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Class Information
Number: 257/E23.133
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo) > Coating also covering sidewalls of semiconductor body (epo)
Description: This subclass is indented under subclass E23.129. This subclass is substantially the same in scope as ECLA classification H01L23/31P10.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8624372 Semiconductor component comprising an interposer substrate Jan. 7, 2014
8618645 Package process and package structure Dec. 31, 2013
8614470 Unit pixel of a CMOS image sensor Dec. 24, 2013
8558366 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Oct. 15, 2013
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8405225 Three-dimensional integrated circuits with protection layers Mar. 26, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8361869 Method for manufacturing suspended fin and gate-all-around field effect transistor Jan. 29, 2013
8207585 Method for producing a micromechanical component and mircomechanical component Jun. 26, 2012
8148829 Self repairing IC package design Apr. 3, 2012
8148826 Three-dimensional integrated circuits with protection layers Apr. 3, 2012
8125079 Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same Feb. 28, 2012
8080446 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Dec. 20, 2011
8062929 Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die Nov. 22, 2011
7947589 FinFET formation with a thermal oxide spacer hard mask formed from crystalline silicon layer May. 24, 2011
7855440 Functional device-mounted module and a process for producing the same Dec. 21, 2010
7851894 System and method for shielding of package on package (PoP) assemblies Dec. 14, 2010
7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel Sep. 14, 2010
7790492 Method for fabricating a transducer package with the transducer die unsupported by a substrate Sep. 7, 2010
7772698 Package structure for integrated circuit device Aug. 10, 2010
7741726 Integrated circuit underfill package system Jun. 22, 2010
7718479 Forming integrated circuits with replacement metal gate electrodes May. 18, 2010
7691675 Encapsulating electrical connections Apr. 6, 2010
7691682 Build-up-package for integrated circuit devices, and methods of making same Apr. 6, 2010
7683479 Semiconductor package involving a rotary lock that connects a package substrate and a separate component Mar. 23, 2010
7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion Oct. 27, 2009
7579280 Method of patterning a film Aug. 25, 2009
7573061 Low-k SiC copper diffusion barrier films Aug. 11, 2009
7485502 Integrated circuit underfill package system Feb. 3, 2009
7470984 Perpendicularly oriented electrically active element method and system Dec. 30, 2008
7446423 Semiconductor device and method for assembling the same Nov. 4, 2008
7282438 Low-k SiC copper diffusion barrier films Oct. 16, 2007
7273770 Compliant passivated edge seal for low-k interconnect structures Sep. 25, 2007
7153725 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor Dec. 26, 2006
7098544 Edge seal for integrated circuit chips Aug. 29, 2006
7067922 Semiconductor device Jun. 27, 2006
7042096 Single semiconductor element in a flip chip construction May. 9, 2006
7023027 Diode package having an anode and a cathode formed on one surface of a diode chip Apr. 4, 2006
7011985 Method for producing miniature amplifier and signal processing unit Mar. 14, 2006
6995464 Pressure-contact type semiconductor device Feb. 7, 2006
6987068 Methods to planarize semiconductor device and passivation layer Jan. 17, 2006
6982484 Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet Jan. 3, 2006
6911722 Resin-molded semiconductor device having posts with bumps Jun. 28, 2005
6891252 Electronic component with a semiconductor chip and method of producing an electronic component May. 10, 2005
6873034 Solid-state imaging device, method for producing same, and mask Mar. 29, 2005
6852931 Configuration having an electronic device electrically connected to a printed circuit board Feb. 8, 2005
6847102 Low profile semiconductor device having improved heat dissipation Jan. 25, 2005
6828686 Chip size stack package and method of fabricating the same Dec. 7, 2004
6818475 Wafer level package and the process of the same Nov. 16, 2004

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