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Class Information
Number: 257/E23.135
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/16.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.136 Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (epo) 28

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8610277 Bridge type pad structure of a semiconductor device Dec. 17, 2013
8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler Aug. 20, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8309997 Photoelectric conversion device, method for manufacturing the same and image pickup system Nov. 13, 2012
8288845 Package including proximately-positioned lead frame Oct. 16, 2012
8288862 Multiple die stack package Oct. 16, 2012
8237171 High voltage high package pressure semiconductor package Aug. 7, 2012
7969028 Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device Jun. 28, 2011
7948060 Integrated circuit structure May. 24, 2011
7919833 Semiconductor package having a crack-propagation preventing unit Apr. 5, 2011
7884453 Semiconductor device and manufacturing method thereof Feb. 8, 2011
7880283 High reliability power module Feb. 1, 2011
7859119 Stacked flip chip die assembly Dec. 28, 2010
7830026 Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip Nov. 9, 2010
7821117 Semiconductor package with mechanical stress isolation of semiconductor die subassembly Oct. 26, 2010
7785928 Integrated circuit device and method of manufacturing thereof Aug. 31, 2010
7776650 Method for fabricating a flip chip system in package Aug. 17, 2010
7776649 Method for fabricating wafer level chip scale packages Aug. 17, 2010
7745945 Semiconductor package with position member Jun. 29, 2010
RE41369 Semiconductor device and method of manufacturing the same Jun. 8, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7632715 Method of packaging semiconductor devices Dec. 15, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7517723 Method for fabricating a flip chip system in package Apr. 14, 2009
7518239 Semiconductor device with substrate having penetrating hole having a protrusion Apr. 14, 2009
7495346 Semiconductor package Feb. 24, 2009
7425758 Metal core foldover package structures Sep. 16, 2008
7352054 Semiconductor device having conducting portion of upper and lower conductive layers Apr. 1, 2008
7242085 Semiconductor device including a semiconductor chip mounted on a metal base Jul. 10, 2007
7224062 Chip package with embedded panel-shaped component May. 29, 2007
7192870 Semiconductor device and fabrication process therefor Mar. 20, 2007
7180181 Mesh shaped dam mounted on a substrate Feb. 20, 2007
7075184 Semiconductor device and manufacturing method, circuit board and electronic device thereof Jul. 11, 2006
7067358 Package structure with a retarding structure and method of making same Jun. 27, 2006
7064452 Package structure with a retarding structure and method of making same Jun. 20, 2006
7061124 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder Jun. 13, 2006
7061097 Semiconductor device and manufacturing method for the same Jun. 13, 2006
7041533 Stereolithographic method for fabricating stabilizers for semiconductor devices May. 9, 2006
7041536 Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card May. 9, 2006
7034395 Power semiconductor module with cooling element and pressing apparatus Apr. 25, 2006
7023079 Stacked semiconductor chip package Apr. 4, 2006
7018871 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods Mar. 28, 2006
7015574 Electronic device carrier adapted for transmitting high frequency signals Mar. 21, 2006
7015593 Semiconductor device having contact prevention spacer Mar. 21, 2006
7004035 Physical value detecting apparatus and housing for physical value detecting means Feb. 28, 2006
6982486 Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same Jan. 3, 2006
6967400 IC chip package Nov. 22, 2005
6964889 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby Nov. 15, 2005
6946732 Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same Sep. 20, 2005

1 2 3 4 5 6

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