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Class Information
Number: 257/E23.13
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo) > Coating being foil (epo)
Description: This subclass is indented under subclass E23.129. This subclass is substantially the same in scope as ECLA classification H01L23/31P4.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8652869 Method for roughening substrate surface and method for manufacturing photovoltaic device Feb. 18, 2014
8435855 Methods of manufacturing semiconductor devices May. 7, 2013
8399938 Stressed Fin-FET devices with low contact resistance Mar. 19, 2013
8334171 Package system with a shielded inverted internal stacking module and method of manufacture thereof Dec. 18, 2012
8129219 Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same Mar. 6, 2012
8110912 Semiconductor device Feb. 7, 2012
7880254 Semiconductor light receiving device and method for manufacturing same Feb. 1, 2011
7851893 Semiconductor device and method of connecting a shielding layer to ground through conductive vias Dec. 14, 2010
7414311 Ball grid array housing having a cooling foil Aug. 19, 2008
7301188 CMOS image sensor and method of manufacturing the same Nov. 27, 2007
7256493 Ball grid array housing having a cooling foil Aug. 14, 2007
7018869 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Mar. 28, 2006
6975026 Package for mounting semiconductor device Dec. 13, 2005
6919262 Process for producing semiconductor chips Jul. 19, 2005
6917107 Board-on-chip packages Jul. 12, 2005
6916686 Method of manufacturing a semiconductor device Jul. 12, 2005
6900077 Methods of forming board-on-chip packages May. 31, 2005
6885101 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Apr. 26, 2005
6825550 Board-on-chip packages with conductive foil on the chip surface Nov. 30, 2004
6492194 Method for the packaging of electronic components Dec. 10, 2002
6465893 Stacked chip assembly Oct. 15, 2002
6462282 Circuit board for mounting bare chip Oct. 8, 2002
6433419 Face-up semiconductor chip assemblies Aug. 13, 2002
6392306 Semiconductor chip assembly with anisotropic conductive adhesive connections May. 21, 2002
6372527 Methods of making semiconductor chip assemblies Apr. 16, 2002
6255741 Semiconductor device with a protective sheet to affix a semiconductor chip Jul. 3, 2001
6133627 Semiconductor chip package with center contacts Oct. 17, 2000
6011300 Semiconductor integrated circuit device Jan. 4, 2000
5972739 Method of manufacturing a tab semiconductor device Oct. 26, 1999
5950304 Methods of making semiconductor chip assemblies Sep. 14, 1999
5946555 Wafer level decal for minimal packaging of chips Aug. 31, 1999
5904488 Semiconductor integrated circuit device May. 18, 1999
5872050 Semiconductor device and method of manufacturing thereof Feb. 16, 1999
5856913 Multilayer semiconductor device having high packing density Jan. 5, 1999
5852326 Face-up semiconductor chip assembly Dec. 22, 1998
5848467 Methods of making semiconductor chip assemblies Dec. 15, 1998
5767572 Semiconductor integrated circuit device assembly Jun. 16, 1998
5737191 Structure and process for mounting semiconductor chip Apr. 7, 1998
5717255 Semiconductor device Feb. 10, 1998
5685885 Wafer-scale techniques for fabrication of semiconductor chip assemblies Nov. 11, 1997
5682061 Component for connecting a semiconductor chip to a substrate Oct. 28, 1997
5679977 Semiconductor chip assemblies, methods of making same and components for same Oct. 21, 1997
5672908 Thin semiconductor integrated circuit device assembly Sep. 30, 1997
5448106 Thin semiconductor integrated circuit device assembly Sep. 5, 1995
5401688 Semiconductor device of multichip module-type Mar. 28, 1995
5394303 Semiconductor device Feb. 28, 1995
5346861 Semiconductor chip assemblies and methods of making same Sep. 13, 1994
5347159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate Sep. 13, 1994
5331513 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon Jul. 19, 1994
5258330 Semiconductor chip assemblies with fan-in leads Nov. 2, 1993

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