 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules Nov. 30, 2004
6822880 Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components Nov. 23, 2004
6818479 Highly moisture-sensitive electronic device element and method for fabrication Nov. 16, 2004
6812547 Transposed split of ion cut materials Nov. 2, 2004
6803265 Liner for semiconductor memories and manufacturing method therefor Oct. 12, 2004
6790381 Drying agent Sep. 14, 2004
6740430 Organic luminescence device May. 25, 2004
6740145 Desiccants and desiccant packages for highly moisture-sensitive electronic devices May. 25, 2004
6696353 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film Feb. 24, 2004
6680545 Semiconductor devices Jan. 20, 2004
6673436 Moisture absorbing formed article Jan. 6, 2004
6673400 Hydrogen gettering system Jan. 6, 2004
6664779 Package with environmental control material carrier Dec. 16, 2003
6656609 Organic EL element Dec. 2, 2003
6594916 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps Jul. 22, 2003
6590157 Sealing structure for highly moisture-sensitive electronic device element and method for fabrication Jul. 8, 2003
6590280 Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same Jul. 8, 2003
6566735 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film May. 20, 2003
6566211 Surface modified interconnects May. 20, 2003
6548889 Hydrogen getter for integrated microelectronic assembly Apr. 15, 2003
6534850 Electronic device sealed under vacuum containing a getter and method of operation Mar. 18, 2003
6515366 Reduction of metal corrosion in semiconductor devices Feb. 4, 2003
6504234 Semiconductor device with interlayer film comprising a diffusion prevention layer to keep metal impurities from invading the underlying semiconductor substrate Jan. 7, 2003
6470594 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps Oct. 29, 2002
6423575 Hydrogen gettering structure including silver-doped palladium layer to increase hydrogen gettering of module component and semiconductor device module having such structure, and methods of fab Jul. 23, 2002
6413840 Method of gettering layer for improving chemical-mechanical polishing process in flash memory production and semiconductor structure thereof Jul. 2, 2002
6369442 Hydrogen getter for integrated microelectronic assembly Apr. 9, 2002
6355983 Surface modified interconnects Mar. 12, 2002
6346458 Transposed split of ion cut materials Feb. 12, 2002
6288411 Defect collecting structures for photolithography Sep. 11, 2001
6252294 Semiconductor device and semiconductor storage device Jun. 26, 2001
6203869 Hydrogen getters and methods for fabricating sealed microelectronic packages employing same Mar. 20, 2001
6166428 Formation of a barrier layer for tungsten damascene interconnects by nitrogen implantation of amorphous silicon or polysilicon Dec. 26, 2000
6110808 Hydrogen getter for integrated microelectronic assembly Aug. 29, 2000
6060766 Protection of hydrogen sensitive regions in semiconductor devices from the positive charge associated with plasma deposited barriers or layers May. 9, 2000
5929515 Gettering enclosure for a semiconductor device Jul. 27, 1999
5921461 Vacuum package having vacuum-deposited local getter and its preparation Jul. 13, 1999

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