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Class Information
Number: 257/E23.132
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo) > Coating being directly applied to semiconductor body, e.g., passivation layer (epo)
Description: This subclass is indented under subclass E23.129. This subclass is substantially the same in scope as ECLA classification H01L23/31P6.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8624372 Semiconductor component comprising an interposer substrate Jan. 7, 2014
8592953 Structures including passivated germanium Nov. 26, 2013
8575724 Semiconductor device having under-filled die in a die stack Nov. 5, 2013
8574960 Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material Nov. 5, 2013
8524591 Maintaining integrity of a high-K gate stack by passivation using an oxygen plasma Sep. 3, 2013
8354738 Structures including passivated germanium Jan. 15, 2013
8338220 Negatively charged passivation layer in a photovoltaic cell Dec. 25, 2012
8236615 Passivation layer surface topography modifications for improved integrity in packaged assemblies Aug. 7, 2012
8202806 Method to avoid threshold voltage shift in thicker dielectric films Jun. 19, 2012
8193591 Transistor and method with dual layer passivation Jun. 5, 2012
8148829 Self repairing IC package design Apr. 3, 2012
8125079 Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same Feb. 28, 2012
8105925 Method for forming an insulated gate field effect device Jan. 31, 2012
8062931 Surface treatment and passivation of AlGaN/GaN HEMT Nov. 22, 2011
7955992 Method of passivating and encapsulating CdTe and CZT segmented detectors Jun. 7, 2011
7915712 Structures including passivated germanium Mar. 29, 2011
7855451 Device having a contacting structure Dec. 21, 2010
7811946 Semiconductor device and method for manufacturing the same Oct. 12, 2010
7732923 Impurity doped UV protection layer Jun. 8, 2010
7691682 Build-up-package for integrated circuit devices, and methods of making same Apr. 6, 2010
7655492 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Feb. 2, 2010
7655987 Method for fabricating ultra-high tensile-stressed film and strained-silicon transistors thereof Feb. 2, 2010
7651956 Process for fabricating films of uniform properties on semiconductor devices Jan. 26, 2010
7648857 Process for precision placement of integrated circuit overcoat material Jan. 19, 2010
7642641 Integrated circuit component with passivation layer Jan. 5, 2010
7575994 Semiconductor device and manufacturing method of the same Aug. 18, 2009
7573061 Low-k SiC copper diffusion barrier films Aug. 11, 2009
7534645 CMOS type image sensor module having transparent polymeric encapsulation material May. 19, 2009
7534729 Modification of semiconductor surfaces in a liquid May. 19, 2009
7528077 Semiconductor device and method for manufacturing the same May. 5, 2009
7521744 Resin-encapsulated semiconductor apparatus and process for its fabrication Apr. 21, 2009
7494848 Flip-chip packaging of a photo-sensor die on a transparent substrate Feb. 24, 2009
7470993 Semiconductor component with passivation layer Dec. 30, 2008
7442653 Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass Oct. 28, 2008
7397125 Semiconductor device with bonding pad support structure Jul. 8, 2008
7381657 Biased pulse DC reactive sputtering of oxide films Jun. 3, 2008
7341935 Alternative interconnect structure for semiconductor devices Mar. 11, 2008
7323423 Forming high-k dielectric layers on smooth substrates Jan. 29, 2008
7282438 Low-k SiC copper diffusion barrier films Oct. 16, 2007
7268035 Methods of forming semiconductor constructions comprising cerium oxide and titanium oxide Sep. 11, 2007
7262118 Method for generating a structure on a substrate Aug. 28, 2007
7192894 High performance CMOS transistors using PMD liner stress Mar. 20, 2007
7067923 Semiconductor device having hall-effect and manufacturing method thereof Jun. 27, 2006
7064368 Resin-encapsulated semiconductor apparatus and process for its fabrication Jun. 20, 2006
7060607 Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface Jun. 13, 2006
7057281 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths Jun. 6, 2006
7049705 Chip structure May. 23, 2006
7042053 Semiconductor device with polymer insulation of some electrodes May. 9, 2006
7037826 Method for forming semiconductor device bonding pads May. 2, 2006

1 2 3 4 5 6 7 8 9

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