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Class Information
Number: 257/E23.134
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo) > Multilayer coating (epo)
Description: This subclass is indented under subclass E23.129. This subclass is substantially the same in scope as ECLA classification H01L23/31P12.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module Feb. 18, 2014
8643151 Passivation layer for semiconductor devices Feb. 4, 2014
8546193 Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure Oct. 1, 2013
8502400 Methods and apparatuses to stiffen integrated circuit package Aug. 6, 2013
8450140 Method for large-scale manufacturing of photovoltaic cells for a converter panel and photovoltaic converter panel May. 28, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8415252 Selective copper encapsulation layer deposition Apr. 9, 2013
8405202 MEMS packaging scheme using dielectric fence Mar. 26, 2013
8390121 Semiconductor device and method of manufacture thereof Mar. 5, 2013
8368233 Semiconductor device with improved resin configuration Feb. 5, 2013
8304289 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof Nov. 6, 2012
8237283 Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices Aug. 7, 2012
8164185 Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof Apr. 24, 2012
8159068 Semiconductor device Apr. 17, 2012
7994647 Method of reducing memory card edge roughness by edge coating Aug. 9, 2011
7982319 Semiconductor device with improved resin configuration Jul. 19, 2011
7960847 Packaging structure of SIP and a manufacturing method thereof Jun. 14, 2011
7879652 Semiconductor module Feb. 1, 2011
7868443 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability Jan. 11, 2011
RE41948 Semiconductor device having multi-layered wiring Nov. 23, 2010
7829390 Packaging structure of SIP and a manufacturing method thereof Nov. 9, 2010
7741135 Method of manufacturing light emitting display Jun. 22, 2010
7656044 Semiconductor device with improved resin configuration Feb. 2, 2010
7642156 Three-dimensional flash memory cell Jan. 5, 2010
7633169 Chip package structure Dec. 15, 2009
7608910 Semiconductor ESD device and methods of protecting a semiconductor device Oct. 27, 2009
7579590 Method of measuring thin layers using SIMS Aug. 25, 2009
7576000 Molded dielectric layer in print-patterned electronic circuits Aug. 18, 2009
7573061 Low-k SiC copper diffusion barrier films Aug. 11, 2009
7474002 Semiconductor device having dielectric film having aperture portion Jan. 6, 2009
7416923 Underfill film having thermally conductive sheet Aug. 26, 2008
7397073 Barrier dielectric stack for seam protection Jul. 8, 2008
7382037 Semiconductor device with a peeling prevention layer Jun. 3, 2008
7341935 Alternative interconnect structure for semiconductor devices Mar. 11, 2008
7323424 Semiconductor constructions comprising cerium oxide and titanium oxide Jan. 29, 2008
7282438 Low-k SiC copper diffusion barrier films Oct. 16, 2007
7268035 Methods of forming semiconductor constructions comprising cerium oxide and titanium oxide Sep. 11, 2007
7262118 Method for generating a structure on a substrate Aug. 28, 2007
7220686 Process for contact opening definition for active element electrical connections May. 22, 2007
7087520 Method for fabricating metal wiring Aug. 8, 2006
7067896 Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture Jun. 27, 2006
7067901 Semiconductor devices including protective layers on active surfaces thereof Jun. 27, 2006
7061127 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus Jun. 13, 2006
7057282 Semiconductor device and method for manufacturing the same, circuit board and electronic equipment Jun. 6, 2006
7056763 Composite structure for electronic microsystems and method for production of said composite structure Jun. 6, 2006
7045894 Semiconductor device and manufacturing method thereof May. 16, 2006
7029948 Electrical or electronic component and method of producing same Apr. 18, 2006
7005752 Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion Feb. 28, 2006
6987319 Wafer-level chip-scale package Jan. 17, 2006
6977442 Semiconductor device structure Dec. 20, 2005

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