Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E23.131
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo) > Coating or filling in grooves made in semiconductor body (epo)
Description: This subclass is indented under subclass E23.129. This subclass is substantially the same in scope as ECLA classification H01L23/31P8.

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8710676 Stacked structure and stacked method for three-dimensional chip Apr. 29, 2014
8647963 Structure and method of wafer level chip molded packaging Feb. 11, 2014
8426980 Chip-to-chip multi-signaling communication system with common conductive layer Apr. 23, 2013
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8242004 Semiconductor device and method of fabricating the same Aug. 14, 2012
8222101 Method of fabricating a MOS transistor having a gate insulation layer with a lateral portion and a vertical portion Jul. 17, 2012
8129741 Light emitting diode package Mar. 6, 2012
8093156 Method for manufacturing semiconductor device Jan. 10, 2012
8049292 Semiconductor device and method for manufacturing semiconductor device Nov. 1, 2011
8049274 Semiconductor integrated circuit and method of manufacturing the same Nov. 1, 2011
7851342 In-situ formation of conductive filling material in through-silicon via Dec. 14, 2010
7705441 Semiconductor module Apr. 27, 2010
7700414 Method of making flip-chip package with underfill Apr. 20, 2010
7674657 Method of manufacture of encapsulated package Mar. 9, 2010
7675186 IC package with a protective encapsulant and a stiffening encapsulant Mar. 9, 2010
7651956 Process for fabricating films of uniform properties on semiconductor devices Jan. 26, 2010
7573061 Low-k SiC copper diffusion barrier films Aug. 11, 2009
7508083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same Mar. 24, 2009
7485964 Dielectric material Feb. 3, 2009
7282394 Printed circuit board including embedded chips and method of fabricating the same using plating Oct. 16, 2007
7282438 Low-k SiC copper diffusion barrier films Oct. 16, 2007
7273770 Compliant passivated edge seal for low-k interconnect structures Sep. 25, 2007
7098544 Edge seal for integrated circuit chips Aug. 29, 2006
7064452 Package structure with a retarding structure and method of making same Jun. 20, 2006
6891252 Electronic component with a semiconductor chip and method of producing an electronic component May. 10, 2005
6770543 Semiconductor apparatus and semiconductor apparatus manufacturing method Aug. 3, 2004
6696353 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film Feb. 24, 2004
6693336 Intergrated circuit chip package with reduced parameter offsets Feb. 17, 2004
6611006 Vertical component peripheral structure Aug. 26, 2003
6579748 Fabrication method of an electronic component Jun. 17, 2003
6566735 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film May. 20, 2003
6400000 Semiconductor device with a diode, and method of manufacturing such a device Jun. 4, 2002
6348363 Method for manufacturing a semiconductor package Feb. 19, 2002
6291316 Method for fabricating passivated semiconductor devices Sep. 18, 2001
6281591 Semiconductor apparatus and semiconductor apparatus manufacturing method Aug. 28, 2001
5489802 Pressure contact type semiconductor device and heat compensator Feb. 6, 1996
5313094 Thermal dissipation of integrated circuits using diamond paths May. 17, 1994
5187558 Stress reduction structure for a resin sealed semiconductor device Feb. 16, 1993
5102822 Planar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof Apr. 7, 1992
5093283 Method of manufacturing a semiconductor device Mar. 3, 1992
5045151 Micromachined bonding surfaces and method of forming the same Sep. 3, 1991
4999684 Symmetrical blocking high voltage breakdown semiconducotr device Mar. 12, 1991
4982269 Blanar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof Jan. 1, 1991
4977107 Method for manufacturing semiconductor rectifier Dec. 11, 1990
4904609 Method of making symmetrical blocking high voltage breakdown semiconductor device Feb. 27, 1990
4727048 Process for making isolated semiconductor structure Feb. 23, 1988
4647472 Process of producing a semiconductor device Mar. 3, 1987
4630343 Product for making isolated semiconductor structure Dec. 23, 1986
4618877 Power semiconductor device with mesa type structure Oct. 21, 1986
4484214 pn Junction device with glass moats and a channel stopper region of greater depth than the base pn junction depth Nov. 20, 1984

1 2

  Recently Added Patents
Spoofing detection for civilian GNSS signals
Sitagliptin intermediate compounds, preparation methods and uses thereof
Methods and apparatus to identify exposure to 3D media presentations
Methods of fabricating semiconductor device
MiR 204, miR 211, their anti-miRs, and therapeutic uses of same
Battery-operated massager and soap dispensing wand
Optimized delivery of web application code
  Randomly Featured Patents
Disk tray, disk storing apparatus and disk drive
Retractable merchandise security tether with alarm
Powered controlled acceleration suspension work platform hoist system
Metering device for the inhalation of a pulverulent substance
Process for removing acidic gases from gaseous mixtures using aqueous scrubbing solutions containing heterocyclic nitrogen compounds
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
Amplified control keypad
Scan converting apparatus for transferring subtitles on a screen
Billing system for distributing third party messages to form a community of subscribers to negotiate a group purchase from the third party
Quick release safety mechanism