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Class Information
Number: 257/E23.137
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) > Including materials for absorbing or reacting with moisture or other undesired substances, e.g., getters (epo)
Description: This subclass is indented under subclass E23.136. This subclass is substantially the same in scope as ECLA classification H01L23/26.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8680664 Structure for encapsulating an electronic device Mar. 25, 2014
8546928 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof Oct. 1, 2013
8486734 Alternating current light-emitting device and fabrication method thereof Jul. 16, 2013
8436453 Micromechanical device lubrication May. 7, 2013
8399270 Method of manufacturing organic light emitting device with water vapor absorption material containing transparent sealant layer Mar. 19, 2013
8395229 MEMS-based getter microdevice Mar. 12, 2013
8193623 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices Jun. 5, 2012
8120155 Reduced stiction and mechanical memory in MEMS devices Feb. 21, 2012
8105860 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices Jan. 31, 2012
8039940 Semiconductor storage device, semiconductor device, and manufacturing method therefor Oct. 18, 2011
8003999 Organic light emitting device Aug. 23, 2011
7972942 Method of reducing metal impurities of upgraded metallurgical grade silicon wafer by using epitaxial silicon film Jul. 5, 2011
7968987 Carbon dioxide gettering for a chip module assembly Jun. 28, 2011
7825424 Methods to manufacture contaminant-gettering materials in the surface of EUV optics Nov. 2, 2010
7807547 Wafer bonding material with embedded rigid particles Oct. 5, 2010
7800190 Getter on die in an upper sense plate designed system Sep. 21, 2010
7759218 Indented lid for encapsulated devices and method of manufacture Jul. 20, 2010
7651890 Method and apparatus for prevention of solder corrosion Jan. 26, 2010
7541663 P-type silicon wafer and method for heat-treating the same Jun. 2, 2009
7538343 Organic light emitting display (OLED) May. 26, 2009
7452742 Solid-state imaging device, camera and method of producing the solid-state imaging device Nov. 18, 2008
7443017 Package having bond-sealed underbump Oct. 28, 2008
7342290 Semiconductor metal contamination reduction for ultra-thin gate dielectrics Mar. 11, 2008
7309865 Electronic device having infrared sensing elements Dec. 18, 2007
7235864 Integrated circuit devices, edge seals therefor Jun. 26, 2007
7205179 Hydrogen diffusion hybrid port and method of making Apr. 17, 2007
7091605 Highly moisture-sensitive electronic device element and method for fabrication Aug. 15, 2006
7042075 Electronic device sealed under vacuum containing a getter and method of operation May. 9, 2006
6992375 Anchor for device package Jan. 31, 2006
6977391 Transport balancing diffusion layer for rate limited scavenging systems Dec. 20, 2005
6958260 Hydrogen gettering system Oct. 25, 2005
6929974 Feedthrough design and method for a hermetically sealed microdevice Aug. 16, 2005
6879147 Package with environmental control material carrier Apr. 12, 2005
6861289 Moisture-sensitive device protection system Mar. 1, 2005
6842473 Water getter devices for laser amplifiers and process for the manufacture thereof Jan. 11, 2005
6825817 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules Nov. 30, 2004
6822880 Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components Nov. 23, 2004
6818479 Highly moisture-sensitive electronic device element and method for fabrication Nov. 16, 2004
6812547 Transposed split of ion cut materials Nov. 2, 2004
6803265 Liner for semiconductor memories and manufacturing method therefor Oct. 12, 2004
6790381 Drying agent Sep. 14, 2004
6740430 Organic luminescence device May. 25, 2004
6740145 Desiccants and desiccant packages for highly moisture-sensitive electronic devices May. 25, 2004
6696353 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film Feb. 24, 2004
6680545 Semiconductor devices Jan. 20, 2004
6673400 Hydrogen gettering system Jan. 6, 2004
6673436 Moisture absorbing formed article Jan. 6, 2004
6664779 Package with environmental control material carrier Dec. 16, 2003
6656609 Organic EL element Dec. 2, 2003
6594916 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps Jul. 22, 2003

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