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Class Information
Number: 257/E23.136
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) > Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo)
Description: This subclass is indented under subclass E23.135. This subclass is substantially the same in scope as ECLA classification H01L23/18.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.138 Gaseous at normal operating temperature of device (epo) 18
257/E23.137 Including materials for absorbing or reacting with moisture or other undesired substances, e.g., getters (epo) 97
257/E23.139 Liquid at normal operating temperature of device (epo) 17
257/E23.14 Solid or gel at normal operating temperature of device (epo) 410


Patents under this class:

Patent Number Title Of Patent Date Issued
8598686 Electronic device package structure with a hydrophilic protection layer and method for fabricating the same Dec. 3, 2013
8421197 Integrated circuit package system with warp-free chip Apr. 16, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8343810 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers Jan. 1, 2013
8304924 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device Nov. 6, 2012
8193627 IC chip mounting package provided with IC chip located in device hole formed within a package base member Jun. 5, 2012
8053884 Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it Nov. 8, 2011
7759774 Shielded structures to protect semiconductor devices Jul. 20, 2010
7700958 Light emitting device having pixel portion surrounded by first sealing material and covered with second sealing material Apr. 20, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7646089 Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device Jan. 12, 2010
7554192 Semiconductor device having filler with thermal conductive particles Jun. 30, 2009
7332822 Flip chip system with organic/inorganic hybrid underfill composition Feb. 19, 2008
7199479 Chip package structure and process for fabricating the same Apr. 3, 2007
7122908 Electronic device package Oct. 17, 2006
6858795 Radiation shielding of three dimensional multi-chip modules Feb. 22, 2005
6720493 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages Apr. 13, 2004
6613978 Radiation shielding of three dimensional multi-chip modules Sep. 2, 2003
6583432 Methods and compositions for ionizing radiation shielding Jun. 24, 2003
6455864 Methods and compositions for ionizing radiation shielding Sep. 24, 2002
6261508 Method for making a shielding composition Jul. 17, 2001
6262362 Radiation shielding of three dimensional multi-chip modules Jul. 17, 2001
5880403 Radiation shielding of three dimensional multi-chip modules Mar. 9, 1999
5801936 Semiconductor module for a power conversion device Sep. 1, 1998
5635754 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages Jun. 3, 1997
5466969 Intelligent power device module Nov. 14, 1995
5384683 Intelligent power device module Jan. 24, 1995
5218234 Semiconductor device with controlled spread polymeric underfill Jun. 8, 1993











 
 
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