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Class Information
Number: 257/E23.128
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo) > Encapsulation having cavity (epo)
Description: This subclass is indented under subclass E23.124. This subclass is substantially the same in scope as ECLA classification H01L23/31H8.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8659128 Flip chip package structure with heat dissipation enhancement and its application Feb. 25, 2014
8652866 Sensor device and method Feb. 18, 2014
8614504 Chip package and method for making same Dec. 24, 2013
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8586456 Use of CL2 and/or HCL during silicon epitaxial film formation Nov. 19, 2013
8575740 Semiconductor device Nov. 5, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8541801 Light-emitting-device package and a method for producing the same Sep. 24, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8518747 Stackable semiconductor assemblies and methods of manufacturing such assemblies Aug. 27, 2013
8487426 Semiconductor package with embedded die and manufacturing methods thereof Jul. 16, 2013
8486744 Multiple bonding in wafer level packaging Jul. 16, 2013
8482116 Semiconductor device having stacked components Jul. 9, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8471289 Semiconductor laser device, optical pickup device and semiconductor device Jun. 25, 2013
8445984 Micro-optical device packaging system May. 21, 2013
8420450 Method of molding semiconductor package Apr. 16, 2013
8410601 RF package Apr. 2, 2013
8378502 Integrated circuit package system with image sensor system Feb. 19, 2013
8372695 Integrated circuit packaging system with stack interconnect and method of manufacture thereof Feb. 12, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8314486 Integrated circuit packaging system with shield and method of manufacture thereof Nov. 20, 2012
8264074 Device for use as dual-sided sensor package Sep. 11, 2012
8247253 MEMS package structure and method for fabricating the same Aug. 21, 2012
8174082 Micromechanical component having multiple caverns, and manufacturing method May. 8, 2012
8138062 Electrical coupling of wafer structures Mar. 20, 2012
8125047 Semiconductor device and method of manufacturing the same Feb. 28, 2012
8110928 Stacked-type chip package structure and method of fabricating the same Feb. 7, 2012
8105881 Method of fabricating chip package structure Jan. 31, 2012
8106498 Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof Jan. 31, 2012
8093694 Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures Jan. 10, 2012
8088650 Method of fabricating chip package Jan. 3, 2012
8048714 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities Nov. 1, 2011
8035209 Micromechanical device which has cavities having different internal atmospheric pressures Oct. 11, 2011
8026595 Semiconductor device having hermitically sealed active area and electrodes Sep. 27, 2011
8004075 Semiconductor power module including epoxy resin coating Aug. 23, 2011
7999366 Micro-component packaging process and set of micro-components resulting from this process Aug. 16, 2011
7994617 Semiconductor device Aug. 9, 2011
7936033 Micro-optical device packaging system May. 3, 2011
7893514 Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package Feb. 22, 2011
7880254 Semiconductor light receiving device and method for manufacturing same Feb. 1, 2011
7863109 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof Jan. 4, 2011
7851925 Wafer level packaged MEMS integrated circuit Dec. 14, 2010
7847387 Electrical device and method Dec. 7, 2010
7785987 Isolating chip-to-chip contact Aug. 31, 2010
7745891 Encapsulation component for integrated micro electromechanical system comprising first and second covers Jun. 29, 2010
7732305 Use of Cl2 and/or HCl during silicon epitaxial film formation Jun. 8, 2010

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