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Class Information
Number: 257/E23.129
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Partial encapsulation or coating (epo)
Description: This subclass is indented under subclass E23.123. This subclass is substantially the same in scope as ECLA classification H01L23/ 31P.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.133 Coating also covering sidewalls of semiconductor body (epo) 99
257/E23.132 Coating being directly applied to semiconductor body, e.g., passivation layer (epo) 407
257/E23.13 Coating being foil (epo) 61
257/E23.131 Coating or filling in grooves made in semiconductor body (epo) 66
257/E23.134 Multilayer coating (epo) 154


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8618645 Package process and package structure Dec. 31, 2013
8614517 Semiconductor device and method of manufacturing the same Dec. 24, 2013
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8587124 Semiconductor device having low dielectric insulating film and manufacturing method of the same Nov. 19, 2013
8581395 Hybrid integrated circuit device and electronic device Nov. 12, 2013
8574960 Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material Nov. 5, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8569875 Integrally molded die and bezel structure for fingerprint sensors and the like Oct. 29, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8471345 Biometric sensor assembly with integrated visual indicator Jun. 25, 2013
8450838 Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus May. 28, 2013
8450840 Ultra ruggedized ball grid array electronic components May. 28, 2013
8445295 Semiconductor device and method for manufacturing the same May. 21, 2013
8446000 Package structure and package process May. 21, 2013
8399305 Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist Mar. 19, 2013
8399989 Metal pad or metal bump over pad exposed by passivation layer Mar. 19, 2013
8378508 Integrally molded die and bezel structure for fingerprint sensors and the like Feb. 19, 2013
8373284 Semiconductor device Feb. 12, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8350344 Semiconductor device and method of fabricating the same Jan. 8, 2013
8304883 Semiconductor device having multiple semiconductor elements Nov. 6, 2012
8258528 Semiconductor light-emitting device Sep. 4, 2012
8242614 Thermally improved semiconductor QFN/SON package Aug. 14, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8222744 Semiconductor device and manufacturing method of the semiconductor device Jul. 17, 2012
8207022 Exposed die overmolded flip chip package method Jun. 26, 2012
8187921 Semiconductor package having ink-jet type dam and method of manufacturing the same May. 29, 2012
8178982 Dual molded multi-chip package system May. 15, 2012
8120150 Integrated circuit package system with dual connectivity Feb. 21, 2012
8062929 Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die Nov. 22, 2011
7999368 Semiconductor package having ink-jet type dam and method of manufacturing the same Aug. 16, 2011
7994638 Semiconductor chip and semiconductor device Aug. 9, 2011
7964509 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device Jun. 21, 2011
7898093 Exposed die overmolded flip chip package and fabrication method Mar. 1, 2011
7897484 Fabricating a top conductive layer in a semiconductor die Mar. 1, 2011
7867794 Surface-mount type optical semiconductor device and method for manufacturing the same Jan. 11, 2011
7863728 Semiconductor module including components in plastic casing Jan. 4, 2011
7807505 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Oct. 5, 2010
7803718 BiCMOS performance enhancement by mechanical uniaxial strain and methods of manufacture Sep. 28, 2010
7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel Sep. 14, 2010
7772679 Magnetic shielding package structure of a magnetic memory device Aug. 10, 2010
7741135 Method of manufacturing light emitting display Jun. 22, 2010
7728407 Semiconductor device and method of cutting electrical fuse Jun. 1, 2010
7709946 Micro universal serial bus (USB) memory package May. 4, 2010

1 2 3 4










 
 
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